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CC1175RHBT

Texas Instruments

CC1175RHBT by Texas Instruments

The Texas Instruments CC1175RHBT is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and data rate of 0.2 Mbps. This chip carrier package is suitable for industrial applications requiring a compact design and surface mount capability.

Median Price

$3.689

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,250 parts In-Stock

1+ parts

$3.689

100+ parts

$3.232

1k+ parts

$1.826

10k+ parts

-

2,250

$3.689

$3.232

$1.826

-

DigiKey

USA . 5,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,470

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.739

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$2.739

-

-

-

Digiode

USA . 4,227 parts In-Stock

1+ parts

$3.505

100+ parts

-

1k+ parts

-

10k+ parts

-

4,227

$3.505

-

-

-

Bristol Electronics

USA . 444 parts In-Stock

1+ parts

$4.195

100+ parts

$1.972

1k+ parts

$1.804

10k+ parts

-

444

$4.195

$1.972

$1.804

-

Chip Stock

USA . 50,200 parts In-Stock

1+ parts

-

100+ parts

-

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50,200

-

-

-

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Vyrian

USA . 3,833 parts In-Stock

1+ parts

-

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3,833

-

-

-

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Dan-Mar Components

USA . 444 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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444

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,013 parts In-Stock

1+ parts

$2.739

100+ parts

-

1k+ parts

-

10k+ parts

$2.684

3,013

$2.739

-

-

$2.684

Argo Parts USA

USA . 2,996 parts In-Stock

1+ parts

$2.739

100+ parts

-

1k+ parts

-

10k+ parts

-

2,996

$2.739

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

$2.739

100+ parts

$2.684

1k+ parts

-

10k+ parts

-

50

$2.739

$2.684

-

-

Ampacity Inc.

Singapore . 3,703 parts In-Stock

1+ parts

$3.140

100+ parts

-

1k+ parts

-

10k+ parts

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3,703

$3.140

-

-

-

Corphita

USA . 2,403 parts In-Stock

1+ parts

$3.320

100+ parts

-

1k+ parts

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10k+ parts

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2,403

$3.320

-

-

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Parana Technologies

USA . 1,815 parts In-Stock

1+ parts

$13.824

100+ parts

-

1k+ parts

$14.309

10k+ parts

-

1,815

$13.824

-

$14.309

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DigiPath Technology Company

USA . 1,675 parts In-Stock

1+ parts

$15.222

100+ parts

$14.005

1k+ parts

-

10k+ parts

-

1,675

$15.222

$14.005

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-

ChromeModa Solutions

Germany . 3,415 parts In-Stock

1+ parts

$15.533

100+ parts

$12.737

1k+ parts

-

10k+ parts

-

3,415

$15.533

$12.737

-

-

IDEA Electronic Components Group

UK . 1,431 parts In-Stock

1+ parts

$15.533

100+ parts

$14.756

1k+ parts

$13.980

10k+ parts

-

1,431

$15.533

$14.756

$13.980

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Lixinc

USA . 8,107 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,107

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-

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,500

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-

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A-Z Elektronik GmbH

Germany . 250 parts In-Stock

1+ parts

-

100+ parts

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250

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Overview

Elevate your telecom systems with the CC1175RHBT by Texas Instruments. This cutting-edge, high-quality IC offers unparalleled performance and reliability, thanks to its innovative design and superior manufacturing by Texas Instruments. Ideal for a range of applications in the telecom industry, this product provides exceptional value and benefits to customers, ensuring seamless connectivity and optimal efficiency. Upgrade your systems today with the CC1175RHBT and experience the advantages of top-tier technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the integrated circuit within the package, making it suitable for various operating conditions.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 2.5/3.3

Compatible with common power supplies, ensuring flexibility in integration with existing systems.

No. of Terminals: 32

Offers multiple connectivity options for interfacing with other components, increasing versatility in telecom applications.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where high temperatures may be present, ensuring reliable performance under challenging conditions.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Provides excellent conductivity and corrosion resistance for long-term reliability in telecom applications.

Width: 5 mm

Compact size allows for efficient use of space on a circuit board, ideal for applications with limited real estate.

Temperature Grade: INDUSTRIAL

Designed to meet the rigorous requirements of industrial environments, ensuring stability and performance under harsh conditions.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed and optimized for telecom applications, providing specialized functionality and performance for these specific requirements.

Nominal Supply Voltage: 3 V

Optimized for a 3V supply, making it compatible with standard power sources commonly used in telecom systems.

Data Rate: 0.2 Mbps

Capable of handling data rates up to 0.2 Mbps, suitable for telecom applications requiring moderate data transmission speeds.

Technical Specifications

Other Function Telecom Interface ICs CC1175RHBT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.2 Mbps

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

CC1175RHBT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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