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SL3S1002FTB1,115

NXP Semiconductors

SL3S1002FTB1,115 by NXP Semiconductors

NXP Semiconductors SL3S1002FTB1,115 is a telecom interface IC in chip carrier package. Operating temp range -40 to 85°C with peak reflow temp of 260°C. Features CMOS technology, suitable for industrial telecom circuit applications.

Median Price

$0.232

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,784 parts In-Stock

1+ parts

-

100+ parts

$0.232

1k+ parts

$0.192

10k+ parts

$0.171

10,784

-

$0.232

$0.192

$0.171

Verical

USA . 10,000 parts In-Stock

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$0.289

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$0.289

Chip1Stop

Japan . 185 parts In-Stock

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$0.096

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185

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$0.096

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Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$0.160

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150

$0.160

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Digiode

USA . 919 parts In-Stock

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$0.180

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919

$0.180

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ACDS - Activité Composants Distribution Service

France . 48,182 parts In-Stock

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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Vyrian

USA . 7,308 parts In-Stock

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Anansix

USA . 714 parts In-Stock

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714

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Distributors (Availability)

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Ampacity Inc.

Singapore . 7,723 parts In-Stock

1+ parts

$0.082

100+ parts

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7,723

$0.082

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Argo Parts USA

USA . 3,198 parts In-Stock

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$0.160

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$0.155

3,198

$0.160

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$0.155

Continental Prestige Electronics

USA . 476 parts In-Stock

1+ parts

$0.160

100+ parts

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$0.156

476

$0.160

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$0.156

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.160

100+ parts

-

1k+ parts

$0.152

10k+ parts

$0.148

1,000

$0.160

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$0.152

$0.148

Corphita

USA . 4,699 parts In-Stock

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$0.171

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4,699

$0.171

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Semicontronic

India . 7,672 parts In-Stock

1+ parts

$0.178

100+ parts

$0.174

1k+ parts

$0.173

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7,672

$0.178

$0.174

$0.173

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Corohmni

South Africa . 271 parts In-Stock

1+ parts

$7.091

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271

$7.091

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Aztec Data Supply Inc.

USA . 1,891 parts In-Stock

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$9.770

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1,891

$9.770

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Perfect Parts

USA . 147,128 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 48,182 parts In-Stock

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48,182

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Glotronic Ltd.

UK . 38,546 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,958 parts In-Stock

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27,958

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UNI Independent Distributors

Spain . 4,526 parts In-Stock

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4,526

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Overview

Enhance your telecom devices with the SL3S1002FTB1,115 from NXP Semiconductors. Known for their superior quality and cutting-edge technology, NXP Semiconductors delivers top-of-the-line products that guarantee reliability and performance. This Telecom Interface IC is a game-changer in the industry, offering seamless connectivity and enhanced functionality for your devices. Experience unparalleled value and efficiency with this product, designed to meet the demands of today's fast-paced world. Upgrade your devices now with NXP Semiconductors!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material offers durability and protection for the IC, ensuring a longer lifespan and reliable performance.

Surface Mount: YES

Surface mount capability makes the IC easy to integrate onto PCBs, saving space and simplifying assembly processes.

No. of Terminals: 3

Having just 3 terminals simplifies the design and circuitry, making it easier to troubleshoot and maintain.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand demanding environmental conditions without degradation in performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs SL3S1002FTB1,115 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PBCC-B3

JESD-609 Code:

e3

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BCC

Package Equivalence Code:

LCC3(UNSPEC)

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.55 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

SL3S1002FTB1,115 Telecommunications trade compliance attributes, and parameters.

HTS

8542.32.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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