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SL3S1002FTT

NXP Semiconductors

SL3S1002FTT by NXP Semiconductors

SL3S1002FTT by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It features a wide operating temp range of -40 °C to 85 °C, an 8-terminal gull-wing design, and compact dimensions (3mm x 3mm). Ideal for surface mount technology in telecom circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,484 parts In-Stock

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4,484

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Anansix

USA . 2,229 parts In-Stock

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2,229

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Digiode

USA . 966 parts In-Stock

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966

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Cyclops Electronics Ltd

UK . 52 parts In-Stock

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52

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Distributors (Availability)

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One Stop Electronics

USA . 849 parts In-Stock

1+ parts

$783.000

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849

$783.000

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A-Z Elektronik GmbH

Germany . 4,905 parts In-Stock

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4,905

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UNI Independent Distributors

Spain . 4,409 parts In-Stock

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4,409

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Metaverse IC Inc.

Canada . 864 parts In-Stock

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864

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Kepictronics

USA . 764 parts In-Stock

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764

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Corphita

USA . 668 parts In-Stock

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668

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Overview

Elevate your telecom solutions with the SL3S1002FTT from NXP Semiconductors, a trusted leader in high-quality semiconductor technology. Built for reliability and performance, this compact interface IC excels in demanding industrial environments. Its robust design ensures longevity and efficiency, making it ideal for diverse applications ranging from communication systems to equipment controls. Experience unmatched value and peace of mind with NXP at your side!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable package, contributing to reliability in various applications.

Surface Mount: YES

Surface mount capability allows for efficient and compact designs, making it suitable for modern electronic assemblies.

Package Shape: SQUARE

The square shape facilitates efficient space utilization on the PCB, making it easier to design compact electronic devices.

No. of Terminals: 8

Eight terminals provide versatility in connections, supporting various configurations for different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes the footprint, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures the IC can function reliably in demanding environments.

Minimum Operating Temperature: -40 °C

Operating at low temperatures enhances the product's suitability for harsh environmental conditions.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and aids in minimizing routing complexities.

Maximum Seated Height: 1.1 mm

A low maximum seated height allows for a slim profile, contributing to overall compactness in device design.

Width: 3 mm

The narrow width aids in fitting into tight spaces and enhances layout flexibility on PCB.

Length: 3 mm

A compact length further contributes to space-saving designs, making it an excellent choice for miniaturized applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates high reliability and performance in challenging environments.

Technology: CMOS

CMOS technology provides low power consumption and high-speed performance, making it ideal for telecom applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering, improving assembly efficiency and reliability.

Telecom IC Type: TELECOM CIRCUIT

Specialized as a telecom circuit, this IC is optimized for telecom applications, ensuring high performance and compatibility.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for more compact designs and makes it easier to integrate into modern PCB layouts.

Technical Specifications

Other Function Telecom Interface ICs SL3S1002FTT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

SL3S1002FTT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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