Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SL3S1002FTT by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It features a wide operating temp range of -40 °C to 85 °C, an 8-terminal gull-wing design, and compact dimensions (3mm x 3mm). Ideal for surface mount technology in telecom circuits.
Median Price
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Suppliers In-Stock
4
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1k+
Vyrian
1+ parts
100+ parts
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Anansix
Digiode
Cyclops Electronics Ltd
One Stop Electronics
$783.000
A-Z Elektronik GmbH
UNI Independent Distributors
Authorized Procurement Solutions
Metaverse IC Inc.
Kepictronics
Corphita
The use of plastic/epoxy ensures a lightweight and durable package, contributing to reliability in various applications.
Surface mount capability allows for efficient and compact designs, making it suitable for modern electronic assemblies.
The square shape facilitates efficient space utilization on the PCB, making it easier to design compact electronic devices.
Eight terminals provide versatility in connections, supporting various configurations for different applications.
The small outline package style minimizes the footprint, ideal for space-constrained applications.
A high maximum operating temperature ensures the IC can function reliably in demanding environments.
Operating at low temperatures enhances the product's suitability for harsh environmental conditions.
Dual terminal positioning simplifies PCB layout and aids in minimizing routing complexities.
A low maximum seated height allows for a slim profile, contributing to overall compactness in device design.
The narrow width aids in fitting into tight spaces and enhances layout flexibility on PCB.
A compact length further contributes to space-saving designs, making it an excellent choice for miniaturized applications.
An industrial temperature grade indicates high reliability and performance in challenging environments.
CMOS technology provides low power consumption and high-speed performance, making it ideal for telecom applications.
Gull wing terminals facilitate easy soldering, improving assembly efficiency and reliability.
Specialized as a telecom circuit, this IC is optimized for telecom applications, ensuring high performance and compatibility.
A 0.65 mm terminal pitch allows for more compact designs and makes it easier to integrate into modern PCB layouts.
Other Function Telecom Interface ICs SL3S1002FTT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
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SL3S1002FTT Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BAV99
Toshiba
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
L7805CV
STMicroelectronics
L7805CV by STMicroelectronics is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation in electronic circuits.
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
SS14
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Shanghai Lunsure Electronic Technology
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
MBRS3200T3G
Onsemi
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LL4148
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
FDD5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
Rectron
Rugao Dachang Electronic
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Forward Voltage (VF): .5 V;
1N4148
American Power Devices
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
OHN3020U
Tt Electronics Plc
OHN3020U by Tt Electronics Plc is a magnetic field sensor with a max supply voltage of 24V and hysteresis of 5mT. It features an output range of 25mA and operates in temperatures ranging from -20 to 85°C. Ideal for applications requiring precise detection and measurement of magnetic fields, such as automotive sensors or industrial automation systems.
PD69208T4ILQ-TR
Microchip Technology's PD69208T4ILQ-TR is a 56-terminal telecom IC with a max operating temp of 85°C. It features a no-lead terminal form, quad terminal position, and industrial temperature grade. Ideal for telecom circuits, this chip carrier package has a square shape and very thin profile for surface mount applications.
DWM1000
Qorvo
The Qorvo DWM1000 is a surface-mount telecom IC with 24 terminals, operating temperature range of -40 to 85°C. It features a data rate of 6.8 Mbps and CMOS technology, suitable for industrial applications requiring precise wireless communication in compact spaces.
MAX7044AKA-T
Maxim Integrated
MAX7044AKA-T by Maxim Integrated is a telecom IC with 8 terminals, operating at -40 to 125°C. It has a supply voltage of 2.7V and low power consumption of 0.0257mA, suitable for automotive applications due to its CMOS technology and small form factor.
BM20SPKS1NBC-0001AA
BM20SPKS1NBC-0001AA by Microchip Technology is a Telecom IC with 40 terminals, operating at -20 to 70°C. It has a supply voltage of 3.7V and terminal pitch of 1.2mm. Ideal for telecom applications due to its compact rectangular package style and surface mount capability.
RN4678-V/RM111
RN4678-V/RM111 by Microchip Technology is a telecom IC with 33 terminals, operating temperature range of -20 to 70°C, and supply voltage of 1.9V. It is designed for surface mount applications in telecom circuits, meeting TS 16949 screening standards. With a compact rectangular package style and no-lead terminal form, it is ideal for commercial use in various electronic devices.
PM-8916-0-176NSP-TR-02-1-01
Qualcomm
PM-8916-0-176NSP-TR-02-1-01 by Qualcomm is a 176-terminal GRID ARRAY IC with HVCMOS technology, 0.4mm terminal pitch, and 3.6V supply voltage. It's used in TELECOM CIRCUITS due to its thin profile and fine pitch for telecom interface applications.
BGM111A256V21
Silicon Labs
BGM111A256V21 by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm. This rectangular surface-mount package is ideal for industrial telecom circuit applications due to its compact size and temperature range.
BQ51013ARHLR
Texas Instruments
BQ51013ARHLR by Texas Instruments is a telecom interface IC with 20 terminals in a chip carrier package. It operates b/w 0-125°C, has a supply voltage of 5V, and data rate of 0.002 Mbps. Ideal for telecom circuits, it features nickel/palladium/gold terminal finish and very thin profile package style.
CMWX1ZZABZ-093
Murata Manufacturing
Murata's CMWX1ZZABZ-093 is a telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a metal package body for industrial use and is surface mountable. Ideal for telecom circuits, this rectangular microelectronic assembly has no lead terminals.
CC2500RGP
CC2500RGP by Texas Instruments is a telecom IC with 20 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8/3.6V and data rate of 0.25 Mbps. Ideal for industrial applications requiring low power consumption and compact design.
NEO-M9N-00B
U-blox Ag
NEO-M9N-00B by U-blox Ag is a GNSS Module with 24 terminals, operating at -40 to 85°C. It has a data rate of 12 Mbps and operates at 3V supply voltage. This surface-mount module in rectangular shape is ideal for telecom applications requiring precise positioning.
NEO-M8L-06B
TELECOM CIRCUIT;
BLE113-A-V1
BLE113-A-V1 by Silicon Labs is a surface mount telecom IC with 36 terminals, operating temperature range of -40 to 85°C. It features a rectangular package style, measures 15.725mm in length, and has a terminal pitch of 0.8mm. Ideal for industrial applications requiring low-profile telecom circuit integration.
RN52-I/RM
Microchip Technology's RN52-I/RM is a rectangular package IC with 40 terminals, 2.7mm height, and dimensions of 13.5mm x 26mm. It operates at a data rate of 3 Mbps and is used in telecom circuits for various applications requiring surface mount technology.
JN5168-001-M03Z
NXP Semiconductors
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 240;
ST25RU3993-BQFT
MAX2769CETI+
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30;
ST60-2230C-P
Laird Technologies
NINA-B112-04B
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 4;
ANNA-B112-01B-00
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
SL3S4011FHK,125
SL3S4011FHK,125 by NXP Semiconductors is a telecom interface IC with 8 terminals in a square chip carrier package. Operating at -40 to 85°C, it supports power supplies of 1.8/3.6V for industrial applications. This surface-mount IC has a terminal pitch of 0.5mm and is ideal for telecom circuit integration.
SL3S1002FTB1,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 3; Package Code: BCC; Package Shape: RECTANGULAR;
SL3S1003FTB0,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: RECTANGULAR;
SL3S4021FHKH
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: QCCN; Package Shape: SQUARE;
SL3S1004FUD/BG1
Other Telecom ICs;
SL3S1013FTB0
SL3S1013FTB0,115
NXP Semiconductors SL3S1013FTB0,115 is a telecom IC with CMOS technology. It features 6 terminals in a small outline package with very thin profile. Operating temperature range from -40 to 85 °C, suitable for industrial applications like telecom circuits.
SL3S1001FTT,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
SL3S1002AC2
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: DIE; Package Shape: RECTANGULAR;
SL3S1003FTB0
SL3S1004FUD/BG
SL3S1002AC2,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel;
SL3S1003FUD
SL3S1004FUD/BG1Z
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
SL3S1002AC0,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Maximum Operating Temperature: 85 Cel; Qualification: Not Qualified; Minimum Operating Temperature: -40 Cel; Package Equivalence Code: DIE OR CHIP;
SL3S1003FUD/BG
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;
SL3S1002FTT,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
SL3S1001FTT
SL3S1002AC0
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