Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Microchip Technology's PD69208T4ILQ-TR is a 56-terminal telecom IC with a max operating temp of 85°C. It features a no-lead terminal form, quad terminal position, and industrial temperature grade. Ideal for telecom circuits, this chip carrier package has a square shape and very thin profile for surface mount applications.
Median Price
-
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Chip Stock
1+ parts
100+ parts
1k+ parts
10k+ parts
Vyrian
Nova Conductors
AZTECH Wire
$10.855
Semicontronic
$438.000
$427.050
$424.860
Ampacity Inc.
$670.000
Metaverse IC Inc.
Authorized Procurement Solutions
QUARKTWIN TECHNOLOGY LTD
XL Components Corporation
Marpe Global Electronics
Continental Prestige Electronics
A-Z Elektronik GmbH
Argo Parts USA
Kepictronics
QualityLine Systems
Assy Fe
Bastille Electronics
Microchip USA
Plastic/epoxy package body material provides good insulation and protection for the IC, making it durable and reliable in various environments.
Surface mount capability allows for easy and efficient assembly onto PCBs, saving space and simplifying the manufacturing process.
Square package shape helps in efficient placement and mounting on the PCB, optimizing board space and layout.
Having 56 terminals provides ample connectivity options for interfacing with different components or devices, enhancing versatility and functionality.
The combination of chip carrier, heat sink/slug, and very thin profile package styles results in efficient heat dissipation, compact design, and reduced overall height for space-constrained applications.
With a high maximum operating temperature, this IC can withstand elevated temperatures without compromising performance, making it suitable for industrial applications where heat management is crucial.
The low minimum operating temperature ensures reliable operation even in cold environments, offering robust performance across a wide temperature range.
Quad terminal position facilitates easy soldering and connection to the PCB, ensuring a secure and stable interface for reliable operation.
The maximum seated height of 1mm allows for a low-profile design, making it suitable for applications where space-saving is essential.
The 8mm width provides a compact footprint, enabling efficient placement on the PCB and enhancing overall board layout.
The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and reflow processes during manufacturing, contributing to the reliability and quality of the end product.
The peak reflow temperature of 260°C allows for secure and effective soldering of the IC onto the PCB, creating strong connections for optimal performance.
The 8mm length complements the compact width and height of the IC, resulting in a small form factor ideal for space-constrained applications.
Designed for industrial temperature ranges, this IC can operate reliably in harsh conditions typically found in industrial settings, ensuring consistent performance and longevity.
The no-lead terminal form eliminates the risk of lead contamination and complies with environmental regulations, making it a more eco-friendly choice.
Specifically designed for telecom applications, this IC offers optimized functionality and performance for telecommunications systems, making it a reliable choice for such applications.
With a nominal supply voltage of 55V, this IC is suitable for telecom applications requiring higher voltage levels, ensuring compatibility and reliable operation.
The 0.5mm terminal pitch allows for fine-pitch connections, enabling high-density PCB designs and efficient signal routing for enhanced performance.
With MSL level 3, this IC can withstand moderate exposure to moisture during storage and handling, ensuring reliability and longevity in various environmental conditions.
Other Function Telecom Interface ICs PD69208T4ILQ-TR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
PCN Obsolescence/ EOL - DK OBS NOTICE
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
BAV99
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
1N4148WS
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Philips Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138LT1G
Onsemi
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
Vishay Telefunken
LL4148
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M24308/2-1F
Souriau-sunbank Connection Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body Length: 1.228 inch; Mounting Type: CABLE AND PANEL; Termination Type: CRIMP;
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
Formosa Microsemi
4554
Jw Miller Magnetics
Other Semiconductors;
1N4148
Diotec Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Diodes Incorporated
ERJ6ENF10R0V
Panasonic
Panasonic ERJ6ENF10R0V is a 10 ohm fixed resistor with 1% tolerance, suitable for surface mount applications. With a rated power dissipation of 0.125W and operating voltage of 150V, it operates b/w -55°C to 155°C. Its metal glaze/thick film technology ensures stable performance in various electronic circuits.
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
NC7WZ17P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
ESP32-D2WD
Espressif Systems (Shanghai)
ESP32-D2WD by Espressif Systems is a 48-terminal IC with CMOS technology. Operating from -40 to 105°C, it has a supply voltage of 3.3V. Ideal for telecom circuits, this chip carrier is surface-mountable and features a very thin profile for industrial applications.
BMD-340-A-R-10
U-blox Ag
BMD-340-A-R-10 by U-blox Ag is a surface mount telecom IC with 68 terminals. It operates in industrial temperature range (-40 to 85 °C) and has a nominal voltage of 3V. With a data rate of 2 Mbps, it is ideal for high-speed telecommunications applications.
MFRC63002HN,151
NXP Semiconductors
NXP Semiconductors' MFRC63002HN,151 is a telecom IC with 32 terminals in a square chip carrier package. Operating b/w -25 to 85°C, it has a nominal voltage of 5V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and features a max seated height of 1mm.
ZOE-M8Q-0-10
ZOE-M8Q-0-10 by U-blox Ag is a telecom IC with 51 terminals, operating at -40 to 85°C. It features a 3V supply voltage, 0.5mm terminal pitch, and AEC-Q100 screening for industrial applications. This surface-mount device in square package shape is ideal for compact telecom circuit designs.
BGM15MA12E6327XTSA1
BGM15MA12E6327XTSA1 by Infineon is a telecom IC with 12 terminals, operating temperature range of -40 to 85°C. It features a chip carrier package style, very thin profile, and no-lead terminal form. Ideal for telecom circuit applications with a nominal voltage of 2.8V and compact dimensions of 1.9mm x 1.1mm x 0.65mm.
CC1125RHMR
Texas Instruments
CC1125RHMR by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. Operating at -40 to 85°C, it has a supply voltage of 3V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and features nickel palladium gold finish.
BMD-350-A-R
Rigado
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 47; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
ATA5551M-PPMY
Microchip Technology
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; Package Shape: UNSPECIFIED; JESD-30 Code: X-XXSS-X; Surface Mount: NO;
LEA-M8T-0
LEA-M8T-0 by U-blox Ag is a telecom IC with 28 terminals, operating at -40 to 85°C. With a compact size of 17x22.4mm, it has a supply voltage of 3V and MSL level of 4. Ideal for industrial applications requiring precise telecom circuit interfacing in tight spaces.
AP22814BM8-13
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;
BM71BLES1FC2-0B05BA
BM71BLES1FC2-0B05BA by Microchip Technology is a surface mount telecom interface IC with 16 terminals. It operates at temperatures ranging from -40 to 85 °C and has a max seated height of 2.1 mm. With a data rate of 0.0086 Mbps, it is suitable for various telecom circuit applications.
ZED-F9P-01B-01
Other Telecom ICs;
AX-SFEU-1-03-TX30
AX-SFEU-1-03-TX30 by Onsemi is a telecom IC with 40 terminals in a rectangular chip carrier package. It operates b/w -40 to 85°C, suitable for industrial applications. With a nominal voltage of 3V and terminal pitch of 0.5mm, it's ideal for telecom interface functions.
NINA-B406-00B
TELECOM CIRCUIT;
NEO-M8P-0
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 4;
HMC624ALP4ETR
Analog Devices
Analog Devices' HMC624ALP4ETR is a 24-terminal CMOS telecom IC with a square chip carrier package. Operating from -40 to 85°C, it has a very thin profile and matte tin finish. Ideal for telecom circuits, this IC has a terminal pitch of 0.5mm and no lead terminal form.
BGM123A256V2R
Silicon Labs
BGM123A256V2R by Silicon Labs is a telecom IC with 56 terminals, operating temperature range of -40 to 85°C, and nominal voltage of 3.3V. It is designed for telecom circuit applications in industrial settings due to its compact square package style and surface mount capability.
RN4871-I/RM130
RN4871-I/RM130 by Microchip Technology is a surface mount telecom interface IC with 16 terminals. It operates in an industrial temperature range of -40 to 85 °C and has a data rate of 0.01 Mbps. This IC is commonly used in telecom circuits for various applications.
A2235-H
Lantronix
The Lantronix A2235-H is an industrial-grade telecom circuit IC with a nominal voltage of 3.3V. It operates b/w -40°C to 85°C, making it suitable for harsh environments. Packaged in a rectangular microelectronic assembly, it is ideal for telecom interface applications.
BM71BLE01FC2-0B04AA
The Microchip Technology BM71BLE01FC2-0B04AA is a telecom IC with 17 terminals, operating temperature range of -40 to 85°C, and data rate of 0.0086 Mbps. It is designed for industrial applications requiring a nominal voltage of 3V, such as wireless communication systems.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
PD69208MILQ-TR-LE
Microsemi
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
PD69208T4ILQ-TR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;
PD69208MILQ-TR
PD69200C-016121
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
PD69204T4ILQ-TR
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved