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AX-SFEU-1-03-TX30

Onsemi

AX-SFEU-1-03-TX30 by Onsemi

AX-SFEU-1-03-TX30 by Onsemi is a telecom IC with 40 terminals in a rectangular chip carrier package. It operates b/w -40 to 85°C, suitable for industrial applications. With a nominal voltage of 3V and terminal pitch of 0.5mm, it's ideal for telecom interface functions.

Median Price

$4.513

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 72,000 parts In-Stock

1+ parts

-

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1k+ parts

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10k+ parts

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72,000

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-

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Rochester

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

$3.610

1k+ parts

$3.230

10k+ parts

$3.040

21,000

-

$3.610

$3.230

$3.040

Farnell

UK . 21,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$9.970

21,000

-

-

-

$9.970

Verical

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

$4.513

1k+ parts

$4.037

10k+ parts

$3.800

21,000

-

$4.513

$4.037

$3.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,394 parts In-Stock

1+ parts

$12.008

100+ parts

-

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1,394

$12.008

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Nova Conductors

Japan . 79 parts In-Stock

1+ parts

$12.012

100+ parts

-

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79

$12.012

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Flip Electronics

USA . 72,000 parts In-Stock

1+ parts

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72,000

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DigiKey Marketplace

USA . 72,000 parts In-Stock

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72,000

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Vyrian

USA . 46,189 parts In-Stock

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46,189

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Chip Stock

USA . 28,000 parts In-Stock

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28,000

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VNN

France . 98 parts In-Stock

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98

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$8.182

100+ parts

$7.446

1k+ parts

$6.709

10k+ parts

-

2,000

$8.182

$7.446

$6.709

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Ampacity Inc.

Singapore . 46,208 parts In-Stock

1+ parts

$8.470

100+ parts

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46,208

$8.470

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Corphita

USA . 1,545 parts In-Stock

1+ parts

$11.376

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1,545

$11.376

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Corohmni

South Africa . 165 parts In-Stock

1+ parts

$14.056

100+ parts

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165

$14.056

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Continental Prestige Electronics

USA . 21,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$9.970

10k+ parts

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21,000

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$9.970

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SupplyDigital Components

Austria . 8,253 parts In-Stock

1+ parts

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8,253

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Kulean Microsystems

USA . 6,386 parts In-Stock

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6,386

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TANS Electronics

Latvia . 5,741 parts In-Stock

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5,741

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Problanco Electronics

Mexico . 2,071 parts In-Stock

1+ parts

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2,071

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Argo Parts USA

USA . 1,459 parts In-Stock

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1,459

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UHIMA Technologies

Türkiye . 639 parts In-Stock

1+ parts

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639

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Overview

Elevate your telecom interface solutions with the AX-SFEU-1-03-TX30 by Onsemi. Manufactured with top-notch quality and precision, this product offers unmatched reliability and performance in various applications within the telecom industry. With its innovative design and advanced features, customers can expect seamless integration and enhanced functionality for their projects. Trust Onsemi to deliver excellence, trust the AX-SFEU-1-03-TX30 for superior performance that exceeds expectations. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, perfect for use in telecom applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient installation, making it a convenient choice for manufacturers.

Package Shape: RECTANGULAR

The rectangular shape offers a compact design, saving space and allowing for more efficient PCB layout.

No. of Terminals: 40

With a high number of terminals, this product can support complex telecom interfaces and connections.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance in a wide range of temperature environments.

Terminal Position: QUAD

The quad terminal position provides a sturdy connection and allows for efficient signal transmission.

Maximum Seated Height: 1 mm

The low seated height makes it suitable for applications where space is limited.

Width: 5 mm

The compact width enables the product to fit in tight spaces without compromising functionality.

Length: 7 mm

The short length makes it easy to integrate into electronic systems and devices without occupying too much space.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures the product can withstand harsh operating conditions commonly found in industrial settings.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process and reduces environmental impact.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is common in telecom applications, making this product compatible with existing systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting, making it suitable for compact and complex circuit designs.

Technical Specifications

Other Function Telecom Interface ICs AX-SFEU-1-03-TX30 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PQCC-N40

Length:

7 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2X.27,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

AX-SFEU-1-03-TX30 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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