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TLE8457BLEXUMA1

Infineon Technologies

TLE8457BLEXUMA1 by Infineon Technologies

TLE8457BLEXUMA1 by Infineon is a BICMOS technology telecom IC with 8 terminals in a small outline package. It operates at a nominal voltage of 8V and has a terminal pitch of 0.65mm. This IC is suitable for telecom circuit applications due to its AEC-Q100 screening level and moisture sensitivity level of 2A.

Median Price

$0.990

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 4,890 parts In-Stock

1+ parts

$1.010

100+ parts

-

1k+ parts

-

10k+ parts

-

4,890

$1.010

-

-

-

Mouser Electronics

USA . 4,834 parts In-Stock

1+ parts

$1.310

100+ parts

$0.945

1k+ parts

$0.843

10k+ parts

$0.771

4,834

$1.310

$0.945

$0.843

$0.771

Chip1Stop

Japan . 4,824 parts In-Stock

1+ parts

$1.920

100+ parts

$1.140

1k+ parts

$0.825

10k+ parts

$0.734

4,824

$1.920

$1.140

$0.825

$0.734

Future Electronics

Canada . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.650

10,000

-

-

-

$0.650

Rochester

USA . 9,051 parts In-Stock

1+ parts

-

100+ parts

$0.934

1k+ parts

$0.776

10k+ parts

$0.692

9,051

-

$0.934

$0.776

$0.692

DigiKey

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.737

5,000

-

-

-

$0.737

Element14

Singapore . 4,890 parts In-Stock

1+ parts

-

100+ parts

$1.650

1k+ parts

$1.170

10k+ parts

$1.150

4,890

-

$1.650

$1.170

$1.150

Verical

USA . 4,830 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.970

10k+ parts

-

4,830

-

-

$0.970

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 277 parts In-Stock

1+ parts

$0.585

100+ parts

-

1k+ parts

-

10k+ parts

-

277

$0.585

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.000

-

-

-

NAC Semi

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.090

10,000

-

-

-

$1.090

Vyrian

USA . 6,137 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,137

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,505 parts In-Stock

1+ parts

$0.520

100+ parts

-

1k+ parts

-

10k+ parts

-

6,505

$0.520

-

-

-

Semicontronic

India . 6,329 parts In-Stock

1+ parts

$0.520

100+ parts

$0.507

1k+ parts

$0.504

10k+ parts

-

6,329

$0.520

$0.507

$0.504

-

Corphita

USA . 670 parts In-Stock

1+ parts

$0.554

100+ parts

-

1k+ parts

-

10k+ parts

-

670

$0.554

-

-

-

Component Stockers USA

USA . 16,551 parts In-Stock

1+ parts

$0.990

100+ parts

$0.980

1k+ parts

$0.790

10k+ parts

$0.790

16,551

$0.990

$0.980

$0.790

$0.790

Continental Prestige Electronics

USA . 5,002 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

$0.980

5,002

$1.000

-

-

$0.980

Argo Parts USA

USA . 4,777 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

4,777

$1.000

-

-

-

Microchip USA

USA . 1,055 parts In-Stock

1+ parts

$6.370

100+ parts

$6.330

1k+ parts

$6.310

10k+ parts

$6.290

1,055

$6.370

$6.330

$6.310

$6.290

Corohmni

South Africa . 704 parts In-Stock

1+ parts

$8.463

100+ parts

-

1k+ parts

-

10k+ parts

-

704

$8.463

-

-

-

Aztec Data Supply Inc.

USA . 1,307 parts In-Stock

1+ parts

$10.540

100+ parts

-

1k+ parts

-

10k+ parts

-

1,307

$10.540

-

-

-

Modulus Dynamics

Lithuania . 1,782 parts In-Stock

1+ parts

$11.950

100+ parts

$11.472

1k+ parts

$10.994

10k+ parts

-

1,782

$11.950

$11.472

$10.994

-

Perfect Parts

USA . 11,292 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,292

-

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.980

1k+ parts

$0.950

10k+ parts

$0.930

1,000

-

$0.980

$0.950

$0.930

Overview

Unlock the power of seamless communication with the TLE8457BLEXUMA1 by Infineon Technologies. As a leader in manufacturing excellence, Infineon delivers top-quality telecom interface ICs that are designed to optimize performance and reliability. Whether you're looking to enhance your telecommunications infrastructure or streamline data transmission, this product offers unparalleled value and benefits. Experience the convenience of a compact package style and advanced BICMOS technology, all while enjoying the peace of mind that comes with AEC-Q100 screening. Elevate your connectivity solutions with the TLE8457BLEXUMA1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving time and space during assembly.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability, making it suitable for automotive applications where high performance is critical.

Package Shape: SQUARE

Provides a compact form factor, ideal for applications where space is limited.

No. of Terminals: 8

Offers multiple connection points for interfacing with other components, enhancing versatility.

Package Style (Meter): SMALL OUTLINE

Facilitates easy integration into various circuit designs, promoting seamless compatibility.

Terminal Finish: TIN

Ensures good conductivity and corrosion resistance, maintaining signal integrity and longevity.

Terminal Position: DUAL

Provides redundancy and improved signal quality, enhancing the overall performance of the IC.

Maximum Seated Height: 1.15 mm

Low profile design enables space-efficient PCB layouts, suitable for compact electronic devices.

Width: 3 mm

Compact width allows for efficient use of board space, ideal for applications with limited real estate.

Length: 3 mm

Compact length ensures minimal footprint on the circuit board, contributing to space-saving designs.

Technology: BICMOS

Combines the benefits of bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: NO LEAD

Lead-free design complies with environmental regulations and improves overall solder joint reliability.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance and compatibility in telecommunications systems.

Nominal Supply Voltage: 8 V

Operates within the standard voltage range for telecom applications, ensuring compatibility with existing systems.

Terminal Pitch: 0.65 mm

Fine pitch allows for high-density packaging, enabling efficient use of board space for complex designs.

Moisture Sensitivity Level (MSL): 2A

Indicates that the IC is moderately sensitive to moisture, suitable for handling and storage in typical manufacturing environments.

Technical Specifications

Other Function Telecom Interface ICs TLE8457BLEXUMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.15 mm

Nominal Supply Voltage:

8 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TLE8457BLEXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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