Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE8457BLEXUMA1 by Infineon is a BICMOS technology telecom IC with 8 terminals in a small outline package. It operates at a nominal voltage of 8V and has a terminal pitch of 0.65mm. This IC is suitable for telecom circuit applications due to its AEC-Q100 screening level and moisture sensitivity level of 2A.
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Provides durability and protection for the internal components of the IC, ensuring longevity and reliability.
Allows for easy and efficient mounting on circuit boards, saving time and space during assembly.
Meets automotive industry standards for reliability, making it suitable for automotive applications where high performance is critical.
Provides a compact form factor, ideal for applications where space is limited.
Offers multiple connection points for interfacing with other components, enhancing versatility.
Facilitates easy integration into various circuit designs, promoting seamless compatibility.
Ensures good conductivity and corrosion resistance, maintaining signal integrity and longevity.
Provides redundancy and improved signal quality, enhancing the overall performance of the IC.
Low profile design enables space-efficient PCB layouts, suitable for compact electronic devices.
Compact width allows for efficient use of board space, ideal for applications with limited real estate.
Compact length ensures minimal footprint on the circuit board, contributing to space-saving designs.
Combines the benefits of bipolar and CMOS technologies, offering high performance and low power consumption.
Lead-free design complies with environmental regulations and improves overall solder joint reliability.
Specifically designed for telecom applications, ensuring optimal performance and compatibility in telecommunications systems.
Operates within the standard voltage range for telecom applications, ensuring compatibility with existing systems.
Fine pitch allows for high-density packaging, enabling efficient use of board space for complex designs.
Indicates that the IC is moderately sensitive to moisture, suitable for handling and storage in typical manufacturing environments.
Other Function Telecom Interface ICs TLE8457BLEXUMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Screening Level:
Maximum Seated Height:
Nominal Supply Voltage:
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Technology:
Telecom IC Type:
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TLE8457BLEXUMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
2N2222A
Aeroflex/metelics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Package Shape: ROUND; Transistor Application: SWITCHING;
BAV99
Kec
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
2N7002-T1-E3
Vishay Intertechnology
Vishay Intertechnology's 2N7002-T1-E3 is a N-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. With ENHANCEMENT MODE operation, this GULL WING transistor is ideal for small outline surface mount designs up to 150°C.
LL4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Nte Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358DT
STMicroelectronics
LM358DT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 9000 uV. It operates at a nominal voltage of 5V and has a min voltage gain of 25000. This amplifier is commonly used in applications requiring high precision and low power consumption.
SMBJ18CA
Semtech
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
Cheng-yi Electronic
BSS123LT1G
Onsemi
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
Diodes Incorporated
Crimson Semiconductor
ULN2803ADWRG4
Texas Instruments
ULN2803ADWRG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output, and built-in transient protection. It operates b/w -40 to 85 °C with a max supply voltage of 3 V. Ideal for applications requiring sink current flow direction in a small outline package style.
2N7002
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
LM317LMX/NOPB
LM317LMX/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max input-output voltage differential of 40V. It operates in temperatures ranging from -40°C to 125°C and has a max output current of 0.1A, making it suitable for various applications requiring precise voltage regulation.
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
Microsemi
1N4148W-7-F
1N4148W-7-F by Diodes Inc. is a single rectifier diode with 0.715V max forward voltage and 100V max reverse voltage. Ideal for applications requiring fast switching speeds, it has a small outline package style and matte tin terminal finish, making it suitable for surface mount PCB designs.
MAX2769CETI+T
Maxim Integrated
TELECOM CIRCUIT; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1;
RS9116W-DB00-CC0-B2A
Silicon Labs
TELECOM CIRCUIT;
CC2642R1FRGZT
CC2642R1FRGZT by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. This surface-mount IC is ideal for industrial applications requiring very thin profile components.
HMC624ALP4E
Hittite Microwave
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
AS3933-BTST
Sciosense Bv
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
MAX24287ETK+
SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE;
MD0100N8-G
MD0100N8-G by Microchip Tech is a telecom IC with 3 terminals. It operates b/w -40 to 125°C, suitable for automotive applications. The package is small outline, low profile, with matte tin finish and single terminal position.
MAX-M8Q
U-blox Ag
BM70BLES1FC2-0B04AA
Microchip Technology's BM70BLES1FC2-0B04AA is a telecom IC with 33 terminals, operating at -40 to 85°C. It has a data rate of 0.0086 Mbps and operates at 3V supply voltage. This rectangular package is ideal for industrial applications requiring low-power telecom circuit integration.
SPBTLE-RF0
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
TRF37B73IDSGT
TRF37B73IDSGT by Texas Instruments is an 8-terminal telecom IC with a package style of small outline, heat sink/slug, and very thin profile. It operates b/w -40 to 85°C, with a nominal voltage of 3.3V. Ideal for telecom circuits due to its nickel palladium gold terminal finish and industrial temperature grade suitability.
CC430F6137IRGCR
CC430F6137IRGCR by Texas Instruments is a 64-terminal telecom IC with a data rate of 0.25 Mbps and operates b/w -40 to 85°C. It features a package style of CHIP CARRIER, ideal for industrial applications requiring low power consumption and compact design.
LMH0384SQX/NOPB
National Semiconductor
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: QCCN; Package Shape: SQUARE;
EC25EUXGA-128-SGNS
Quectel Wireless Solutions
Quectel Wireless Solutions EC25EUXGA-128-SGNS is a telecom IC with 150 Mbps data rate, operating at -35 to 75°C. With 144 terminals and 3.8V supply voltage, it's ideal for high-speed communication applications in commercial extended temperature environments.
PN7161A1HN/C100E
NXP Semiconductors
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
NRF51822-QFAB-T
Nordic Semiconductor Asa
NRF51822-QFAB-T by Nordic Semiconductor Asa is a 48-terminal telecom IC with 1.8V supply voltage, -25 to 75°C operating range, and 0.4mm terminal pitch. It is used in telecom circuits due to its square chip carrier package style and quad terminal position, suitable for surface mount applications.
TLK2711IRCP
TLK2711IRCP by Texas Instruments is a telecom IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5V and terminal pitch of 0.5mm. Ideal for telecom circuits, it features a flatpack package style and nickel palladium gold terminal finish.
AP22814BW5-7
Diodes Inc. AP22814BW5-7 is a telecom IC with 5V supply voltage, operating from -40 to 85°C. It features a small outline package with matte tin finish, suitable for telecom circuit applications. The IC has dual terminals in gull wing form, measuring 3x1.6mm and 1.4mm seated height for industrial temperature grade use.
RS9116W-SB00-QMS-B2A
HMC244AG16
Analog Devices
HMC244AG16 by Analog Devices is a telecom IC with 16 terminals in a low profile flatpack package. It operates b/w -40 to 85°C, with gold over nickel terminal finish. Ideal for telecom circuits, it has a nominal voltage of 3V and gull wing terminal form.
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TLE8457BSJXUMA1
Infineon Technologies
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE8457ALEXUMA1
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: SON; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 2A;
TLE8457ASJXUMA1
TLE8457ASJXUMA1 by Infineon is a BICMOS technology Telecom IC with 8 terminals in a small outline package. It operates at 8V, AEC-Q100 screening level, suitable for telecom circuit applications. The Gull Wing terminal form and compact size make it ideal for space-constrained designs.
TLE8457ALE
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Technology: BICMOS;
TLE8457ASJ
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Technology: BICMOS;
TLE8457BLE
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HTSON; Package Shape: SQUARE; Nominal Supply Voltage: 8 V;
TLE8457BSJ
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5 mm;
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