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CC430F6137IRGCR

Texas Instruments

CC430F6137IRGCR by Texas Instruments

CC430F6137IRGCR by Texas Instruments is a 64-terminal telecom IC with a data rate of 0.25 Mbps and operates b/w -40 to 85°C. It features a package style of CHIP CARRIER, ideal for industrial applications requiring low power consumption and compact design.

Median Price

$9.690

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,572 parts In-Stock

1+ parts

$5.520

100+ parts

$4.500

1k+ parts

$3.000

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-

6,572

$5.520

$4.500

$3.000

-

Mouser Electronics

USA . 1,951 parts In-Stock

1+ parts

$9.690

100+ parts

$6.640

1k+ parts

$6.030

10k+ parts

$5.600

1,951

$9.690

$6.640

$6.030

$5.600

DigiKey

USA . 49 parts In-Stock

1+ parts

$9.690

100+ parts

$7.357

1k+ parts

$6.490

10k+ parts

-

49

$9.690

$7.357

$6.490

-

Distributors (In-Stock)

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EXC GmbH

Germany . 4,000 parts In-Stock

1+ parts

$4.338

100+ parts

-

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4,000

$4.338

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$4.500

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150

$4.500

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Digiode

USA . 221 parts In-Stock

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$5.244

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221

$5.244

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Chip Stock

USA . 11,000 parts In-Stock

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Vyrian

USA . 2,541 parts In-Stock

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LittleDiode

UK . 2 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,137 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

-

10k+ parts

$4.410

4,137

$4.500

-

-

$4.410

Netroflash

USA . 500 parts In-Stock

1+ parts

$4.500

100+ parts

$4.410

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-

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500

$4.500

$4.410

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Argo Parts USA

USA . 409 parts In-Stock

1+ parts

$4.500

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409

$4.500

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Ampacity Inc.

Singapore . 2,695 parts In-Stock

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$4.690

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2,695

$4.690

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Semicontronic

India . 2,604 parts In-Stock

1+ parts

$4.690

100+ parts

$4.573

1k+ parts

$4.549

10k+ parts

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2,604

$4.690

$4.573

$4.549

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Corphita

USA . 3,810 parts In-Stock

1+ parts

$4.968

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3,810

$4.968

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Parana Technologies

USA . 1,978 parts In-Stock

1+ parts

$8.993

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$9.662

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1,978

$8.993

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$9.662

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DigiPath Technology Company

USA . 1,295 parts In-Stock

1+ parts

$9.903

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1,295

$9.903

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ChromeModa Solutions

Germany . 3,689 parts In-Stock

1+ parts

$10.105

100+ parts

$8.286

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3,689

$10.105

$8.286

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IDEA Electronic Components Group

UK . 960 parts In-Stock

1+ parts

$10.105

100+ parts

$9.600

1k+ parts

$9.094

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960

$10.105

$9.600

$9.094

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Corohmni

South Africa . 177 parts In-Stock

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$16.958

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177

$16.958

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Lixinc

USA . 19,923 parts In-Stock

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Perfect Parts

USA . 18,489 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,919 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,279 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Kepictronics

USA . 42 parts In-Stock

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Robosynatics

Brazil . 10 parts In-Stock

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$7.443

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$7.443

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$7.443

10

-

$7.443

$7.443

$7.443

Lucentia Tech

USA . 10 parts In-Stock

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100+ parts

$7.443

1k+ parts

$7.443

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$7.443

10

-

$7.443

$7.443

$7.443

Overview

Enhance your telecom interface systems with the CC430F6137IRGCR from Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments delivers top-notch products that are built to last. This telecom circuit IC offers unmatched reliability and performance, making it ideal for a wide range of applications. With a nominal supply voltage of 2.2V and a data rate of 0.25Mbps, this chip carrier provides seamless connectivity and efficient operation. Trust Texas Instruments to provide you with the best solutions for your telecom interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, ensuring long-lasting performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort in the manufacturing process.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, making it suitable for compact designs.

No. of Terminals: 64

64 terminals offer a high level of connectivity, enabling the IC to interface with various components effectively.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability of the IC in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures makes the IC versatile and suitable for use in different climate conditions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

Multiple terminal finishes enhance the conductivity and reliability of the connections, ensuring optimal performance.

Maximum Seated Height: 1 mm

Low seated height allows for a compact and slim design, making it suitable for space-constrained applications.

Nominal Supply Voltage: 2.2 V

Low nominal supply voltage minimizes power consumption, making the IC energy-efficient.

Data Rate: 0.25 Mbps

High data rate capability enables fast and efficient data transmission, enhancing the overall performance of the product.

Technical Specifications

Other Function Telecom Interface ICs CC430F6137IRGCR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.25 Mbps

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

CC430F6137IRGCR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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