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CC430F6127IRGCR

Texas Instruments

CC430F6127IRGCR by Texas Instruments

CC430F6127IRGCR by Texas Instruments is a telecom IC with 64 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 2.2V and data rate of 0.25 Mbps. Ideal for industrial applications requiring low power consumption and compact design.

Median Price

$3.698

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,436 parts In-Stock

1+ parts

$3.698

100+ parts

$3.015

1k+ parts

$2.010

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17,436

$3.698

$3.015

$2.010

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.010

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10

$2.010

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Digiode

USA . 2,535 parts In-Stock

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$3.513

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2,535

$3.513

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Vyrian

USA . 7,055 parts In-Stock

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7,055

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Cyclops Electronics Ltd

UK . 1,974 parts In-Stock

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LittleDiode

UK . 2 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$1.970

100+ parts

-

1k+ parts

$1.891

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500

$1.970

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$1.891

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Argo Parts USA

USA . 3,512 parts In-Stock

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$2.010

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3,512

$2.010

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Continental Prestige Electronics

USA . 523 parts In-Stock

1+ parts

$2.010

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$1.970

523

$2.010

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$1.970

Ampacity Inc.

Singapore . 17,327 parts In-Stock

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$3.140

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17,327

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Corphita

USA . 3,762 parts In-Stock

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$3.328

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3,762

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Parana Technologies

USA . 892 parts In-Stock

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$6.460

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$7.203

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892

$6.460

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DigiPath Technology Company

USA . 2,225 parts In-Stock

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$7.113

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$6.544

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2,225

$7.113

$6.544

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ChromeModa Solutions

Germany . 6,451 parts In-Stock

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$7.258

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$5.952

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$7.258

$5.952

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IDEA Electronic Components Group

UK . 181 parts In-Stock

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$7.258

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$6.532

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$6.532

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AZTECH Wire

Italy . 40 parts In-Stock

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$11.870

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Corohmni

South Africa . 981 parts In-Stock

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Component Stockers USA

USA . 22,532 parts In-Stock

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Lixinc

USA . 10,199 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,370 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,913 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Overview

Experience seamless communication with the CC430F6127IRGCR by Texas Instruments. Known for its superior quality and reliability, Texas Instruments offers a wide range of applications in the telecom interface IC category. This product provides unmatched value, benefits, and advantages to customers looking for a high-performance solution. Whether you're in need of a telecom circuit or other function interface IC, the CC430F6127IRGCR is the perfect choice for your industrial-grade requirements. Upgrade your communication systems today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material helps provide durability and protection for the IC.

Surface Mount: YES

Being surface mount enables easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, maximizing functionality in a compact design.

No. of Terminals: 64

With a high number of terminals, this IC can support complex telecom functions and communication protocols.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The chip carrier style with a very thin profile ensures space-saving integration, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this IC is suitable for use in cold environments without sacrificing functionality.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of nickel, palladium, gold, and silver for terminal finish ensures excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position offers stability and secure connections for efficient signal transmission.

Maximum Seated Height: 1 mm

With a low maximum seated height, this IC can be easily incorporated into slim devices without compromising space constraints.

Width: 9 mm

The compact 9 mm width allows for versatile placement on circuit boards without occupying excessive space.

Maximum Time At Peak Reflow Temperature (s): 30

This IC can withstand peak reflow temperatures for up to 30 seconds, ensuring secure soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables efficient soldering processes for seamless integration into electronic assemblies.

Length: 9 mm

The 9 mm length complements the compact width, making this IC suitable for space-restricted applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments, making this IC a robust choice for telecom applications.

Terminal Form: NO LEAD

The no-lead terminal form reduces potential health and environmental risks, making this IC an eco-friendly option.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this IC offers optimized performance and compatibility within telecom systems.

Nominal Supply Voltage: 2.2 V

The 2.2 V nominal supply voltage provides stable power input for consistent operation of the IC.

Terminal Pitch: 0.5 mm

The fine 0.5 mm terminal pitch allows for precise connections, enhancing the overall functionality and reliability of the IC.

Data Rate: 0.25 Mbps

With a data rate of 0.25 Mbps, this IC can efficiently handle moderate data transmission speeds in telecom applications.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the IC's moderate moisture sensitivity, ensuring proper handling during manufacturing and storage.

Technical Specifications

Other Function Telecom Interface ICs CC430F6127IRGCR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.25 Mbps

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

CC430F6127IRGCR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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