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CYBT-343026-01

Infineon Technologies

CYBT-343026-01 by Infineon Technologies

Infineon's CYBT-343026-01 is a telecom IC with 24 terminals in a rectangular microelectronic assembly. Operating b/w -30°C to 85°C, it has a compact size of 12mm width and 15.5mm length with no-lead terminal form. Ideal for telecom interfaces, this surface-mount IC is suitable for various applications requiring reliable connectivity in limited space environments.

Median Price

$6.341

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 302 parts In-Stock

1+ parts

$4.166

100+ parts

-

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302

$4.166

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Chip1Stop

Japan . 446 parts In-Stock

1+ parts

$4.440

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-

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-

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446

$4.440

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Farnell

UK . 219 parts In-Stock

1+ parts

$7.370

100+ parts

$5.590

1k+ parts

$5.270

10k+ parts

-

219

$7.370

$5.590

$5.270

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Mouser Electronics

USA . 1,312 parts In-Stock

1+ parts

$9.750

100+ parts

$7.310

1k+ parts

$6.100

10k+ parts

-

1,312

$9.750

$7.310

$6.100

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DigiKey

USA . 9,397 parts In-Stock

1+ parts

$10.200

100+ parts

$7.732

1k+ parts

$7.345

10k+ parts

-

9,397

$10.200

$7.732

$7.345

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RS (Exports)

UK . 5 parts In-Stock

1+ parts

$10.211

100+ parts

$7.139

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-

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5

$10.211

$7.139

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Avnet

USA . 2,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$4.287

10k+ parts

$4.104

2,500

-

-

$4.287

$4.104

Verical

USA . 766 parts In-Stock

1+ parts

-

100+ parts

$6.341

1k+ parts

$5.470

10k+ parts

-

766

-

$6.341

$5.470

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Rochester

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$4.620

1k+ parts

$4.130

10k+ parts

$3.890

90

-

$4.620

$4.130

$3.890

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 68 parts In-Stock

1+ parts

$6.014

100+ parts

-

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68

$6.014

-

-

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Nova Conductors

Japan . 61 parts In-Stock

1+ parts

$6.437

100+ parts

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61

$6.437

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IBS Electronics

USA . 8,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$7.181

10k+ parts

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8,500

-

-

$7.181

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Vyrian

USA . 1,560 parts In-Stock

1+ parts

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1,560

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PC Components Company LLC

USA . 150 parts In-Stock

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150

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Bristol Electronics

USA . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,100 parts In-Stock

1+ parts

$3.870

100+ parts

-

1k+ parts

-

10k+ parts

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1,100

$3.870

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-

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Semicontronic

India . 1,225 parts In-Stock

1+ parts

$4.300

100+ parts

$4.192

1k+ parts

$4.171

10k+ parts

-

1,225

$4.300

$4.192

$4.171

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Corphita

USA . 341 parts In-Stock

1+ parts

$5.697

100+ parts

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341

$5.697

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Modulus Dynamics

Lithuania . 527 parts In-Stock

1+ parts

$5.908

100+ parts

$5.672

1k+ parts

$5.435

10k+ parts

-

527

$5.908

$5.672

$5.435

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Corohmni

South Africa . 138 parts In-Stock

1+ parts

$5.908

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-

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138

$5.908

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Advanced Electronics

New Zealand . 38 parts In-Stock

1+ parts

$6.436

100+ parts

$5.921

1k+ parts

$5.549

10k+ parts

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38

$6.436

$5.921

$5.549

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Continental Prestige Electronics

USA . 6,829 parts In-Stock

1+ parts

$6.437

100+ parts

-

1k+ parts

-

10k+ parts

$6.308

6,829

$6.437

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-

$6.308

Component Stockers USA

USA . 5,649 parts In-Stock

1+ parts

$7.120

100+ parts

$4.810

1k+ parts

$4.200

10k+ parts

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5,649

$7.120

$4.810

$4.200

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Andel Nordic

Denmark . 724 parts In-Stock

1+ parts

$7.257

100+ parts

-

1k+ parts

$6.966

10k+ parts

$6.966

724

$7.257

-

$6.966

$6.966

Aztec Data Supply Inc.

USA . 37,632 parts In-Stock

1+ parts

$10.999

100+ parts

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37,632

$10.999

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Argo Parts USA

USA . 4,429 parts In-Stock

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4,429

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Robosynatics

Brazil . 4,065 parts In-Stock

1+ parts

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100+ parts

$5.790

1k+ parts

$5.672

10k+ parts

$5.672

4,065

-

$5.790

$5.672

$5.672

Lucentia Tech

USA . 4,065 parts In-Stock

1+ parts

-

100+ parts

$5.790

1k+ parts

$5.672

10k+ parts

$5.672

4,065

-

$5.790

$5.672

$5.672

Infinite Electronics LLP (Excess)

. 1,008 parts In-Stock

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1,008

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$6.308

1k+ parts

$6.115

10k+ parts

$5.986

100

-

$6.308

$6.115

$5.986

Perfect Parts

USA . 6 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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6

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Overview

Elevate your telecommunications projects with the CYBT-343026-01 by Infineon Technologies. Known for their top-notch quality and innovative solutions, Infineon delivers a reliable product that exceeds expectations. This telecom interface IC offers seamless integration, compact design, and wide temperature range suitability, making it ideal for various applications. Stay ahead of the game with the CYBT-343026-01 and experience unparalleled performance and value like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and efficient PCB assembly, saving time and reducing overall production costs.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact and space-saving design, ideal for applications with limited space.

No. of Terminals: 24

The 24 terminals offer enough connectivity options for versatile integration within telecom interfaces.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product ensures reliable performance in a variety of environments.

Minimum Operating Temperature: -30 °C

The wide temperature range allows for operation in extreme conditions without compromising functionality.

Maximum Seated Height: 1.95 mm

Low seated height enables a slim profile design, making it suitable for compact electronic devices.

Width: 12 mm

Narrow width contributes to space efficiency and easy integration into electronic systems.

Length: 15.5 mm

The moderate length provides a good balance between functionality and space-saving design.

Terminal Form: NO LEAD

No-lead terminals offer improved reliability and mechanical strength compared to traditional leaded components.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, ensuring optimized performance in communication systems.

Terminal Pitch: 1.22 mm

The fine terminal pitch allows for high-density packaging, enabling more functionalities in a compact form factor.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates good resistance to moisture, enhancing the reliability and longevity of the product.

Technical Specifications

Other Function Telecom Interface ICs CYBT-343026-01 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-XXMA-N24

Length:

15.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

1.95 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.22 mm

Terminal Position:

UNSPECIFIED

Width:

12 mm

Trade Compliance

CYBT-343026-01 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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