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SA602AD/01,118

NXP Semiconductors

SA602AD/01,118 by NXP Semiconductors

SA602AD/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features nickel palladium gold silver terminal finish and 3V nominal voltage.

Median Price

$2.743

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.283

100+ parts

-

1k+ parts

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100

$3.283

-

-

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Vyrian

USA . 7,836 parts In-Stock

1+ parts

-

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-

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7,836

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Digiode

USA . 1,913 parts In-Stock

1+ parts

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1,913

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Anansix

USA . 1,387 parts In-Stock

1+ parts

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1,387

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Sensible Micro Corp

USA . 54 parts In-Stock

1+ parts

-

100+ parts

$2.204

1k+ parts

$2.048

10k+ parts

-

54

-

$2.204

$2.048

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,676 parts In-Stock

1+ parts

$2.260

100+ parts

$1.470

1k+ parts

$0.989

10k+ parts

-

1,676

$2.260

$1.470

$0.989

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Argo Parts USA

USA . 2,789 parts In-Stock

1+ parts

$3.283

100+ parts

-

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2,789

$3.283

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Aztec Data Supply Inc.

USA . 3,270 parts In-Stock

1+ parts

$8.820

100+ parts

-

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3,270

$8.820

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Corohmni

South Africa . 1,366 parts In-Stock

1+ parts

$14.667

100+ parts

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1,366

$14.667

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AZTECH Wire

Italy . 812 parts In-Stock

1+ parts

$18.828

100+ parts

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812

$18.828

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Ampacity Inc.

Singapore . 800 parts In-Stock

1+ parts

$296.000

100+ parts

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800

$296.000

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Semicontronic

India . 924 parts In-Stock

1+ parts

$358.000

100+ parts

$349.050

1k+ parts

$347.260

10k+ parts

-

924

$358.000

$349.050

$347.260

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One Stop Electronics

USA . 700 parts In-Stock

1+ parts

$760.000

100+ parts

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700

$760.000

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Lixinc

USA . 13,544 parts In-Stock

1+ parts

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13,544

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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10,000

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Corphita

USA . 4,829 parts In-Stock

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4,829

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Robosynatics

Brazil . 3,653 parts In-Stock

1+ parts

-

100+ parts

$10.964

1k+ parts

$10.740

10k+ parts

$10.740

3,653

-

$10.964

$10.740

$10.740

Lucentia Tech

USA . 3,653 parts In-Stock

1+ parts

-

100+ parts

$10.964

1k+ parts

$10.740

10k+ parts

$10.740

3,653

-

$10.964

$10.740

$10.740

UNI Independent Distributors

Spain . 2,698 parts In-Stock

1+ parts

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2,698

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Perfect Parts

USA . 2,691 parts In-Stock

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2,691

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Overview

Enhance your telecom devices with the SA602AD/01,118 by NXP Semiconductors. This top-quality telecom interface IC offers unparalleled performance and reliability, thanks to its advanced design and premium materials. Perfect for a wide range of applications, this product delivers exceptional value to customers looking for cutting-edge technology in a compact package. Experience seamless integration and enhanced functionality with the SA602AD/01,118 - the ultimate choice for telecom circuit solutions.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Provides durability and protection for the integrated circuit, ensuring a longer lifespan.

Surface Mount - YES

Allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Package Shape - RECTANGULAR

Facilitates uniform and compact PCB design, optimizing space utilization.

No. of Terminals - 20

Offers a sufficient number of connection points for versatile integration with other components in the telecom system.

Maximum Operating Temperature - 85 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature - -40 °C

Maintains functionality in cold conditions, making it suitable for a wide range of operating environments.

Terminal Finish - NICKEL PALLADIUM GOLD SILVER

Provides excellent conductivity and corrosion resistance for stable signal transmission.

Terminal Position - DUAL

Allows for multiple connection options, increasing flexibility in PCB layout.

Maximum Seated Height - 1.5 mm

Enables low-profile and compact device design, ideal for space-constrained applications.

Width - 4.4 mm

Compact size allows for efficient use of PCB real estate and easier integration into telecom equipment.

Peak Reflow Temperature - 260 °C

Withstands high-temperature manufacturing processes, ensuring reliable solder joints.

Temperature Grade - INDUSTRIAL

Suitable for use in industrial settings with varying temperature and environmental conditions.

Nominal Supply Voltage - 3 V

Compatible with standard voltage levels in telecom systems, simplifying integration.

Terminal Pitch - 0.65 mm

Fine pitch allows for high-density mounting, saving space on the PCB.

Technical Specifications

Other Function Telecom Interface ICs SA602AD/01,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SA602AD/01,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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