Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SA602AD/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features nickel palladium gold silver terminal finish and 3V nominal voltage.
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$8.820
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$14.667
AZTECH Wire
$18.828
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$296.000
Semicontronic
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One Stop Electronics
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Lucentia Tech
UNI Independent Distributors
Perfect Parts
Provides durability and protection for the integrated circuit, ensuring a longer lifespan.
Allows for easy and convenient installation on PCBs, saving space and reducing assembly time.
Facilitates uniform and compact PCB design, optimizing space utilization.
Offers a sufficient number of connection points for versatile integration with other components in the telecom system.
Ensures reliable performance even in high-temperature environments.
Maintains functionality in cold conditions, making it suitable for a wide range of operating environments.
Provides excellent conductivity and corrosion resistance for stable signal transmission.
Allows for multiple connection options, increasing flexibility in PCB layout.
Enables low-profile and compact device design, ideal for space-constrained applications.
Compact size allows for efficient use of PCB real estate and easier integration into telecom equipment.
Withstands high-temperature manufacturing processes, ensuring reliable solder joints.
Suitable for use in industrial settings with varying temperature and environmental conditions.
Compatible with standard voltage levels in telecom systems, simplifying integration.
Fine pitch allows for high-density mounting, saving space on the PCB.
Other Function Telecom Interface ICs SA602AD/01,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
SA602AD/01,118 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - PCF2119AU/SA6x obs 18/Aug/2022
PCN Assembly/Origin - Transf RC3 Line ASMC from 125mm to 150mm 18/Dec/2015
PCN Packaging - All Dev Label Update 15/Dec/2020 Lighter Packing Reels 30/Mar/2014
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
ULN2803ADWR
Texas Instruments
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
LL4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
BAV99
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
M24308/2-1F
Defense Logistics Agency
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Type: CABLE AND PANEL; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Empty Shell: NO;
NE555D
STMicroelectronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N2222A
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
1552200253
Molex
WIRE AND CABLE;
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
2N7002
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
SS14
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDD5614P
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
ADL5350ACPZ-R7
Analog Devices
ADL5350ACPZ-R7 by Analog Devices is a telecom IC with 8 terminals, operating from -40 to 85°C. It has a small outline package style, matte tin finish, and no lead terminal form. Ideal for telecom circuits, it operates at 3V with a peak reflow temp of 260°C.
CYBLE-222014-01
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 22; Package Shape: SQUARE; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
XB3-24Z8PS-J
Digi International
The Digi International XB3-24Z8PS-J is a telecom IC with 37 terminals, suitable for industrial applications. It operates b/w -40°C to 85°C and comes in a surface-mount rectangular package. This IC is designed for telecom circuits, offering reliable performance in various communication systems.
SIM7070G
Simcom Wireless Solutions
SIM7070G by Simcom Wireless Solutions is a telecom IC with 1.119 Mbps data rate, suitable for industrial use. It operates b/w -40 to 85°C, has 68 terminals in a square package shape, and is surface mountable.
ODIN-W260-00B
U-blox Ag
TELECOM CIRCUIT;
BG96MATEA-128-SGN
Quectel Wireless Solutions
BG96MATEA-128-SGN by Quectel is a surface mount telecom IC with 102 terminals. It operates at temperatures ranging from -35 to 75 °C and has a data rate of 0.375 Mbps. This IC is commonly used in applications requiring reliable and high-speed communication.
MD0101K6-G
Supertex
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 18; Package Code: HVSON; Package Shape: SQUARE; JESD-609 Code: e3;
ADRV9009BBCZ-REEL
ADRV9009BBCZ-REEL by Analog Devices is a telecom IC with 196 terminals in a grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features low profile and fine pitch design for industrial applications.
MAX5980GTJ+
MAX5980GTJ+ by Analog Devices is a CMOS telecom interface IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use. With matte tin finish and very thin profile, it's ideal for telecom circuit applications.
BQ51013BRHLT
BQ51013BRHLT by Texas Instruments is a Telecom IC with 20 terminals, operating b/w -40 to 125°C. It has a supply voltage of 5V and data rate of 0.002 Mbps, suitable for automotive applications due to its nickel/palladium/gold terminal finish. The chip carrier package style with very thin profile makes it ideal for surface mount designs.
NRF52833-QIAA-R
Nordic Semiconductor Asa
NRF52833-QIAA-R by Nordic Semiconductor Asa is a telecom IC with 2 Mbps data rate. It operates in industrial temperature range (-40 to 105 °C) and has 73 terminals in a square chip carrier package. Ideal for telecom circuit applications, it is surface mountable and features quad terminal position.
MCP2120-I/SL
Microchip Technology
MCP2120-I/SL by Microchip: Telecom IC with 14 terminals, 3/5V supply, CMOS tech. Ideal for telecom circuits, operates in -40 to 85°C range. Small outline package, matte tin finish, TS16949 screening level.
NEO-M8M-0
NEO-M8M-0 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. Its package style is MICROELECTRONIC ASSEMBLY, suitable for industrial applications. AEC-Q100 and TS 16949 screening levels ensure high quality in automotive and telecom sectors.
PN7160B1HN/C100Y
NXP Semiconductors
PN7160B1HN/C100Y by NXP Semiconductors is a telecom IC with 40 terminals in a square chip carrier package. Operating b/w -25°C to 85°C, it has a data rate of 0.848 Mbps and nominal voltage of 1.8V. Ideal for telecom circuits, this IC is surface mountable and has a max seated height of 1mm.
TM266DVA1
Pulse Electronics
TM266DVA1 by Pulse Electronics is a telecom IC with 28 terminals, operating at -55 to 125°C. It features a 5V supply voltage and GULL WING terminals in a small outline package. Ideal for military-grade applications requiring hybrid technology and high reliability in telecommunications circuits.
CC2640R2FRSMT
CC2640R2FRSMT by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Suitable for telecom circuits, it has a terminal pitch of 0.4mm and is designed for industrial temperature grades.
MIA-M10C-00B
GNSS Module;
CC2564BYFVR-XI
CC2564BYFVR-XI by Texas Instruments is a 54-terminal IC with a package style of GRID ARRAY. It operates at -40 to 85°C, has a data rate of 4 Mbps, and requires a nominal voltage of 3.6 V. Ideal for telecom circuits, this IC is surface mountable and features TIN SILVER COPPER terminal finish.
ODIN-W260-06B
Other Telecom ICs;
RN4871-V/RM140
RN4871-V/RM140 by Microchip Technology is a surface mount telecom IC with 16 terminals. It operates at temperatures ranging from -20 to 70 °C and has a data rate of 0.01 Mbps. It is commonly used in telecom circuits for various applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
SA602AD/01,112
SA602AD/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating from -40 to 85°C, it has a supply voltage of 3V and terminal pitch of 0.65mm. Ideal for telecom circuits, this IC is surface mountable and features nickel/palladium/gold/silver terminal finish.
SA606DK/01,118
SA606DK/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, with terminal finish of nickel palladium gold. Ideal for telecom circuits requiring nominal voltage of 3V and industrial temperature grade.
SA606DK/01,112
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
SA602AN
Philips Components
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIP; Terminal Pitch: 2.54 mm; Minimum Operating Temperature: -40 Cel; Maximum Seated Height: 4.2 mm;
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SA606DK/01
SA606DK/01 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, peak reflow temp of 260°C. Ideal for telecom circuits requiring nominal voltage of 3V, featuring gull wing terminal form and shrink pitch package style.
SA602AD/01
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SA602AD
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm; Nominal Supply Voltage: 6 V;
SA602AD,602
SA602AD-T
SA606DK,118
SA606DK
SA606DK,112
SA606D/01,112
SA602AD/N,118
SA606D/01,118
SA606D/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature ranges from -40 to 85°C. It features nickel palladium gold terminal finish and is ideal for telecom circuit applications.
SA606D,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
SA606D,602
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