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SA602AD/01

NXP Semiconductors

SA602AD/01 by NXP Semiconductors

SA602AD/01 by NXP Semiconductors is an 8-terminal telecom interface IC in a small outline package. With a supply voltage of 6V, it operates b/w -40°C to 85°C. Featuring gull wing terminals and nickel palladium gold silver finish, it's ideal for telecom circuit applications.

Median Price

$1.222

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Nova Conductors

Japan . 59 parts In-Stock

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Chip Stock

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Digiode

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Vyrian

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Anansix

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Pegasus Components GmbH

Germany . 426 parts In-Stock

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NexGen Digital

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Argo Parts USA

USA . 2,558 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$1.161

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$1.136

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Corohmni

South Africa . 256 parts In-Stock

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$7.058

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Aztec Data Supply Inc.

USA . 5,880 parts In-Stock

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AZTECH Wire

Italy . 793 parts In-Stock

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One Stop Electronics

USA . 1,484 parts In-Stock

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Ampacity Inc.

Singapore . 424 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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UNI Independent Distributors

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Corphita

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Futuretech Components

Singapore . 1,955 parts In-Stock

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Kepictronics

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Overview

Elevate your telecom interface with the SA602AD/01 from NXP Semiconductors. Designed with precision and reliability in mind, this small outline IC offers unparalleled performance for a wide range of applications. With a temperature grade suitable for industrial use, dual terminal positions, and a nominal supply voltage of 6V, this Telecom Circuit type IC provides seamless connectivity and functionality. Trust in NXP Semiconductors to deliver quality products that exceed expectations. Experience the difference with the SA602AD/01.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and lightweight construction, making it ideal for telecom applications.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on PCBs.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor for easy integration into various telecom devices.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options for telecom interfaces.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand industrial conditions without overheating.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The combination of terminal finishes ensures reliable and consistent electrical connections.

Width: 3.9 mm

Compact width allows for efficient use of PCB real estate, especially in space-constrained telecom applications.

Nominal Supply Voltage: 6 V

Operates on a common nominal supply voltage, making it compatible with various power sources in telecom systems.

Technical Specifications

Other Function Telecom Interface ICs SA602AD/01 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SA602AD/01 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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