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SA606DK/01

NXP Semiconductors

SA606DK/01 by NXP Semiconductors

SA606DK/01 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, peak reflow temp of 260°C. Ideal for telecom circuits requiring nominal voltage of 3V, featuring gull wing terminal form and shrink pitch package style.

Median Price

$3.328

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$3.328

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10

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Chip Stock

USA . 6,500 parts In-Stock

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Digiode

USA . 4,657 parts In-Stock

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Vyrian

USA . 353 parts In-Stock

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Anansix

USA . 298 parts In-Stock

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ComSIT Distribution GmbH

Germany . 11 parts In-Stock

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ComSIT USA

USA . 11 parts In-Stock

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Distributors (Availability)

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Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

$3.328

100+ parts

$3.162

1k+ parts

$3.004

10k+ parts

$2.962

200

$3.328

$3.162

$3.004

$2.962

Argo Parts USA

USA . 3,732 parts In-Stock

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$3.328

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Continental Prestige Electronics

USA . 2,903 parts In-Stock

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$3.328

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$3.261

2,903

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$3.261

Advanced Electronics

New Zealand . 300 parts In-Stock

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$3.395

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$3.395

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$3.395

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$3.395

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Corohmni

South Africa . 646 parts In-Stock

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$6.924

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Aztec Data Supply Inc.

USA . 100 parts In-Stock

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$9.860

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AZTECH Wire

Italy . 499 parts In-Stock

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$17.852

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One Stop Electronics

USA . 384 parts In-Stock

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$389.000

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Ampacity Inc.

Singapore . 1,137 parts In-Stock

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$460.000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 2,852 parts In-Stock

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UNI Independent Distributors

Spain . 1,411 parts In-Stock

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Lixinc

USA . 1,036 parts In-Stock

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Perfect Parts

USA . 542 parts In-Stock

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542

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Overview

Unlock the power of seamless communication with the SA606DK/01 from NXP Semiconductors. This cutting-edge telecom interface IC offers unrivaled quality and performance, making it the perfect choice for a wide range of applications. With a compact design and durable construction, this product delivers exceptional value to customers looking for reliable connectivity solutions. Experience the benefits of superior technology and innovation with the SA606DK/01 - your gateway to efficient and effective communication.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and reliability, making it a cost-effective choice for telecom applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, ideal for space-constrained applications in the telecom industry.

No. of Terminals: 20

With 20 terminals, this IC can accommodate a variety of connections, increasing its versatility for different telecom interface requirements.

Package Style: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This package style offers a space-saving solution with a low profile design and shrink pitch, making it suitable for compact telecom devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions, increasing the product's longevity.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of temperatures, enhancing the product's flexibility in various environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity and corrosion resistance, ensuring reliable connections for telecom applications.

Terminal Position: DUAL

The dual terminal position offers additional flexibility for connecting and integrating the IC into telecom systems, making it a versatile choice.

Maximum Seated Height: 1.5 mm

The low maximum seated height allows for a compact and space-efficient design, ideal for slim telecom devices.

Width: 4.4 mm

The narrow width of 4.4 mm enables easy integration into tight spaces or densely packed PCB layouts, making it a convenient choice for telecom interfaces.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this IC offers quick and efficient soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure and reliable solder joints, contributing to the overall durability of the product.

Length: 6.5 mm

The length of 6.5 mm provides a balanced form factor, allowing for easy integration into various telecom devices without compromising on performance.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures the IC can withstand rugged operating conditions, making it a reliable choice for telecom applications.

Terminal Form: GULL WING

The gull wing terminal form offers secure connections and easy assembly onto PCBs, enhancing the reliability and longevity of the product.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this IC is optimized for efficient communication and data transfer in telecommunications systems.

Nominal Supply Voltage: 3 V

The 3V supply voltage is commonly used in telecom applications, ensuring compatibility and efficient operation within telecom systems.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this IC enables high-density mounting, making it suitable for compact and space-saving telecom designs.

Technical Specifications

Other Function Telecom Interface ICs SA606DK/01 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SA606DK/01 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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