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SA606DK/01,112

NXP Semiconductors

SA606DK/01,112 by NXP Semiconductors

SA606DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it features nickel/palladium/gold terminal finish and Gull Wing form factor.

Median Price

$3.470

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 97 parts In-Stock

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$3.470

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Vyrian

USA . 8,785 parts In-Stock

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Digiode

USA . 4,284 parts In-Stock

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Anansix

USA . 2,204 parts In-Stock

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Inventory MP

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A2Z Electronics, Inc.

USA . 5 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,283 parts In-Stock

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$3.470

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$3.401

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Argo Parts USA

USA . 3,178 parts In-Stock

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$3.470

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Netroflash

USA . 50 parts In-Stock

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$3.470

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$3.297

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$3.227

50

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$3.227

Aztec Data Supply Inc.

USA . 4,859 parts In-Stock

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$11.610

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AZTECH Wire

Italy . 777 parts In-Stock

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$13.449

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Advanced Electronics

New Zealand . 138 parts In-Stock

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$15.492

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$14.098

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$12.703

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Semicontronic

India . 2,165 parts In-Stock

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$78.000

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$76.050

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$75.660

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One Stop Electronics

USA . 1,359 parts In-Stock

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$699.000

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Ampacity Inc.

Singapore . 1,562 parts In-Stock

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$818.000

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UNI Independent Distributors

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Corphita

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Perfect Parts

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Corohmni

South Africa . 749 parts In-Stock

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Overview

Unleash the power of seamless telecom connectivity with the SA606DK/01,112 by NXP Semiconductors. Crafted with precision and expertise, this innovative product offers unmatched quality and reliability. Whether you are in need of crystal-clear voice calls or lightning-fast data transfer, this versatile telecom interface IC has got you covered. Embrace the future of communication with the SA606DK/01,112 and experience unparalleled performance and efficiency like never before. Elevate your projects and stay ahead of the curve with this game-changing solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the internal components of the telecom interface IC, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during manufacturing processes.

Package Shape: RECTANGULAR

Rectangular shape offers compatibility with standard PCB layouts, making integration into existing designs straightforward.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the telecom interface IC can perform effectively in various environmental conditions without risk of overheating.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V is commonly used in telecom applications, ensuring compatibility with existing systems and power sources.

Technical Specifications

Other Function Telecom Interface ICs SA606DK/01,112 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SA606DK/01,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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