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SA606DK/01,118

NXP Semiconductors

SA606DK/01,118 by NXP Semiconductors

SA606DK/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, with terminal finish of nickel palladium gold. Ideal for telecom circuits requiring nominal voltage of 3V and industrial temperature grade.

Median Price

$8.627

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$8.627

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100

$8.627

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Vyrian

USA . 3,522 parts In-Stock

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3,522

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Digiode

USA . 2,078 parts In-Stock

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Anansix

USA . 1,819 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 611 parts In-Stock

1+ parts

$6.580

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$6.580

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Continental Prestige Electronics

USA . 2,332 parts In-Stock

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$8.627

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$8.454

2,332

$8.627

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$8.454

Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

$8.627

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$8.196

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$7.678

50

$8.627

$8.196

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$7.678

Corohmni

South Africa . 100 parts In-Stock

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$12.703

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AZTECH Wire

Italy . 526 parts In-Stock

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$14.227

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Modulus Dynamics

Lithuania . 4,133 parts In-Stock

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$17.702

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$17.702

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$17.702

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$17.702

$17.702

$17.702

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$19.595

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$17.831

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$16.068

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$19.595

$17.831

$16.068

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Semicontronic

India . 578 parts In-Stock

1+ parts

$34.000

100+ parts

$33.150

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$32.980

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578

$34.000

$33.150

$32.980

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Ampacity Inc.

Singapore . 1,004 parts In-Stock

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$141.000

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$141.000

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One Stop Electronics

USA . 913 parts In-Stock

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$594.000

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Lixinc

USA . 13,771 parts In-Stock

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Argo Parts USA

USA . 4,200 parts In-Stock

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Corphita

USA . 3,868 parts In-Stock

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UNI Independent Distributors

Spain . 3,169 parts In-Stock

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Overview

Experience seamless connectivity with the SA606DK/01,118 by NXP Semiconductors. This high-quality telecom interface IC offers unparalleled performance and reliability for a wide range of applications. With its compact design and advanced features, this product is perfect for enhancing communication systems in industrial settings. Trust in NXP Semiconductors' expertise in semiconductor technology to deliver a product that exceeds your expectations. Upgrade your telecom infrastructure today with the SA606DK/01,118 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides a lightweight yet durable construction for the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and costs during production.

Package Shape: RECTANGULAR

The rectangular package shape helps in efficient PCB layout and space utilization, making it a convenient choice for designs with limited space.

No. of Terminals: 20

With a high number of terminals, this IC provides flexibility in interfacing with other components and peripherals, enhancing its functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the IC to function effectively even in extreme cold environments, ensuring consistent performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish enhances the conductivity and reliability of the connections, ensuring stable performance over time.

Maximum Seated Height: 1.5 mm

The low seated height of the IC enables a compact and slim profile, making it a good choice for space-constrained applications.

Width: 4.4 mm

The narrow width of the IC allows for efficient PCB layout and space utilization, making it suitable for compact designs.

Maximum Time At Peak Reflow Temperature (s): 30

The short peak reflow time ensures quick and reliable soldering during assembly, contributing to the overall efficiency of the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability enables reliable soldering without compromising the integrity of the IC, ensuring a robust connection.

Length: 6.5 mm

The compact length of the IC contributes to its overall small form factor, making it a suitable choice for space-constrained designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade specification ensures that the IC can withstand harsh environmental conditions typically encountered in industrial settings.

Terminal Form: GULL WING

The gull wing terminal form provides a reliable and secure connection during PCB assembly, reducing the risk of connection failure.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom applications, this IC offers optimized performance and compatibility in telecommunications systems, making it a highly suitable choice for such applications.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage ensures compatibility with common power sources in various electronic systems, simplifying integration into existing designs.

Terminal Pitch: 0.65 mm

The narrow terminal pitch allows for high-density packaging and efficient use of PCB space, making it an ideal choice for compact and space-saving designs.

Technical Specifications

Other Function Telecom Interface ICs SA606DK/01,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SA606DK/01,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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