Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SA606DK/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, with terminal finish of nickel palladium gold. Ideal for telecom circuits requiring nominal voltage of 3V and industrial temperature grade.
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The use of plastic/epoxy as the package body material provides a lightweight yet durable construction for the IC, making it suitable for various applications.
Surface mount capability allows for easy and efficient PCB assembly, saving time and costs during production.
The rectangular package shape helps in efficient PCB layout and space utilization, making it a convenient choice for designs with limited space.
With a high number of terminals, this IC provides flexibility in interfacing with other components and peripherals, enhancing its functionality.
The high maximum operating temperature ensures reliable performance in various environmental conditions, making it suitable for industrial applications.
The low minimum operating temperature range allows the IC to function effectively even in extreme cold environments, ensuring consistent performance.
The use of nickel palladium gold terminal finish enhances the conductivity and reliability of the connections, ensuring stable performance over time.
The low seated height of the IC enables a compact and slim profile, making it a good choice for space-constrained applications.
The narrow width of the IC allows for efficient PCB layout and space utilization, making it suitable for compact designs.
The short peak reflow time ensures quick and reliable soldering during assembly, contributing to the overall efficiency of the manufacturing process.
The high peak reflow temperature capability enables reliable soldering without compromising the integrity of the IC, ensuring a robust connection.
The compact length of the IC contributes to its overall small form factor, making it a suitable choice for space-constrained designs.
The industrial temperature grade specification ensures that the IC can withstand harsh environmental conditions typically encountered in industrial settings.
The gull wing terminal form provides a reliable and secure connection during PCB assembly, reducing the risk of connection failure.
Being specifically designed for telecom applications, this IC offers optimized performance and compatibility in telecommunications systems, making it a highly suitable choice for such applications.
The 3V nominal supply voltage ensures compatibility with common power sources in various electronic systems, simplifying integration into existing designs.
The narrow terminal pitch allows for high-density packaging and efficient use of PCB space, making it an ideal choice for compact and space-saving designs.
Other Function Telecom Interface ICs SA606DK/01,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
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Maximum Time At Peak Reflow Temperature (s):
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SA606DK/01,118 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - PCF2119AU/SA6x obs 18/Aug/2022
PCN Assembly/Origin - Transf RC3 Line ASMC from 125mm to 150mm 18/Dec/2015
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N2222A
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LIS2DH12TR
STMicroelectronics
LIS2DH12TR by STMicroelectronics is a 3-axis accelerometer with digital voltage output. It operates b/w -40 to 85°C, with supply voltage range of 1.71-3.6V. Ideal for applications requiring precise motion sensing in compact spaces like wearables and IoT devices.
1N4148
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
MURS160T3G
Onsemi
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
LM7805CT/NOPB
Texas Instruments
LM7805CT/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a package style of flange mount, and offers low line/load regulation making it ideal for various electronic applications requiring stable power supply.
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
SMBJ18CA
Continental Device India
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Rfe International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Shenzhen Yixinsemi Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Taiwan Semiconductor
BAT54C-7-F
Diodes Incorporated
BAT54C-7-F by Diodes Inc. is a Schottky rectifier diode with common cathode, 2 elements, and max forward voltage of 0.24V. Ideal for applications requiring fast reverse recovery time of 0.005 us, such as in small outline packages for surface mount technology at temperatures ranging from -65 to 150°C.
Shenzhen Socay Electronics
1N4148WT
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
LM555CM by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V and max operating temperature of 70°C. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveform outputs. With surface mount capability and low supply current of 15mA, it is ideal for commercial-grade electronic circuits.
FDC5614P
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BGT24MR2E6327XUMA1
Infineon Technologies
BGT24MR2E6327XUMA1 by Infineon is a Telecom IC with 32 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 105°C, suitable for industrial use. It operates at 3.3V and features a thin profile design for telecom circuit applications.
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
HMC980LP4ETR
Hittite Microwave
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
L76L-M33
Quectel Wireless Solutions
Quectel Wireless Solutions' L76L-M33 is a telecom IC with 18 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and is surface-mountable in industrial applications. With a compact size of 9.7mm x 10.1mm, it's ideal for telecom circuit integration requiring low power consumption.
CC2640R2FRHBR
CC2640R2FRHBR by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it features nickel palladium gold terminal finish and very thin profile packaging.
ISP1507-AC-ST
Insight Sip
ISP1507-AC-ST by Insight Sip is a telecom IC with 3V supply voltage, 2 Mbps data rate, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring high-speed communication in compact form factor MICROELECTRONIC ASSEMBLY package.
MAX-M8C-0
U-blox Ag
MAX-M8C-0 by U-blox Ag is a GNSS module with 18 terminals and a rectangular package shape. It operates in temperatures ranging from -40 to 85 °C, making it suitable for industrial applications. With a compact size of 9.7mm width and 10.1mm length, it is ideal for space-constrained projects.
LM2893MX
National Semiconductor
LM2893MX by National Semiconductor is a telecom interface IC with 20 terminals, operating b/w -40 to 85°C. It has a supply voltage of 18V and max current draw of 79mA. Ideal for industrial applications requiring small outline packages and gull wing terminals.
BLUENRG-234N
TELECOM CIRCUIT;
TSC2000IPWG4
TSC2000IPWG4 by Texas Instruments is a Telecom Interface IC with 20 terminals, operating temperature range of -40 to 85°C. It features CMOS technology, GULL WING terminal form, and SINGLE-ENDED input type. Ideal for telecom circuits in industrial applications due to its compact size and high reliability.
EC21AFA-512-STD
Quectel Wireless Solutions EC21AFA-512-STD is a RECTANGULAR MICROELECTRONIC ASSEMBLY with -40 to 85 °C operating temp range. It features QUAD terminals, 29mm width, and 3.8V supply voltage. Ideal for INDUSTRIAL telecom applications due to its compact size and high temperature tolerance.
EVA-M8M-0
EVA-M8M-0 by U-blox Ag is a telecom IC with 43 terminals, operating at -40 to 85°C. It has a square surface mount package measuring 7x7mm and requires a nominal voltage of 3.3V. Ideal for industrial applications requiring precise telecom circuit functionality in compact designs.
ZOE-M8Q-0
ZOE-M8Q-0 by U-blox Ag is a telecom IC with 51 terminals, operating at -40 to 85°C. It features a thin profile grid array package, 0.5mm terminal pitch, and 3V supply voltage. Ideal for industrial applications requiring precise positioning and reliable connectivity in compact spaces.
AS3933-BQFT
Ams Ag
AS3933-BQFT by Ams Ag is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It has a nominal voltage of 3V and terminal pitch of 0.65mm, ideal for telecom circuit applications.
MC60ECB-04-BLE
Quectel Wireless Solutions' MC60ECB-04-BLE is a telecom IC with 68 terminals, operating b/w -35 to 75°C. It offers a data rate of 0.0856 Mbps and operates at a nominal voltage of 4V. Ideal for applications requiring low-power telecom circuitry in compact spaces.
SX1278IMLTRT
Semtech
Semtech's SX1278IMLTRT is a 28-terminal telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a square chip carrier package and matte tin finish, suitable for industrial applications requiring reliable telecom circuit interfaces in compact spaces.
TLE8457BSJXUMA1
TLE8457BSJXUMA1 by Infineon is a BICMOS technology telecom IC with 8 terminals in a small outline package. It operates at a nominal voltage of 8V and has a terminal pitch of 1.27mm. This AEC-Q100 screened IC is ideal for telecom circuit applications due to its compact size and gull wing terminal form.
LBEE5QD1ZM-572
Murata Manufacturing
LXMS33HCNG-134
Murata's LXMS33HCNG-134 is a telecom IC with small outline, very thin profile package. Operating temp range -40 to 85°C. Dual terminal position, no lead form for industrial applications in telecom interfaces.
ATECC508A-MAHDA-T
Atmel
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
SA602AD/01,112
SA602AD/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating from -40 to 85°C, it has a supply voltage of 3V and terminal pitch of 0.65mm. Ideal for telecom circuits, this IC is surface mountable and features nickel/palladium/gold/silver terminal finish.
SA602AD/01,118
SA602AD/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features nickel palladium gold silver terminal finish and 3V nominal voltage.
SA606DK/01,112
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
SA602AN
Philips Components
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIP; Terminal Pitch: 2.54 mm; Minimum Operating Temperature: -40 Cel; Maximum Seated Height: 4.2 mm;
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SA606DK/01
SA606DK/01 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, peak reflow temp of 260°C. Ideal for telecom circuits requiring nominal voltage of 3V, featuring gull wing terminal form and shrink pitch package style.
SA602AD/01
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SA602AD
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm; Nominal Supply Voltage: 6 V;
SA602AD,602
SA602AD-T
SA606DK,118
SA606DK
SA606DK,112
SA606D/01,112
SA602AD/N,118
SA606D/01,118
SA606D/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature ranges from -40 to 85°C. It features nickel palladium gold terminal finish and is ideal for telecom circuit applications.
SA606D,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
SA606D,602
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