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SN65DSI86IPAPQ1

Texas Instruments

SN65DSI86IPAPQ1 by Texas Instruments

SN65DSI86IPAPQ1 by Texas Instruments is a telecom interface IC with 64 terminals in a square package. It operates b/w -40 to 85°C, with terminal finish of NiPdAu. This IC is suitable for industrial applications requiring a nominal voltage of 1.2V and features gull wing terminal form.

Median Price

$17.650

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 31,077 parts In-Stock

1+ parts

$16.314

100+ parts

$14.251

1k+ parts

$9.828

10k+ parts

-

31,077

$16.314

$14.251

$9.828

-

Mouser Electronics

USA . 542 parts In-Stock

1+ parts

$27.000

100+ parts

$19.530

1k+ parts

-

10k+ parts

-

542

$27.000

$19.530

-

-

Rochester

USA . 15,070 parts In-Stock

1+ parts

-

100+ parts

$14.120

1k+ parts

$12.630

10k+ parts

$11.890

15,070

-

$14.120

$12.630

$11.890

DigiKey

USA . 15,070 parts In-Stock

1+ parts

-

100+ parts

$18.580

1k+ parts

-

10k+ parts

-

15,070

-

$18.580

-

-

Verical

USA . 7,962 parts In-Stock

1+ parts

-

100+ parts

$17.650

1k+ parts

$15.787

10k+ parts

$14.863

7,962

-

$17.650

$15.787

$14.863

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,716 parts In-Stock

1+ parts

$12.968

100+ parts

-

1k+ parts

-

10k+ parts

-

4,716

$12.968

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$15.250

100+ parts

-

1k+ parts

-

10k+ parts

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10

$15.250

-

-

-

Vyrian

USA . 15,092 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,092

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 643 parts In-Stock

1+ parts

$12.285

100+ parts

-

1k+ parts

-

10k+ parts

-

643

$12.285

-

-

-

Corohmni

South Africa . 504 parts In-Stock

1+ parts

$12.420

100+ parts

-

1k+ parts

-

10k+ parts

-

504

$12.420

-

-

-

Parana Technologies

USA . 1,363 parts In-Stock

1+ parts

$13.087

100+ parts

-

1k+ parts

$13.583

10k+ parts

-

1,363

$13.087

-

$13.583

-

DigiPath Technology Company

USA . 2,302 parts In-Stock

1+ parts

$14.410

100+ parts

$13.257

1k+ parts

-

10k+ parts

-

2,302

$14.410

$13.257

-

-

ChromeModa Solutions

Germany . 3,085 parts In-Stock

1+ parts

$14.704

100+ parts

$12.057

1k+ parts

-

10k+ parts

-

3,085

$14.704

$12.057

-

-

IDEA Electronic Components Group

UK . 1,614 parts In-Stock

1+ parts

$14.704

100+ parts

$13.969

1k+ parts

$13.234

10k+ parts

-

1,614

$14.704

$13.969

$13.234

-

Continental Prestige Electronics

USA . 1,417 parts In-Stock

1+ parts

$15.250

100+ parts

-

1k+ parts

-

10k+ parts

$14.945

1,417

$15.250

-

-

$14.945

Bastille Electronics

Australia . 900 parts In-Stock

1+ parts

$15.250

100+ parts

$14.488

1k+ parts

-

10k+ parts

$13.572

900

$15.250

$14.488

-

$13.572

Ampacity Inc.

Singapore . 15,251 parts In-Stock

1+ parts

$25.250

100+ parts

-

1k+ parts

-

10k+ parts

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15,251

$25.250

-

-

-

Semicontronic

India . 15,214 parts In-Stock

1+ parts

$25.250

100+ parts

$24.619

1k+ parts

$24.492

10k+ parts

-

15,214

$25.250

$24.619

$24.492

-

Metaverse IC Inc.

Canada . 9,520 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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9,520

-

-

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Argo Parts USA

USA . 3,243 parts In-Stock

1+ parts

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3,243

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QUARKTWIN TECHNOLOGY LTD

USA . 2,452 parts In-Stock

1+ parts

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2,452

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

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100+ parts

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1,500

-

-

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Computer Components Inc. - USA

USA . 112 parts In-Stock

1+ parts

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112

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-

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Kepictronics

USA . 55 parts In-Stock

1+ parts

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55

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-

-

-

Overview

Experience unparalleled quality and reliability with the SN65DSI86IPAPQ1 from Texas Instruments, a leading manufacturer in the industry. This telecom interface IC delivers exceptional performance in a wide range of applications, offering customers unmatched value and benefits. With its innovative design and top-notch features, this product is sure to exceed your expectations and enhance your projects. Trust in Texas Instruments for cutting-edge solutions that set the standard for excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and allows for cost-effective manufacturing, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology enables easy and efficient assembly, saving time and effort during production.

Package Shape: SQUARE

The square shape allows for efficient use of space on circuit boards, maximizing component density and enabling compact designs.

No. of Terminals: 64

With a high number of terminals, this product can support complex telecom interfaces and connectivity requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold conditions, increasing the product's versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides corrosion resistance and enhances the reliability of the terminals, ensuring long-term performance.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of signals and connections, optimizing signal integrity and performance.

Maximum Seated Height: 1.2 mm

The low seated height enables slim and compact designs, ideal for space-constrained applications.

Width: 10 mm

The compact width allows for easy integration into various system designs without occupying excessive space.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time minimizes thermal stress on the components during manufacturing, ensuring product reliability.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the rigors of the manufacturing process, ensuring robustness.

Length: 10 mm

The compact length makes the product suitable for applications where space is limited, offering flexibility in design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the product ideal for industrial applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and mounting, streamlining the assembly process and ensuring proper connections.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuits, this product offers specialized functionality and performance tailored to telecom applications.

Nominal Supply Voltage: 1.2 V

The low nominal supply voltage ensures compatibility with various power sources and helps reduce power consumption.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting on circuit boards, enabling compact designs and efficient use of space.

Moisture Sensitivity Level (MSL): 3

With a moderate MSL rating, the product can withstand exposure to moisture during storage and handling, ensuring long-term reliability.

Technical Specifications

Other Function Telecom Interface ICs SN65DSI86IPAPQ1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

SN65DSI86IPAPQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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