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SN65DSI83ZQER

Texas Instruments

SN65DSI83ZQER by Texas Instruments

SN65DSI83ZQER by Texas Instruments is a telecom interface IC with 64 terminals in a grid array package. It operates b/w -40 to 85°C, has a data rate of 1 Mbps, and requires a nominal voltage of 1.8V. This IC is suitable for industrial applications requiring thin profile and fine pitch components.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 23,050 parts In-Stock

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Digiode

USA . 3,970 parts In-Stock

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3,970

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Vyrian

USA . 1,972 parts In-Stock

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1,972

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Parana Technologies

USA . 1,828 parts In-Stock

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$10.878

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-

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$11.355

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1,828

$10.878

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$11.355

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ChromeModa Solutions

Germany . 5,991 parts In-Stock

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$12.222

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$10.022

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5,991

$12.222

$10.022

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IDEA Electronic Components Group

UK . 1,727 parts In-Stock

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$12.222

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$11.611

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$11.000

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1,727

$12.222

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$11.000

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Corohmni

South Africa . 434 parts In-Stock

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$14.451

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434

$14.451

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AZTECH Wire

Italy . 593 parts In-Stock

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$16.381

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593

$16.381

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Ampacity Inc.

Singapore . 1,580 parts In-Stock

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$308.000

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$308.000

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One Stop Electronics

USA . 609 parts In-Stock

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$748.000

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609

$748.000

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Semicontronic

India . 1,623 parts In-Stock

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$846.000

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$824.850

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$820.620

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$846.000

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Kepictronics

USA . 15,000 parts In-Stock

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Perfect Parts

USA . 12,491 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,215 parts In-Stock

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S.R.D Solutions

India . 6,000 parts In-Stock

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Lixinc

USA . 5,499 parts In-Stock

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Continental Prestige Electronics

USA . 4,807 parts In-Stock

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Argo Parts USA

USA . 4,214 parts In-Stock

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DigiPath Technology Company

USA . 2,252 parts In-Stock

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$11.019

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Corphita

USA . 1,636 parts In-Stock

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Advanced Electronics

New Zealand . 450 parts In-Stock

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450

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Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

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$0.481

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$0.481

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$0.481

350

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$0.481

$0.481

$0.481

Microchip USA

USA . 276 parts In-Stock

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iodParts Technologies Inc.

India . 225 parts In-Stock

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Futuretech Components

Singapore . 225 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Experience the next level of connectivity with the SN65DSI83ZQER by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability in their products. The SN65DSI83ZQER falls under the category of Other Function Telecom Interface ICs, offering a wide range of applications for various telecom circuits. With its advanced features and innovative design, this product provides unparalleled value and benefits to customers looking for high-performance solutions. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for telecommunications equipment.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high temperature environments, essential for telecom applications.

Nominal Supply Voltage: 1.8 V

Operates at a low supply voltage, reducing power consumption in telecom systems.

Data Rate: 1 Mbps

Supports high-speed data transfer, important for transmitting telecommunications signals efficiently.

Technical Specifications

Other Function Telecom Interface ICs SN65DSI83ZQER attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

SN65DSI83ZQER Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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