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SN65DSI85ZQE

Texas Instruments

SN65DSI85ZQE by Texas Instruments

SN65DSI85ZQE by Texas Instruments is a 64-terminal, industrial-grade telecom IC with a nominal voltage of 1.8V. It features a package style of grid array, very thin profile, and fine pitch, suitable for telecom circuit applications. Operating temperature ranges from -40 to 85°C, making it ideal for various industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,293 parts In-Stock

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Digiode

USA . 664 parts In-Stock

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Nova Conductors

Japan . 86 parts In-Stock

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86

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Distributors (Availability)

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AZTECH Wire

Italy . 827 parts In-Stock

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$6.518

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827

$6.518

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Corohmni

South Africa . 239 parts In-Stock

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$7.648

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239

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Parana Technologies

USA . 1,139 parts In-Stock

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$14.855

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$15.286

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$14.855

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$15.286

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DigiPath Technology Company

USA . 167 parts In-Stock

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$16.357

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167

$16.357

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ChromeModa Solutions

Germany . 6,776 parts In-Stock

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$16.691

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$13.687

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$16.691

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IDEA Electronic Components Group

UK . 375 parts In-Stock

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$16.691

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$15.856

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$15.022

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375

$16.691

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$15.022

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Ampacity Inc.

Singapore . 712 parts In-Stock

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$464.000

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712

$464.000

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One Stop Electronics

USA . 788 parts In-Stock

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$535.000

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Continental Prestige Electronics

USA . 4,018 parts In-Stock

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Argo Parts USA

USA . 3,402 parts In-Stock

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Corphita

USA . 3,079 parts In-Stock

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Bastille Electronics

Australia . 79 parts In-Stock

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Overview

Experience unparalleled quality and innovation with the SN65DSI85ZQE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge solutions for a wide range of applications. The SN65DSI85ZQE offers exceptional value, providing customers with reliable performance and superior functionality. Whether you're looking to enhance your telecommunications systems or upgrade your interface ICs, this product is designed to meet your needs and exceed your expectations. Trust Texas Instruments to deliver top-of-the-line products that drive success and innovation in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components due to its durability and resistance to heat and chemicals.

Surface Mount: YES

Surface mount components are easier to install and can provide a more compact design for the product.

Package Shape: SQUARE

The square shape allows for easier mounting and alignment within a circuit board.

No. of Terminals: 64

Having a higher number of terminals allows for more connections and functionality within the product.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style allows for a compact design with high terminal density, making it suitable for telecom applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstands high temperatures in industrial environments.

Minimum Operating Temperature: -40 °C

The product can operate in colder temperatures, making it suitable for a wide range of applications.

Terminal Position: BOTTOM

Bottom terminal position allows for easy connection and installation on the circuit board.

Maximum Seated Height: 1 mm

With a low seated height, the product can be used in slim and compact designs.

Width: 5 mm

The narrow width makes it suitable for applications where space is limited.

Length: 5 mm

The short length allows for a compact overall design of the product.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this product is suitable for harsh industrial environments.

Terminal Form: BALL

Ball terminals provide a reliable connection and are commonly used in telecom applications.

Nominal Supply Voltage: 1.8 V

With a low supply voltage, the product can operate efficiently and consume less power.

Terminal Pitch: 0.5 mm

With a fine terminal pitch, this product can accommodate a high number of terminals in a small space.

Technical Specifications

Other Function Telecom Interface ICs SN65DSI85ZQE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Trade Compliance

SN65DSI85ZQE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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