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MD0100N8-G

Microchip Technology

MD0100N8-G by Microchip Technology

MD0100N8-G by Microchip Tech is a telecom IC with 3 terminals. It operates b/w -40 to 125°C, suitable for automotive applications. The package is small outline, low profile, with matte tin finish and single terminal position.

Median Price

$1.570

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,621 parts In-Stock

1+ parts

$1.570

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-

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2,621

$1.570

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Microchip Technology

USA . 367 parts In-Stock

1+ parts

$1.570

100+ parts

$1.170

1k+ parts

$1.140

10k+ parts

$1.130

367

$1.570

$1.170

$1.140

$1.130

DigiKey

USA . 47 parts In-Stock

1+ parts

$1.570

100+ parts

$1.331

1k+ parts

-

10k+ parts

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47

$1.570

$1.331

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Newark

USA . 19,873 parts In-Stock

1+ parts

$1.620

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19,873

$1.620

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Farnell

UK . 35,509 parts In-Stock

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$1.298

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35,509

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$1.298

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Element14

Singapore . 35,509 parts In-Stock

1+ parts

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$1.238

35,509

-

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$1.238

Master Electronics

USA . 680 parts In-Stock

1+ parts

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$1.540

10k+ parts

$1.490

680

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-

$1.540

$1.490

Verical

USA . 500 parts In-Stock

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$1.867

10k+ parts

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500

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$1.867

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 17 parts In-Stock

1+ parts

$1.634

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17

$1.634

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Vyrian

USA . 16,516 parts In-Stock

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16,516

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IBS Electronics

USA . 2,330 parts In-Stock

1+ parts

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100+ parts

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$1.521

10k+ parts

$1.352

2,330

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-

$1.521

$1.352

Electro Sonic

Canada . 1,270 parts In-Stock

1+ parts

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100+ parts

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$1.230

10k+ parts

$1.070

1,270

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$1.230

$1.070

Prism Electronics

USA . 59 parts In-Stock

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59

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Distributors (Availability)

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Semicontronic

India . 14,786 parts In-Stock

1+ parts

$0.990

100+ parts

$0.965

1k+ parts

$0.960

10k+ parts

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14,786

$0.990

$0.965

$0.960

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Ampacity Inc.

Singapore . 14,543 parts In-Stock

1+ parts

$0.990

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14,543

$0.990

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Vigor

Singapore . 2,264 parts In-Stock

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$1.230

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2,264

$1.230

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Component Stockers USA

USA . 66,691 parts In-Stock

1+ parts

$1.390

100+ parts

$1.130

1k+ parts

$1.100

10k+ parts

$1.090

66,691

$1.390

$1.130

$1.100

$1.090

Argo Parts USA

USA . 2,100 parts In-Stock

1+ parts

$1.634

100+ parts

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2,100

$1.634

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Corohmni

South Africa . 528 parts In-Stock

1+ parts

$13.777

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528

$13.777

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Aztec Data Supply Inc.

USA . 103 parts In-Stock

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$13.862

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103

$13.862

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Continental Prestige Electronics

USA . 38,255 parts In-Stock

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$1.020

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38,255

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$1.020

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Kepictronics

USA . 30,840 parts In-Stock

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Lixinc

USA . 17,596 parts In-Stock

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Metaverse IC Inc.

Canada . 9,039 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,838 parts In-Stock

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Perfect Parts

USA . 4,781 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,100 parts In-Stock

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Fulton Briggs Corp.

USA . 1,640 parts In-Stock

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1,640

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Authorized Procurement Solutions

USA . 74 parts In-Stock

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74

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Overview

Enhance your telecom systems with the MD0100N8-G by Microchip Technology. Manufactured with top-quality materials and designed for reliability, this product offers seamless integration and enhanced performance in a variety of applications. With its small, low-profile design and automotive-grade temperature grade, it provides value and benefits that exceed expectations. Trust in Microchip Technology to deliver cutting-edge solutions for all your telecom interface IC needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and reliability to the product.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation of the IC, saving time and effort during assembly.

Screening Level: TS 16949

The TS 16949 screening level ensures high quality and reliability of the product, making it a dependable choice for telecom applications.

Package Shape: RECTANGULAR

The rectangular package shape offers space-efficient design, allowing for easy integration into various telecom devices.

No. of Terminals: 3

With three terminals, this IC provides simple connectivity options, making it user-friendly for telecom interface applications.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE

The small outline and low profile package style enables space-saving and efficient utilization of PCB real estate.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance ensures reliable performance even in extreme conditions, enhancing the product's longevity.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance allows the IC to function effectively in cold environments, increasing its versatility.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and conductivity, ensuring a strong and stable electrical connection.

Terminal Position: SINGLE

The single terminal position simplifies soldering and reduces assembly complexity, making it easier to work with this IC.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for compact design integration, ideal for space-constrained telecom devices.

Width: 2.445 mm

The narrow width of the IC enables efficient PCB layout and component placement, optimizing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds allows for reliable soldering and prevents overheating of the IC.

Peak Reflow Temperature °C: 260

The peak reflow temperature tolerance of 260°C ensures proper solder melting and joint formation during assembly, enhancing product reliability.

Length: 4.5 mm

The compact length of the IC contributes to space-saving design, making it suitable for telecom applications with limited space.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification confirms the IC's ability to withstand harsh operating conditions, making it a robust choice for telecom interfaces.

Terminal Form: FLAT

The flat terminal form provides easy soldering and secure connection, enhancing the overall reliability of the product.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this IC offers optimized performance and compatibility for telecom interface applications.

Terminal Pitch: 1.5 mm

The 1.5mm terminal pitch facilitates easy soldering and component alignment, ensuring a reliable connection in telecom devices.

Technical Specifications

Other Function Telecom Interface ICs MD0100N8-G attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PSSO-F3

JESD-609 Code:

e3

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-243

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

TS 16949

Maximum Seated Height:

1.6 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.5 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

40

Width:

2.445 mm

Trade Compliance

MD0100N8-G Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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