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XWL1837MODGIMOC

Texas Instruments

XWL1837MODGIMOC by Texas Instruments

XWL1837MODGIMOC by Texas Instruments is a telecom IC with 100 terminals in a grid array package. It operates b/w -40°C to 85°C, with a supply voltage of 3.7V. Ideal for telecom circuit applications due to its compact rectangular shape and surface-mount compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,268 parts In-Stock

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Digiode

USA . 4,245 parts In-Stock

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4,245

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Prism Electronics

USA . 4 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$8.022

100+ parts

$7.621

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$7.621

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3,000

$8.022

$7.621

$7.621

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AZTECH Wire

Italy . 538 parts In-Stock

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$9.821

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538

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Corohmni

South Africa . 290 parts In-Stock

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$10.010

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290

$10.010

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Parana Technologies

USA . 94 parts In-Stock

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$10.733

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$11.216

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94

$10.733

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$11.216

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ChromeModa Solutions

Germany . 4,336 parts In-Stock

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$12.060

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$9.889

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IDEA Electronic Components Group

UK . 2,020 parts In-Stock

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$12.060

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$11.457

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$10.854

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$12.060

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Semicontronic

India . 766 parts In-Stock

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$316.000

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$308.100

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$306.520

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766

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One Stop Electronics

USA . 323 parts In-Stock

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$394.000

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Ampacity Inc.

Singapore . 365 parts In-Stock

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$481.000

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365

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Continental Prestige Electronics

USA . 6,974 parts In-Stock

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Argo Parts USA

USA . 4,576 parts In-Stock

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Corphita

USA . 1,576 parts In-Stock

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DigiPath Technology Company

USA . 254 parts In-Stock

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$10.873

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254

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$10.873

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unlock the potential of your telecom applications with the XWL1837MODGIMOC by Texas Instruments. Crafted with quality and precision, this telecom interface IC offers unparalleled performance and reliability. From enhancing communication systems to optimizing network connectivity, this versatile IC caters to a wide range of applications. Elevate your projects with the value and benefits that Texas Instruments brings to the table. Experience seamless integration, superior functionality, and unmatched efficiency with the XWL1837MODGIMOC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to wear and tear, making this product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort in the manufacturing process.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and space-saving design, ideal for applications where board space is limited.

No. of Terminals: 100

Having 100 terminals provides flexibility in connecting various components, allowing for versatile functionality and connectivity.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions and operate efficiently in a wide range of temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions.

Width: 13.3 mm

Compact width of 13.3 mm enables easy integration into smaller devices or circuit board layouts, contributing to space-efficient design.

Length: 13.4 mm

Length of 13.4 mm provides a balanced form factor, suitable for various applications without compromising on functionality.

Nominal Supply Voltage: 3.7 V

Nominal supply voltage of 3.7 V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Terminal Pitch: 0.7 mm

A small terminal pitch of 0.7 mm allows for high-density mounting, enabling more connections in a limited space and enhancing overall functionality.

Technical Specifications

Other Function Telecom Interface ICs XWL1837MODGIMOC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-N100

Length:

13.4 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.7 mm

Terminal Position:

BOTTOM

Width:

13.3 mm

Trade Compliance

XWL1837MODGIMOC Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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