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XWL1801MODGAMOCR

Texas Instruments

XWL1801MODGAMOCR by Texas Instruments

XWL1801MODGAMOCR by Texas Instruments is a telecom IC with 130 terminals in a grid array package. Operating temperature ranges from -20°C to 70°C. It is used for telecom circuits with a nominal voltage of 3.7V, suitable for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,385 parts In-Stock

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4,385

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Digiode

USA . 3,086 parts In-Stock

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3,086

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 892 parts In-Stock

1+ parts

$5.420

100+ parts

-

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$6.122

10k+ parts

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892

$5.420

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$6.122

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AZTECH Wire

Italy . 570 parts In-Stock

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$5.608

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570

$5.608

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IDEA Electronic Components Group

UK . 1,359 parts In-Stock

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$6.090

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-

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$5.481

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1,359

$6.090

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$5.481

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ChromeModa Solutions

Germany . 1,312 parts In-Stock

1+ parts

$6.090

100+ parts

$4.994

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1,312

$6.090

$4.994

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One Stop Electronics

USA . 803 parts In-Stock

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$223.000

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803

$223.000

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DigiPath Technology Company

USA . 2,245 parts In-Stock

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$5.491

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2,245

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$5.491

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Corphita

USA . 175 parts In-Stock

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Overview

Experience unmatched quality and reliability with the XWL1801MODGAMOCR by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch performance and durability in all their products. This telecom interface IC is versatile and perfect for a wide range of applications. Whether you need it for telecommunications, networking, or other functions, this product delivers exceptional value and benefits. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the XWL1801MODGAMOCR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers durability and thermal stability, making the product suitable for long-term use in telecom applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact design that can easily fit into tight spaces in telecom equipment, optimizing space utilization.

No. of Terminals: 130

Having a high number of terminals allows for the connection of various components, enhancing the functionality and versatility of the product.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand high temperatures in telecom environments, ensuring reliable performance.

Minimum Operating Temperature: -20 °C

The ability to operate at as low as -20°C enables the product to function effectively in cold climates or during temperature fluctuations.

Width: 13.3 mm

Narrow width of 13.3 mm allows for efficient use of space on circuit boards, enabling dense packing of components in telecom systems.

Length: 13.4 mm

Compact length of 13.4 mm aids in creating space-efficient telecom devices, contributing to overall design flexibility and miniaturization.

Nominal Supply Voltage: 3.7 V

Stable and reliable supply voltage of 3.7 V ensures consistent operation of the telecom circuit, minimizing the risk of voltage-related issues.

Technical Specifications

Other Function Telecom Interface ICs XWL1801MODGAMOCR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B130

Length:

13.4 mm

No. of Functions:

1

No. of Terminals:

130

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

13.3 mm

Trade Compliance

XWL1801MODGAMOCR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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