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CC1120RHBT

Texas Instruments

CC1120RHBT by Texas Instruments

CC1120RHBT by Texas Instruments is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and data rate of 0.2 Mbps, suitable for telecom circuits in industrial applications. This surface-mount chip carrier package measures 5x5mm with a very thin profile, making it ideal for compact designs.

Median Price

$6.520

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 1,748 parts In-Stock

1+ parts

$3.637

100+ parts

$4.866

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1,748

$3.637

$4.866

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Mouser Electronics

USA . 2,071 parts In-Stock

1+ parts

$6.520

100+ parts

$4.200

1k+ parts

$3.830

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-

2,071

$6.520

$4.200

$3.830

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DigiKey

USA . 616 parts In-Stock

1+ parts

$6.590

100+ parts

$4.980

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616

$6.590

$4.980

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Distributors (In-Stock)

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Digiode

USA . 2,442 parts In-Stock

1+ parts

$3.455

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2,442

$3.455

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Nova Conductors

Japan . 63 parts In-Stock

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$3.509

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63

$3.509

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Chip Stock

USA . 17,820 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,206 parts In-Stock

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Vyrian

USA . 1,100 parts In-Stock

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Connect4Technologies Inc.

Canada . 233 parts In-Stock

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ComSIT Distribution GmbH

Germany . 72 parts In-Stock

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NPI Materials, Inc.

USA . 5 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,513 parts In-Stock

1+ parts

$3.090

100+ parts

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1,513

$3.090

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Semicontronic

India . 1,510 parts In-Stock

1+ parts

$3.090

100+ parts

$3.013

1k+ parts

$2.997

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1,510

$3.090

$3.013

$2.997

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Corphita

USA . 1,263 parts In-Stock

1+ parts

$3.273

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1,263

$3.273

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Continental Prestige Electronics

USA . 6,160 parts In-Stock

1+ parts

$3.509

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$3.438

6,160

$3.509

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$3.438

Argo Parts USA

USA . 4,597 parts In-Stock

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$3.509

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4,597

$3.509

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Netroflash

USA . 500 parts In-Stock

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$3.509

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$3.438

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500

$3.509

$3.438

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Corohmni

South Africa . 112 parts In-Stock

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$3.742

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112

$3.742

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$3.854

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$3.662

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$3.662

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20

$3.854

$3.662

$3.662

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Parana Technologies

USA . 1,347 parts In-Stock

1+ parts

$12.869

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$13.349

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1,347

$12.869

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$13.349

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DigiPath Technology Company

USA . 101 parts In-Stock

1+ parts

$14.171

100+ parts

$13.037

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101

$14.171

$13.037

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ChromeModa Solutions

Germany . 6,142 parts In-Stock

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$14.460

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$11.857

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$14.460

$11.857

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IDEA Electronic Components Group

UK . 2,242 parts In-Stock

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$14.460

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$13.737

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$13.014

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$14.460

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$13.014

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Perfect Parts

USA . 66,780 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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GreenTree Electronics

Israel . 1,206 parts In-Stock

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Computer Components Inc. - USA

USA . 548 parts In-Stock

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548

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Lixinc

USA . 14 parts In-Stock

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14

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Overview

Upgrade your telecom systems with the CC1120RHBT by Texas Instruments. Known for their high-quality products, Texas Instruments delivers cutting-edge solutions for all your communication needs. The CC1120RHBT is designed to provide seamless integration, reliability, and superior performance in a compact chip carrier package. Whether you're looking to enhance your wireless communication devices or develop innovative telecom solutions, this IC is the perfect choice. Trust Texas Instruments to deliver the value, benefits, and advantages you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and can withstand various environmental conditions, making this product a reliable choice for long-term use.

Surface Mount: YES

Surface mount design allows for easy installation on PCBs, saving space and making it suitable for compact electronic devices.

Power Supplies (V): 3

Operates at a standard power supply voltage of 3V, ensuring compatibility with common power sources in telecom applications.

Package Shape: SQUARE

Square package shape provides a balanced footprint and efficient use of space on the circuit board.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can perform reliably in a wide range of temperature environments.

Width: 5 mm

Compact width of 5mm enables easy integration into tight spaces, ideal for applications where size constraints are a concern.

Data Rate: 0.2 Mbps

Capable of handling data rates up to 0.2 Mbps, making it suitable for telecommunications applications that require moderate-speed data transmission.

Technical Specifications

Other Function Telecom Interface ICs CC1120RHBT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.2 Mbps

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CC1120RHBT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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