Loading...

CC1125RHMT

Texas Instruments

CC1125RHMT by Texas Instruments

The Texas Instruments CC1125RHMT is a telecom IC with 32 terminals in a square chip carrier package. Operating at -40 to 85°C, it has a supply voltage of 3V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and features nickel palladium gold finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,702 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,702

-

-

-

-

Digiode

USA . 717 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

717

-

-

-

-

Nova Conductors

Japan . 24 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24

-

-

-

-

Zilex Electronics Inc.

Canada . 15 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 460 parts In-Stock

1+ parts

$6.110

100+ parts

-

1k+ parts

-

10k+ parts

-

460

$6.110

-

-

-

Corohmni

South Africa . 221 parts In-Stock

1+ parts

$14.716

100+ parts

-

1k+ parts

-

10k+ parts

-

221

$14.716

-

-

-

Parana Technologies

USA . 1,800 parts In-Stock

1+ parts

$15.566

100+ parts

-

1k+ parts

$15.940

10k+ parts

-

1,800

$15.566

-

$15.940

-

DigiPath Technology Company

USA . 1,464 parts In-Stock

1+ parts

$17.140

100+ parts

-

1k+ parts

-

10k+ parts

-

1,464

$17.140

-

-

-

ChromeModa Solutions

Germany . 6,390 parts In-Stock

1+ parts

$17.490

100+ parts

$14.342

1k+ parts

-

10k+ parts

-

6,390

$17.490

$14.342

-

-

IDEA Electronic Components Group

UK . 792 parts In-Stock

1+ parts

$17.490

100+ parts

$16.616

1k+ parts

$15.741

10k+ parts

-

792

$17.490

$16.616

$15.741

-

One Stop Electronics

USA . 514 parts In-Stock

1+ parts

$812.000

100+ parts

-

1k+ parts

-

10k+ parts

-

514

$812.000

-

-

-

Semicontronic

India . 1,354 parts In-Stock

1+ parts

$958.000

100+ parts

$934.050

1k+ parts

$929.260

10k+ parts

-

1,354

$958.000

$934.050

$929.260

-

Ampacity Inc.

Singapore . 951 parts In-Stock

1+ parts

$984.000

100+ parts

-

1k+ parts

-

10k+ parts

-

951

$984.000

-

-

-

Corphita

USA . 3,857 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,857

-

-

-

-

Continental Prestige Electronics

USA . 2,711 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,711

-

-

-

-

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Argo Parts USA

USA . 68 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

68

-

-

-

-

Overview

Elevate your telecom interface solutions with the CC1125RHMT from Texas Instruments. Designed with quality and innovation in mind, this chip carrier IC offers unmatched performance and reliability for a wide range of applications. With a sleek square package, very thin profile, and industrial-grade temperature grade, this Telecom Circuit type IC is perfect for demanding environments. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Upgrade your projects today with the CC1125RHMT and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes this product lightweight and durable, ideal for telecom applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation onto circuit boards.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving valuable space on the PCB.

Power Supplies (V): 3

With a nominal supply voltage of 3V, this IC is suitable for low power telecom applications.

No. of Terminals: 32

The 32 terminals offer ample connections for various telecom functions.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style with heat sink/slug and thin profile ensures efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable performance in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures functionality even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and connectivity in telecom systems.

Maximum Seated Height: 0.9 mm

The maximum seated height of 0.9mm allows for a compact and slim profile in the system design.

Width: 5 mm

The 5mm width offers a space-efficient solution for telecom interface applications.

Maximum Time At Peak Reflow Temperature (s): 30

This IC can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C guarantees secure solder joints for reliable performance.

Length: 5 mm

The 5mm length contributes to the overall compact design of this telecom interface IC.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the IC can operate reliably in harsh industrial environments.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and allows for RoHS compliance.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this IC offers optimized performance for telecommunications applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is ideal for low power telecom systems.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density packaging and efficient use of space on the PCB.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this IC can withstand moderate levels of moisture exposure during storage and assembly.

Technical Specifications

Other Function Telecom Interface ICs CC1125RHMT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CC1125RHMT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19