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CC1120RHMT

Texas Instruments

CC1120RHMT by Texas Instruments

CC1120RHMT by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, this IC is surface mountable and has a low profile design for industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 2,527 parts In-Stock

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Digiode

USA . 1,431 parts In-Stock

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A&K Electronics

USA . 188 parts In-Stock

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Rotakorn

Sweden . 188 parts In-Stock

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Bristol Electronics

USA . 188 parts In-Stock

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AZTECH Wire

Italy . 664 parts In-Stock

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$5.398

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Parana Technologies

USA . 204 parts In-Stock

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$7.648

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$8.167

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DigiPath Technology Company

USA . 1,477 parts In-Stock

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$8.421

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$7.747

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ChromeModa Solutions

Germany . 3,282 parts In-Stock

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$8.593

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$7.046

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IDEA Electronic Components Group

UK . 193 parts In-Stock

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$8.593

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$8.163

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$7.734

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Native Components

USA . 462 parts In-Stock

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$745.500

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$730.590

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$723.135

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$715.680

462

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$715.680

One Stop Electronics

USA . 1,103 parts In-Stock

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Northwest PG Solutions

USA . 848 parts In-Stock

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Lixinc

USA . 17,486 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 1,735 parts In-Stock

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Futuretech Components

Singapore . 603 parts In-Stock

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Kepictronics

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Overview

Unlock seamless communication with the Texas Instruments CC1120RHMT. Designed with precision and reliability in mind, this telecom interface IC delivers superior performance in a wide range of applications. From industrial automation to smart grid systems, this product offers unparalleled value with its innovative features and high-quality construction. Trust Texas Instruments to provide you with the cutting-edge technology you need to stay connected and optimized in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for efficient and reliable PCB assembly.

Package Shape: SQUARE

Square package shape helps in optimizing space on the PCB while ensuring a secure fit.

No. of Terminals: 32

Having 32 terminals allows for extensive connectivity options and versatility in applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable performance even in demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation in a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and conductivity for long-lasting performance.

Width: 5 mm

The compact width of 5mm allows for space-efficient integration into various devices.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability during assembly.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand harsh industrial environments.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and compliant with RoHS regulations.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is common and easily accessible in many applications.

Technical Specifications

Other Function Telecom Interface ICs CC1120RHMT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CC1120RHMT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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