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BM70BLES1FC2-0B04AA

Microchip Technology

BM70BLES1FC2-0B04AA by Microchip Technology

Microchip Technology's BM70BLES1FC2-0B04AA is a telecom IC with 33 terminals, operating at -40 to 85°C. It has a data rate of 0.0086 Mbps and operates at 3V supply voltage. This rectangular package is ideal for industrial applications requiring low-power telecom circuit integration.

Median Price

$9.240

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 161 parts In-Stock

1+ parts

$5.270

100+ parts

$5.100

1k+ parts

-

10k+ parts

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161

$5.270

$5.100

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DigiKey

USA . 798 parts In-Stock

1+ parts

$9.240

100+ parts

$8.450

1k+ parts

-

10k+ parts

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798

$9.240

$8.450

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-

Mouser Electronics

USA . 50 parts In-Stock

1+ parts

$9.240

100+ parts

$8.660

1k+ parts

-

10k+ parts

-

50

$9.240

$8.660

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Element14

Singapore . 161 parts In-Stock

1+ parts

$10.730

100+ parts

$9.810

1k+ parts

-

10k+ parts

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161

$10.730

$9.810

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Adafruit Industries

USA . 88 parts In-Stock

1+ parts

$15.240

100+ parts

$14.478

1k+ parts

$14.478

10k+ parts

-

88

$15.240

$14.478

$14.478

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Master Electronics

USA . 234 parts In-Stock

1+ parts

-

100+ parts

$8.200

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234

-

$8.200

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Verical

USA . 230 parts In-Stock

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230

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$9.970

100+ parts

-

1k+ parts

-

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50

$9.970

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-

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VNN

France . 800 parts In-Stock

1+ parts

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800

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Mil-Aero Solutions, Inc.

USA . 490 parts In-Stock

1+ parts

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490

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Electro Sonic

Canada . 334 parts In-Stock

1+ parts

-

100+ parts

$8.830

1k+ parts

$8.380

10k+ parts

-

334

-

$8.830

$8.380

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IBS Electronics

USA . 234 parts In-Stock

1+ parts

-

100+ parts

$11.332

1k+ parts

$11.164

10k+ parts

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234

-

$11.332

$11.164

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Vyrian

USA . 94 parts In-Stock

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94

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Distributors (Availability)

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Semicontronic

India . 252 parts In-Stock

1+ parts

$4.480

100+ parts

$4.368

1k+ parts

$4.346

10k+ parts

-

252

$4.480

$4.368

$4.346

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Ampacity Inc.

Singapore . 138 parts In-Stock

1+ parts

$4.480

100+ parts

-

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138

$4.480

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Component Stockers USA

USA . 5,009 parts In-Stock

1+ parts

$8.900

100+ parts

$7.650

1k+ parts

$8.160

10k+ parts

-

5,009

$8.900

$7.650

$8.160

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Continental Prestige Electronics

USA . 121 parts In-Stock

1+ parts

$10.320

100+ parts

$7.490

1k+ parts

-

10k+ parts

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121

$10.320

$7.490

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Modulus Dynamics

Lithuania . 600 parts In-Stock

1+ parts

$10.767

100+ parts

$10.659

1k+ parts

$10.336

10k+ parts

-

600

$10.767

$10.659

$10.336

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Aztec Data Supply Inc.

USA . 77 parts In-Stock

1+ parts

$14.573

100+ parts

-

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77

$14.573

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Advanced Electronics

New Zealand . 88 parts In-Stock

1+ parts

$15.240

100+ parts

$14.478

1k+ parts

$14.478

10k+ parts

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88

$15.240

$14.478

$14.478

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Corohmni

South Africa . 419 parts In-Stock

1+ parts

$16.584

100+ parts

-

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419

$16.584

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RGB Technical Solutions

Ukraine . 6,128 parts In-Stock

1+ parts

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6,128

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Argo Parts USA

USA . 3,319 parts In-Stock

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3,319

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Robosynatics

Brazil . 2,377 parts In-Stock

1+ parts

-

100+ parts

$0.376

1k+ parts

$0.376

10k+ parts

$0.376

2,377

-

$0.376

$0.376

$0.376

Lucentia Tech

USA . 2,377 parts In-Stock

1+ parts

-

100+ parts

$0.376

1k+ parts

$0.376

10k+ parts

$0.376

2,377

-

$0.376

$0.376

$0.376

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

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1,000

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$9.771

1k+ parts

$9.472

10k+ parts

$9.272

500

-

$9.771

$9.472

$9.272

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

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50

-

-

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Eastek

USA . 28 parts In-Stock

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28

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Overview

Discover the innovative BM70BLES1FC2-0B04AA by Microchip Technology, setting a new standard in Other Function Telecom Interface ICs. With a sleek rectangular package design and industrial-grade temperature range, this cutting-edge product offers seamless connectivity and reliability for various applications. Elevate your projects with the unmatched quality and performance Microchip Technology is known for. Experience the value and benefits of the BM70BLES1FC2-0B04AA today and unlock endless possibilities for your telecom projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and efficient installation on circuit boards, making this product suitable for mass production.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact and space-saving design, ideal for applications with limited space constraints.

No. of Terminals: 33

With a high number of terminals, this product offers a wide range of connectivity options, increasing its versatility in telecom interfaces.

Package Style: MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style ensures high reliability and performance in demanding industrial environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh conditions and temperature fluctuations.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in extreme cold environments.

Maximum Seated Height: 2.46 mm

The compact maximum seated height makes this product suitable for applications where space is limited.

Width: 12 mm

The small width of the product allows for flexibility in designing compact and efficient circuit layouts.

Length: 22 mm

The moderate length of the product strikes a balance between space-saving design and ease of handling during installation.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in rugged industrial environments.

Terminal Form: NO LEAD

The no-lead terminal form provides improved reliability and mechanical stability in telecom applications.

Telecom IC Type: TELECOM CIRCUIT

This product is specifically designed for telecom circuit applications, ensuring optimal performance in telecommunications systems.

Nominal Supply Voltage: 3 V

With a nominal supply voltage of 3V, this product offers compatibility with a wide range of electronic systems.

Terminal Pitch: 1.1 mm

The small terminal pitch allows for high-density mounting, making this product suitable for applications where space is a premium.

Data Rate: 0.0086 Mbps

The high data rate of 0.0086 Mbps enables fast and efficient data transmission, making this product ideal for high-speed telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs BM70BLES1FC2-0B04AA attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

Data Rate:

.0086 Mbps

JESD-30 Code:

R-XXMA-N33

Length:

22 mm

No. of Functions:

1

No. of Terminals:

33

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Equivalence Code:

MODULE,33LEAD(UNSPEC)

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

2.46 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.1 mm

Terminal Position:

UNSPECIFIED

Width:

12 mm

Trade Compliance

BM70BLES1FC2-0B04AA Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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