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MAX2769CETI+T

Analog Devices

MAX2769CETI+T by Analog Devices

TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Matte Tin (Sn) - annealed; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;

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MAX2769CETI+T by Analog Devices
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Vyrian

USA . 4,382 parts In-Stock

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Digiode

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Nova Conductors

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Anansix

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Corohmni

South Africa . 1,048 parts In-Stock

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AZTECH Wire

Italy . 657 parts In-Stock

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MARBEL Systems

Belgium . 1,281 parts In-Stock

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Advanced Electronics

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Texas Native Microelectronics

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Kenton Components

USA . 3,349 parts In-Stock

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Aztec Data Supply Inc.

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Qasali Group International

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Semicontronic

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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Bastille Electronics

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Technical Specifications

Other Function Telecom Interface ICs MAX2769CETI+T attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Telecom IC Type:

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

MAX2769CETI+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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