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AFE031AIRGZT

Texas Instruments

AFE031AIRGZT by Texas Instruments

AFE031AIRGZT by Texas Instruments is a 48-terminal telecom IC with a 3.3V supply voltage and low current draw of 0.0053mA. It operates in automotive-grade temperatures from -40 to 125°C, making it suitable for telecom circuit applications requiring high reliability and performance in harsh environments. The chip carrier package style with a very thin profile and surface mount capability enhances its versatility for compact designs.

Median Price

$4.603

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 127,718 parts In-Stock

1+ parts

$3.796

100+ parts

$3.326

1k+ parts

$1.879

10k+ parts

-

127,718

$3.796

$3.326

$1.879

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DigiKey

USA . 18,161 parts In-Stock

1+ parts

$5.410

100+ parts

$3.454

1k+ parts

$3.135

10k+ parts

$3.014

18,161

$5.410

$3.454

$3.135

$3.014

Mouser Electronics

USA . 1,211 parts In-Stock

1+ parts

$5.820

100+ parts

$3.710

1k+ parts

$3.360

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1,211

$5.820

$3.710

$3.360

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Arrow

USA . 2,500 parts In-Stock

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-

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$2.322

10k+ parts

$2.214

2,500

-

-

$2.322

$2.214

Distributors (In-Stock)

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Nova Conductors

Japan . 16 parts In-Stock

1+ parts

$3.306

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-

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16

$3.306

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Digiode

USA . 2,480 parts In-Stock

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$3.606

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2,480

$3.606

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Vyrian

USA . 37,013 parts In-Stock

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37,013

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Chip Stock

USA . 7,800 parts In-Stock

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7,800

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VNN

France . 611 parts In-Stock

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611

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PC Components Company LLC

USA . 2 parts In-Stock

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2

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Bristol Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 37,295 parts In-Stock

1+ parts

$1.970

100+ parts

$1.921

1k+ parts

$1.911

10k+ parts

-

37,295

$1.970

$1.921

$1.911

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Corohmni

South Africa . 582 parts In-Stock

1+ parts

$2.890

100+ parts

-

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582

$2.890

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Continental Prestige Electronics

USA . 4,066 parts In-Stock

1+ parts

$3.306

100+ parts

-

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$3.240

4,066

$3.306

-

-

$3.240

Argo Parts USA

USA . 1,183 parts In-Stock

1+ parts

$3.306

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1,183

$3.306

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Netroflash

USA . 50 parts In-Stock

1+ parts

$3.306

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50

$3.306

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Corphita

USA . 766 parts In-Stock

1+ parts

$3.416

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766

$3.416

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Ampacity Inc.

Singapore . 37,250 parts In-Stock

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$4.300

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37,250

$4.300

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Parana Technologies

USA . 1,487 parts In-Stock

1+ parts

$9.732

100+ parts

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$10.312

10k+ parts

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1,487

$9.732

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$10.312

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ChromeModa Solutions

Germany . 3,112 parts In-Stock

1+ parts

$10.935

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$8.967

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3,112

$10.935

$8.967

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IDEA Electronic Components Group

UK . 942 parts In-Stock

1+ parts

$10.935

100+ parts

$10.388

1k+ parts

$9.842

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942

$10.935

$10.388

$9.842

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Microchip USA

USA . 1,947 parts In-Stock

1+ parts

$23.270

100+ parts

$23.130

1k+ parts

$23.060

10k+ parts

$22.990

1,947

$23.270

$23.130

$23.060

$22.990

Lixinc

USA . 15,144 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,613 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,742 parts In-Stock

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Perfect Parts

USA . 2,984 parts In-Stock

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Infinite Electronics LLP (Excess)

. 1,465 parts In-Stock

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DigiPath Technology Company

USA . 834 parts In-Stock

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$9.859

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834

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Futuretech Components

Singapore . 500 parts In-Stock

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500

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

1+ parts

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100+ parts

$0.074

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$0.074

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$0.074

100

-

$0.074

$0.074

$0.074

Kepictronics

USA . 49 parts In-Stock

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49

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Overview

Experience unparalleled quality and reliability with the AFE031AIRGZT by Texas Instruments, a leader in innovative technology solutions. This Telecom Interface IC offers a wide range of applications, ensuring seamless connectivity and communication. With its advanced features and cutting-edge design, this product delivers exceptional value and performance to customers looking for top-notch telecom solutions. Trust Texas Instruments to provide you with the best in class products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and moisture resistance, suitable for various environments.

Surface Mount: YES

Allows for easy and efficient assembly onto PCBs, saving time and effort.

Package Shape: SQUARE

Optimal shape for space-efficient placement on circuit boards.

Power Supplies (V): 3.3

Operates at a common voltage level, compatible with many power systems.

No. of Terminals: 48

Provides ample connectivity options for various applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of styles allows for efficient heat dissipation and space-saving.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for demanding operating conditions.

Minimum Operating Temperature: -40 °C

Can operate in low temperatures, making it versatile for different environments.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

Arrangement allows for efficient routing and organization of connections.

Maximum Seated Height: 1 mm

Low profile design saves space and allows for compact device designs.

Width: 7 mm

Compact width for efficient utilization of space on PCBs.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly processes.

Length: 7 mm

Compact length for space-saving and optimal placement on PCBs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and durability.

Terminal Form: NO LEAD

Lead-free terminal form for compliance with environmental regulations.

Maximum Supply Current: 0.0053 mA

Low power consumption for energy-efficient operation.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance.

Nominal Supply Voltage: 3.3 V

Operates at a standard voltage level, compatible with many systems.

Terminal Pitch: 0.5 mm

Fine pitch for high density connections and space efficiency.

Moisture Sensitivity Level (MSL): 3

Moderate sensitivity level for handling during assembly and storage.

Technical Specifications

Other Function Telecom Interface ICs AFE031AIRGZT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Modems

Maximum Supply Current:

.0053 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

AFE031AIRGZT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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