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TDA7116FHTMA1

Infineon Technologies

TDA7116FHTMA1 by Infineon Technologies

TDA7116FHTMA1 by Infineon is a telecom IC with 10 terminals, operating from -40 to 85°C. It has a small outline package style, matte tin finish, and dual terminal position. This IC is suitable for telecom circuits requiring a nominal voltage of 3V in industrial temperature environments.

Median Price

$1.260

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

-

100+ parts

$1.260

1k+ parts

$1.050

10k+ parts

$0.932

3

-

$1.260

$1.050

$0.932

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 904 parts In-Stock

1+ parts

$0.988

100+ parts

-

1k+ parts

-

10k+ parts

-

904

$0.988

-

-

-

Nova Conductors

Japan . 34 parts In-Stock

1+ parts

$2.141

100+ parts

-

1k+ parts

-

10k+ parts

-

34

$2.141

-

-

-

Chip Stock

USA . 11,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,500

-

-

-

-

Vyrian

USA . 5,093 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,093

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3 parts In-Stock

1+ parts

$0.880

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$0.880

-

-

-

Semicontronic

India . 3 parts In-Stock

1+ parts

$0.880

100+ parts

$0.858

1k+ parts

$0.854

10k+ parts

-

3

$0.880

$0.858

$0.854

-

Corphita

USA . 358 parts In-Stock

1+ parts

$0.936

100+ parts

-

1k+ parts

-

10k+ parts

-

358

$0.936

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$2.098

100+ parts

-

1k+ parts

$2.014

10k+ parts

-

100

$2.098

-

$2.014

-

Argo Parts USA

USA . 4,464 parts In-Stock

1+ parts

$2.141

100+ parts

-

1k+ parts

-

10k+ parts

-

4,464

$2.141

-

-

-

Continental Prestige Electronics

USA . 3,726 parts In-Stock

1+ parts

$2.141

100+ parts

-

1k+ parts

-

10k+ parts

$2.098

3,726

$2.141

-

-

$2.098

Modulus Dynamics

Lithuania . 1,483 parts In-Stock

1+ parts

$7.012

100+ parts

$6.732

1k+ parts

$6.451

10k+ parts

-

1,483

$7.012

$6.732

$6.451

-

AZTECH Wire

Italy . 496 parts In-Stock

1+ parts

$10.458

100+ parts

-

1k+ parts

-

10k+ parts

-

496

$10.458

-

-

-

Corohmni

South Africa . 57 parts In-Stock

1+ parts

$13.773

100+ parts

-

1k+ parts

-

10k+ parts

-

57

$13.773

-

-

-

Aztec Data Supply Inc.

USA . 1,817 parts In-Stock

1+ parts

$15.590

100+ parts

-

1k+ parts

-

10k+ parts

-

1,817

$15.590

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Experience the seamless connectivity and superior performance with the TDA7116FHTMA1 by Infineon Technologies. Crafted with precision and innovation, this telecom interface IC offers unparalleled quality and reliability. Whether you're looking to enhance communication systems or improve network efficiency, this product is designed to exceed your expectations. Embrace the future of telecommunications with the TDA7116FHTMA1 and unlock a world of possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, suitable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape provides stability and ease of handling during installation and maintenance.

No. of Terminals: 10

Having 10 terminals allows for a variety of connections, increasing the versatility and functionality of the product.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style makes the product compact and space-saving, ideal for applications where size is a concern.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand temperature variations and extended usage in industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product can function effectively in extreme cold conditions without any issues.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable and long-lasting connections.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in various circuit configurations and ensures compatibility with different systems.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1 mm ensures the product can fit in tight spaces and slim devices without compromising performance.

Width: 3 mm

The compact width of 3 mm makes the product suitable for applications where space is limited, without sacrificing functionality.

Length: 3 mm

The short length of 3 mm further enhances the compactness of the product, making it suitable for small devices and tight layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial use, the product meets high-quality standards and can operate reliably in demanding industrial environments.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections and facilitates easy installation during PCB assembly.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit type IC, the product is specifically designed to meet the requirements of telecom applications, ensuring optimal performance and compatibility.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is common in many electronic devices, making the product versatile and compatible with a wide range of systems.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, the product offers precise connections and compatibility with standard PCB layouts, ensuring ease of integration.

Technical Specifications

Other Function Telecom Interface ICs TDA7116FHTMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TDA7116FHTMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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