Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TDA7110FHTMA1 by Infineon Technologies is a telecom interface IC with 1 function. It has a small outline, thin profile package style and operates in an industrial temperature range of -40 to 85°C. This IC is suitable for telecom circuit applications.
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Mouser Electronics
$0.868
Digiode
$0.906
Nova Conductors
$1.113
Vyrian
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Ampacity Inc.
$0.740
Corphita
$0.859
Continental Prestige Electronics
$1.110
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Netroflash
$1.091
Aztec Data Supply Inc.
$6.578
Modulus Dynamics
$9.697
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Corohmni
$14.310
Lixinc
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Argo Parts USA
Perfect Parts
The use of plastic/epoxy as the package body material ensures durability and protection for the internal components, making this product a reliable choice.
The surface mount capability allows for easy and efficient integration into various circuit boards, enhancing the ease of installation and reducing assembly time.
With a single function, this product offers a specific and focused functionality, simplifying its implementation and ensuring optimal performance for its intended purpose.
The square package shape provides a compact and space-efficient design, making it suitable for applications where board space is limited.
With 10 terminals, this product offers sufficient connectivity options, enabling smooth and flexible integration within the overall system.
The small outline, thin profile, and shrink pitch package style offers a compact and sleek design, ideal for applications with size constraints without compromising performance.
With a high maximum operating temperature of 85°C, this product can reliably operate in demanding environments without the risk of overheating or performance degradation.
The wide operating temperature range, starting from -40°C, ensures that this product can effectively function in both extreme cold and hot conditions, increasing its versatility.
The matte tin terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections over an extended period, adding to the product's longevity.
With dual terminal position, this product allows for flexible mounting options, facilitating easy integration and accommodating different circuit board layouts.
The low maximum seated height of 1.1 mm enables this product to be used in applications with limited vertical space, contributing to overall space-saving design considerations.
The compact width of 3 mm allows for a small footprint, making this product a suitable choice for space-constrained designs.
With a length of 3 mm, this product offers a compact form factor, further contributing to space-saving requirements in various applications.
The industrial temperature grade ensures that this product can withstand harsh operating conditions prevalent in industrial settings, making it a dependable choice for demanding environments.
The gull wing terminal form allows for easy surface mounting and soldering, simplifying the assembly process and improving overall efficiency.
As a dedicated telecom circuit IC, this product is specifically designed and optimized for telecommunications applications, guaranteeing reliable and efficient performance in this field.
With a nominal supply voltage of 3V, this product offers compatibility with common power supplies, ensuring seamless integration into various systems.
The tight terminal pitch of 0.5 mm enables high-density mounting, making this product suitable for applications requiring a large number of components within a limited space.
With a moisture sensitivity level of 1, this product has a low susceptibility to moisture-related issues, enhancing its reliability and longevity in diverse environments.
Other Function Telecom Interface ICs TDA7110FHTMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
TDA7110FHTMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Cover Tape Chg 9/Mar/2020 Mult Dev Pkg Update 28/May/2020
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
1N4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Onsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
SMBJ18CA
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
LM555CN
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 200 Cel; No. of Elements: 1;
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
STM32F407VGT6
STMicroelectronics
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
Sensitron Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
BAV99
Kec
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
LM317T
Samsung
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
LL4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
Excel (Suzhou) Semiconductor
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
RN4020-V/RM
Microchip Technology
RN4020-V/RM by Microchip Technology is a telecom IC with 24 terminals, operating at 3.3V. It offers a data rate of 1 Mbps and operates b/w -30°C to 85°C. Ideal for applications requiring surface mount technology in compact spaces.
TUSB211IRWBR
Texas Instruments
TUSB211IRWBR by Texas Instruments is a telecom IC with 480.24 Mbps data rate, operating at -40 to 85 °C. It features a 12-terminal chip carrier package suitable for industrial applications requiring a 3.3 V supply voltage and low current consumption of 0.02 mA.
JN5168-001-M03Z
NXP Semiconductors
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 240;
BG96MATEA-128-SGN
Quectel Wireless Solutions
BG96MATEA-128-SGN by Quectel is a surface mount telecom IC with 102 terminals. It operates at temperatures ranging from -35 to 75 °C and has a data rate of 0.375 Mbps. This IC is commonly used in applications requiring reliable and high-speed communication.
MD0101K6-G
MD0101K6-G by Microchip Tech is a telecom IC with 18 terminals in a small outline package. Operating temp range from -40 to 125°C makes it suitable for automotive applications. Terminal finish of NiPdAu ensures reliable performance in various environments.
BG95M3LA-64-SGNS
BG95M3LA-64-SGNS by Quectel Wireless Solutions is a telecom IC with 1.119 Mbps data rate, operating at -35 to 75 °C. It has 102 terminals, measures 19.9mm in width, and is suitable for commercial extended temperature grade applications.
CC1125RHBR
The Texas Instruments CC1125RHBR is a telecom IC with 32 terminals, operating at 3V. It offers a data rate of 0.2 Mbps and can withstand temperatures from -40 to 85°C. Ideal for telecom circuits, this chip carrier package is surface mountable and has a very thin profile, making it suitable for industrial applications.
RN4871-I/RM140
RN4871-I/RM140 by Microchip Technology is a telecom IC with 16 terminals, operating at -40 to 85°C. It has a data rate of 0.01 Mbps and nominal voltage of 3V. Ideal for industrial applications requiring surface mount technology in compact spaces.
WL1805MODGBMOCT
WL1805MODGBMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for commercial applications requiring high-speed telecommunications functionality.
LEA-M8S-0
U-blox Ag
LEA-M8S-0 by U-blox Ag is a surface mount RF and baseband circuit with 28 terminals. It operates in industrial temperature range (-40 to 85°C) and has a supply voltage of 3V. This telecom IC is AEC-Q100 certified, suitable for automotive applications.
ESP32-WROOM-32D
Espressif Systems (Shanghai)
ESP32-WROOM-32D by Espressif Systems is a 38-terminal IC with 3.3V supply voltage, operating from -40 to 85°C. It features no-lead terminals, telecom circuit type, and industrial temperature grade. Ideal for IoT applications requiring compact size and high performance in telecommunications interfaces.
SI4010-C2-GTR
Silicon Labs
SI4010-C2-GTR by Silicon Labs is a telecom IC with 10 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and uses CMOS technology. This small outline package is ideal for telecom circuit applications due to its industrial temperature grade and surface mount capability.
MIA-M10Q-00B
TELECOM CIRCUIT;
TMS3705EDRQ1
TMS3705EDRQ1 by Texas Instruments is a telecom IC with 16 terminals, operating b/w -40 to 85°C. It has a supply voltage of 5V and terminal pitch of 1.27mm. Ideal for industrial applications requiring AEC-Q100 screening level in a small outline package.
CC2564CRVMR
CC2564CRVMR by Texas Instruments is a telecom IC with 76 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a data rate of 4 Mbps and nominal voltage of 3.6V. Ideal for telecom circuits, it has a very thin profile and matte tin terminal finish.
EYSHSNZWZ
Kaga Electronics
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 28; Package Shape: RECTANGULAR; JESD-30 Code: R-XBGA-N28; Minimum Operating Temperature: -40 Cel;
AD9671KBCZ
Analog Devices
AD9671KBCZ by Analog Devices is a 144-terminal GRID ARRAY IC with low profile and fine pitch. Operating b/w 0-85°C, it has a supply voltage of 1.4V and terminal pitch of 0.8mm. Ideal for telecom circuits, its package is made of PLASTIC/EPOXY and is surface mountable for various applications.
SJA1105EL
NXP Semiconductors' SJA1105EL is a telecom IC with 159 terminals in a low-profile grid array package. It operates b/w -40°C to 105°C, with a supply voltage of 1.2V. Suitable for telecom circuits, it has a terminal pitch of 0.8mm and meets AEC-Q100 screening standards.
Taiyo Yuden
EYSHSNZWZ by Taiyo Yuden is a RECTANGULAR telecom IC with 28 terminals, HYBRID technology, and 3V supply voltage. It operates b/w -40°C to 85°C, suitable for telecom circuit applications requiring compact design with surface mount capability.
CC1175RHMR
The Texas Instruments CC1175RHMR is a telecom IC with 32 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C, with power supplies of 2.5/3.3V. Ideal for telecom circuits, it has a terminal pitch of 0.5mm and is suitable for industrial applications.
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ADF7012BRUZ
TDA7116FHTMA1
Infineon Technologies
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;
TDA7200XUMA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
TDA7100HTMA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;
TDA7116F
TDA7116FXT
TDA7116FXT by Infineon is a telecom IC with 10 terminals, operating from -40 to 85°C. Its small outline package makes it suitable for telecom circuits requiring 3V supply voltage. With a terminal pitch of 0.5mm and gull wing form, it's ideal for compact applications in industrial settings.
TDA7541
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
TDA7541B
TDA7541BTR
TDA7541WTR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;
TDA7541BW
TDA7541TR
TDA7541W
TDA7541BWTR
TDA7212
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
TDA7110
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
TDA7255VXUMA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: VQCCN; Package Shape: RECTANGULAR;
TDA7110F
TDA7200
TDA7200XT
Supply Digital Components
$106.00
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12,000 In-Stock
Total price ≈ $80,197.29
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