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TDA7541BW

STMicroelectronics

TDA7541BW by STMicroelectronics

TDA7541BW by STMicroelectronics is a BICMOS telecom interface IC designed for industrial applications. It features a 64-terminal flatpack design, operates b/w -40 °C to 85°C, and supports a nominal voltage of 8.5V. Ideal for robust telecom systems, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,386 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,386

-

-

-

-

Anansix

USA . 1,968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,968

-

-

-

-

Vyrian

USA . 700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

700

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 702 parts In-Stock

1+ parts

$6.985

100+ parts

-

1k+ parts

$6.286

10k+ parts

-

702

$6.985

-

$6.286

-

MKK Technologies

India . 1,518 parts In-Stock

1+ parts

$13.134

100+ parts

-

1k+ parts

-

10k+ parts

-

1,518

$13.134

-

-

-

DigiPath Technology Company

USA . 1,518 parts In-Stock

1+ parts

$13.134

100+ parts

-

1k+ parts

-

10k+ parts

-

1,518

$13.134

-

-

-

Ampacity Inc.

Singapore . 136 parts In-Stock

1+ parts

$802.000

100+ parts

-

1k+ parts

-

10k+ parts

-

136

$802.000

-

-

-

Parana Technologies

USA . 1,636 parts In-Stock

1+ parts

-

100+ parts

$8.351

1k+ parts

-

10k+ parts

-

1,636

-

$8.351

-

-

Corphita

USA . 179 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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179

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Overview

Elevate your communication systems with the TDA7541BW from STMicroelectronics, a leader in innovation and quality. This advanced telecom interface IC delivers exceptional reliability and performance, making it ideal for industrial applications. Its robust design ensures optimal operation across various environments, while its compact footprint allows for seamless integration into your projects. Choose the TDA7541BW for superior functionality and peace of mind in your technology solutions!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides durability and resistance to environmental factors, making this IC suitable for industrial applications.

Surface Mount: YES

Surface mount technology enables compact designs and efficient use of board space, leading to lower production costs.

Package Shape: SQUARE

The square package shape allows for better thermal management and efficient layout on PCB, optimizing performance in tight spaces.

No. of Terminals: 64

With 64 terminals, this IC can support complex functionality and provide a rich interface for connectivity and integration.

Package Style (Meter): FLATPACK

Flatpack style ensures low-profile mounting, which helps in space-constrained applications while maintaining performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is reliable in high-temperature environments, making it ideal for industrial use.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures reliable performance even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish enhances solderability and reliability, ensuring long-lasting connections in tough environments.

Terminal Position: QUAD

The quad terminal position allows for easier routing on PCBs, facilitating better signal integrity and reducing interference.

Maximum Time At Peak Reflow Temperature: 30s

A peak reflow time of 30 seconds helps ensure components maintain integrity during assembly, reducing the risk of thermal damage.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature compatibility ensures reliability in the soldering process, contributing to overall product longevity.

Temperature Grade: INDUSTRIAL

As an industrial-grade component, it is designed for harsh conditions, providing peace of mind in critical applications.

Technology: BICMOS

BICMOS technology combines both bipolar and CMOS capabilities, offering high speed, low power consumption, and improved noise performance.

Terminal Form: GULL WING

Gull wing terminals provide excellent surface mount soldering characteristics, enhancing reliability and solder joint strength.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC offers optimized performance and features suited for communication systems.

Nominal Supply Voltage: 8.5 V

A nominal supply voltage of 8.5 V allows for compatibility with a wide range of telecom systems, ensuring flexibility in various applications.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this IC has moderate moisture sensitivity, requiring standard precautions during handling and storage, suitable for many environments.

Technical Specifications

Other Function Telecom Interface ICs TDA7541BW attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Nominal Supply Voltage:

8.5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TDA7541BW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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