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TDA7541W

STMicroelectronics

TDA7541W by STMicroelectronics

TDA7541W by STMicroelectronics is a versatile telecom interface IC designed for industrial applications. It features a wide operating temp range of -40 °C to 85°C, operates at a nominal voltage of 8.5V, and comes in a compact 64-terminal flatpack package. Ideal for robust telecom circuits, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,869 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,869

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-

-

-

Digiode

USA . 4,620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,620

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-

-

-

Anansix

USA . 628 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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628

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,155 parts In-Stock

1+ parts

$9.284

100+ parts

-

1k+ parts

$8.355

10k+ parts

-

2,155

$9.284

-

$8.355

-

AZTECH Wire

Italy . 505 parts In-Stock

1+ parts

$16.790

100+ parts

-

1k+ parts

-

10k+ parts

-

505

$16.790

-

-

-

MKK Technologies

India . 1,956 parts In-Stock

1+ parts

$17.457

100+ parts

-

1k+ parts

-

10k+ parts

-

1,956

$17.457

-

-

-

DigiPath Technology Company

USA . 1,956 parts In-Stock

1+ parts

$17.457

100+ parts

-

1k+ parts

-

10k+ parts

-

1,956

$17.457

-

-

-

Kepictronics

USA . 8,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,800

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-

-

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Authorized Procurement Solutions

USA . 4,736 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,736

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Corphita

USA . 2,865 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,865

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-

-

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Parana Technologies

USA . 1,806 parts In-Stock

1+ parts

-

100+ parts

$11.100

1k+ parts

-

10k+ parts

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1,806

-

$11.100

-

-

Overview

Unlock superior audio performance with the TDA7541W from STMicroelectronics, a trusted leader in innovation. Designed for industrial applications, this versatile telecom interface IC ensures exceptional sound quality, reliability, and durability, even in extreme temperatures. Experience seamless integration and enhanced functionality that elevate your projects, making them stand out in today’s competitive market. Choose TDA7541W for unmatched value and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product suitable for rugged applications.

Surface Mount: YES

Surface mount capability allows for efficient use of board space and facilitates automated assembly processes, leading to reduced manufacturing costs.

Package Shape: SQUARE

A square package shape enhances layout flexibility on circuit boards, allowing for better design optimization.

No. of Terminals: 64

With 64 terminals, the IC offers extensive connectivity options for complex telecom applications, supporting advanced functionalities.

Package Style (Meter): FLATPACK

The flatpack design provides a low profile, which is essential for space-constrained designs while maintaining reliable performance.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows for reliable performance in various environmental conditions commonly found in industrial settings.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C ensures functionality in extreme cold environments, making it suitable for outdoor and harsh applications.

Terminal Position: QUAD

Quad terminal positioning enables efficient heat dissipation and simplifies routing on PCBs, enhancing overall product performance.

Temperature Grade: INDUSTRIAL

Being graded for industrial use assures users of its reliability and robustness in demanding operational environments.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS transistors, providing high speed and low power consumption, critical for telecom applications.

Terminal Form: GULL WING

Gull wing terminals ensure secure solder connections and are suitable for automated assembly, contributing to manufacturing efficiency.

Telecom IC Type: TELECOM CIRCUIT

Being a dedicated telecom circuit IC, this product is optimized for communication applications, ensuring high performance and reliability.

Nominal Supply Voltage: 8.5 V

With a nominal supply voltage of 8.5 V, this IC is compatible with various telecom systems, providing flexibility in system design.

Technical Specifications

Other Function Telecom Interface ICs TDA7541W attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G64

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Nominal Supply Voltage:

8.5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TDA7541W Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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