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EQCO62R20.3-TRAY

Microchip Technology

EQCO62R20.3-TRAY by Microchip Technology

EQCO62R20.3-TRAY by Microchip Technology is a Telecom Interface IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. Features include nickel palladium gold finish, very thin profile, and 1.2V supply voltage for telecom circuit applications.

Median Price

$33.455

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$33.455

100+ parts

-

1k+ parts

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150

$33.455

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-

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Vyrian

USA . 609 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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609

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$8.715

100+ parts

$8.279

1k+ parts

$8.279

10k+ parts

-

3,000

$8.715

$8.279

$8.279

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Aztec Data Supply Inc.

USA . 3,551 parts In-Stock

1+ parts

$10.260

100+ parts

-

1k+ parts

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3,551

$10.260

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Corohmni

South Africa . 150 parts In-Stock

1+ parts

$10.939

100+ parts

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150

$10.939

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Semicontronic

India . 1,328 parts In-Stock

1+ parts

$31.300

100+ parts

$30.518

1k+ parts

$30.361

10k+ parts

-

1,328

$31.300

$30.518

$30.361

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Continental Prestige Electronics

USA . 2,644 parts In-Stock

1+ parts

$33.455

100+ parts

-

1k+ parts

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10k+ parts

$32.786

2,644

$33.455

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-

$32.786

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$33.455

100+ parts

-

1k+ parts

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10k+ parts

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2,000

$33.455

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Ampacity Inc.

Singapore . 1,534 parts In-Stock

1+ parts

$124.000

100+ parts

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1,534

$124.000

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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Microchip USA

USA . 12,608 parts In-Stock

1+ parts

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12,608

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Fulton Briggs Corp.

USA . 5,876 parts In-Stock

1+ parts

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100+ parts

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5,876

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Argo Parts USA

USA . 4,768 parts In-Stock

1+ parts

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4,768

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Overview

Discover the EQCO62R20.3-TRAY by Microchip Technology, a top-tier manufacturer known for high-quality telecom interface ICs. This versatile product offers a wide range of applications in the telecommunications industry, showcasing its value and reliability. With advanced features like a square package shape, very thin profile, and no lead terminal form, this telecom circuit ensures optimal performance even in industrial-grade environments. Upgrade your systems with the EQCO62R20.3-TRAY and experience unmatched efficiency and stability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making it a reliable choice for telecom applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Package Shape: SQUARE

The square shape helps optimize space on PCBs and allows for efficient arrangement of components in a compact design.

No. of Terminals: 16

With 16 terminals, this IC provides ample connectivity options for telecom interfaces, enabling seamless integration with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers efficient heat dissipation and a slim profile, making it suitable for compact telecom devices with thermal management needs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can function reliably in harsh environments, ensuring consistent performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold conditions, making this IC versatile for deployment in various climates.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, enhancing the longevity and performance of the IC.

Terminal Position: QUAD

The quad terminal position allows for easy connection and ensures stable electrical connections in telecom applications.

Maximum Seated Height: 1 mm

With a low seated height, this IC can be mounted close to the PCB surface, minimizing signal interference and maximizing space efficiency.

Width: 4 mm

The 4 mm width of the IC contributes to its compact design, allowing for efficient placement on PCBs with limited space.

Length: 4 mm

The 4 mm length of the IC complements its square shape, enabling a balanced and space-effective layout on the PCB.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC meets the stringent requirements of telecom systems operating in demanding environments.

Terminal Form: NO LEAD

The no-lead terminal form minimizes signal loss and enhances reliability, ensuring optimal performance in telecom interfaces.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this IC offers specialized features and capabilities tailored to telecommunications applications.

Nominal Supply Voltage: 1.2 V

With a low supply voltage requirement, this IC is energy-efficient and compatible with a wide range of power sources in telecom systems.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch enables precise and compact PCB layout, facilitating efficient signal routing and integration in telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs EQCO62R20.3-TRAY attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

EQCO62R20.3-TRAY Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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