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SA616DK/01,112

NXP Semiconductors

SA616DK/01,112 by NXP Semiconductors

SA616DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features nickel palladium gold terminal finish and gull wing form factor for telecom circuit applications.

Median Price

$2.577

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$2.577

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300

$2.577

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Vyrian

USA . 5,744 parts In-Stock

1+ parts

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5,744

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Digiode

USA . 3,532 parts In-Stock

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3,532

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Anansix

USA . 2,307 parts In-Stock

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2,307

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$2.525

100+ parts

-

1k+ parts

$2.424

10k+ parts

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100

$2.525

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$2.424

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Argo Parts USA

USA . 1,462 parts In-Stock

1+ parts

$2.577

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1,462

$2.577

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Continental Prestige Electronics

USA . 8 parts In-Stock

1+ parts

$2.577

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$2.525

8

$2.577

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-

$2.525

Aztec Data Supply Inc.

USA . 495 parts In-Stock

1+ parts

$10.170

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495

$10.170

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AZTECH Wire

Italy . 304 parts In-Stock

1+ parts

$13.306

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304

$13.306

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Corohmni

South Africa . 639 parts In-Stock

1+ parts

$13.774

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639

$13.774

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Component Stockers USA

USA . 720 parts In-Stock

1+ parts

$99.990

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720

$99.990

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One Stop Electronics

USA . 1,423 parts In-Stock

1+ parts

$251.000

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1,423

$251.000

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UNI Independent Distributors

Spain . 4,580 parts In-Stock

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4,580

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Corphita

USA . 4,559 parts In-Stock

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4,559

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Perfect Parts

USA . 2,184 parts In-Stock

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Assy Fe

Spain . 11 parts In-Stock

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Overview

Experience seamless communication with the NXP Semiconductors SA616DK/01,112. This high-quality telecom interface IC offers unparalleled performance and reliability, thanks to its manufacturer's reputation for innovation and excellence. Ideal for a variety of applications in the telecommunications industry, this product provides exceptional value, benefits, and advantages to customers seeking top-notch connectivity solutions. Upgrade your communication systems with the SA616DK/01,112 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount technology makes the product easy to install and saves space on the PCB.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient placement on the PCB.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting various components in the circuit.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environments.

Nominal Supply Voltage: 3 V

Compatible with a standard 3V supply voltage for easy integration into existing systems.

Technical Specifications

Other Function Telecom Interface ICs SA616DK/01,112 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SA616DK/01,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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