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SA616DK/01

NXP Semiconductors

SA616DK/01 by NXP Semiconductors

SA616DK/01 by NXP Semiconductors is a telecom interface IC with 20 terminals, operating temperature range of -40 to 85°C. It features a small outline package style and gull wing terminal form, suitable for industrial applications requiring a nominal voltage of 3V.

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AZTECH Wire

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Overview

Elevate your telecom interface capabilities with the SA616DK/01 by NXP Semiconductors. Designed with superior quality and precision, this telecom circuit IC offers unmatched performance and reliability for a wide range of applications. Whether you're looking to enhance communication systems or streamline data transfer, this product delivers exceptional value and benefits. Trust in NXP Semiconductors to provide cutting-edge technology that meets your needs and exceeds your expectations. Experience the difference with the SA616DK/01.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight and durable, making the product suitable for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and facilitating automated assembly processes.

Package Shape: RECTANGULAR

Rectangular shape provides a compact form factor, optimizing space utilization on PCBs.

No. of Terminals: 20

Having a higher number of terminals allows for more connections and functionality in the telecom interface IC.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without compromising performance.

Terminal Position: DUAL

Dual terminal position enables flexibility in connecting the IC with external components.

Maximum Seated Height: 1.5 mm

Low profile design with a maximum seated height of 1.5 mm saves space and facilitates slim device designs.

Width: 4.4 mm

Compact width dimension allows for efficient placement on PCBs and reduces footprint.

Length: 6.5 mm

Optimal length dimension provides a balanced form factor for the telecom interface IC.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in industrial environments with varying temperature conditions.

Terminal Form: GULL WING

Gull wing terminal form offers secure solder connections and facilitates easy handling during assembly.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, providing optimized performance and compatibility in telecommunications systems.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3 V is suitable for low-power telecom applications, ensuring efficient power consumption.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm enables high-density interconnections and enhances signal integrity in the telecom interface IC.

Technical Specifications

Other Function Telecom Interface ICs SA616DK/01 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SA616DK/01 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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