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SA612AD,602

NXP Semiconductors

SA612AD,602 by NXP Semiconductors

SA612AD,602 by NXP Semiconductors is a telecom interface IC with 1 function. It has a small outline package style and operates in an industrial temperature range of -40 to 85°C. This IC is commonly used in telecom circuits for various applications.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Digiode

USA . 2,151 parts In-Stock

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Anansix

USA . 2,081 parts In-Stock

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Vyrian

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Nova Conductors

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AZTECH Wire

Italy . 489 parts In-Stock

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$8.123

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Aztec Data Supply Inc.

USA . 3,186 parts In-Stock

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Corohmni

South Africa . 81 parts In-Stock

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Ampacity Inc.

Singapore . 344 parts In-Stock

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One Stop Electronics

USA . 1,323 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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UNI Independent Distributors

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Bastille Electronics

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Overview

Discover the SA612AD,602 by NXP Semiconductors, a high-quality telecom interface IC that offers endless possibilities. With its small and compact design, this product is perfect for various applications. Whether you're looking to enhance communication systems or optimize telecom circuits, the SA612AD,602 guarantees exceptional performance. Built by the renowned manufacturer NXP Semiconductors, you can trust in the reliability and durability of this product. Don't compromise on quality - choose the SA612AD,602 and experience the value and advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the product, making it a reliable choice for Telecom Interface ICs.

Surface Mount: YES

The surface mount capability of this product allows for easy and convenient installation, enabling efficient integration into various electronic systems.

No. of Functions: 1

With a single function, this product simplifies design and implementation, providing a straightforward solution for telecom interface circuitry requirements.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standardized sockets, enhancing the versatility and compatibility of this Telecom Interface IC.

No. of Terminals: 8

Having 8 terminals allows for connectivity options and flexibility, enabling the product to cater to different communication interface needs.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers space-saving benefits, making it suitable for compact electronic devices, and facilitating efficient use of available board area.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this Telecom Interface IC can withstand high-temperature environments, ensuring reliable performance even in demanding conditions.

Minimum Operating Temperature: -40 °C

The product's ability to operate at a minimum temperature of -40 °C makes it suitable for use in a wide range of environments, including those with lower temperature requirements.

Terminal Position: DUAL

The dual terminal position allows for versatility in PCB layout and facilitates easier circuit routing, making it a convenient option for Telecom Interface ICs.

Maximum Seated Height: 1.75 mm

With a maximum seated height of 1.75 mm, this product offers a compact profile, allowing for efficient utilization of space in electronic assemblies.

Width: 3.9 mm

The product's width measurement of 3.9 mm contributes to its compact form factor, enabling integration into smaller devices or systems.

Length: 4.9 mm

The length of 4.9 mm adds to the compactness of the product, making it suitable for applications with space constraints.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this Telecom Interface IC meets the necessary requirements for robustness and reliability in demanding environments.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and robust connection points, ensuring secure PCB mounting and improved signal integrity.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuit applications, this Telecom IC type offers optimized performance and features tailored to meet telecom interface requirements.

Nominal Supply Voltage: 6 V

With a nominal supply voltage of 6 V, this Telecom Interface IC ensures compatibility with common power supply levels, offering ease of integration into various systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch enhances the product's versatility, allowing for compatibility with standard pitch requirements and facilitating PCB layout design.

Technical Specifications

Other Function Telecom Interface ICs SA612AD,602 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

SA612AD,602 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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