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SA616BS,115

NXP Semiconductors

SA616BS,115 by NXP Semiconductors

SA616BS,115 by NXP Semiconductors is a Telecom Interface IC with 20 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for industrial applications. Nominal voltage of 3V and terminal pitch of 0.5mm make it ideal for telecom circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,195 parts In-Stock

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Flip Electronics

USA . 5,595 parts In-Stock

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Digiode

USA . 3,033 parts In-Stock

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Anansix

USA . 2,287 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Corohmni

South Africa . 134 parts In-Stock

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$5.860

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Modulus Dynamics

Lithuania . 92 parts In-Stock

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$5.860

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$5.860

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$11.037

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$10.044

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$9.050

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40

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Aztec Data Supply Inc.

USA . 3,369 parts In-Stock

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$13.400

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AZTECH Wire

Italy . 557 parts In-Stock

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$15.970

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One Stop Electronics

USA . 782 parts In-Stock

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Semicontronic

India . 922 parts In-Stock

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$402.000

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$391.950

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$389.940

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Ampacity Inc.

Singapore . 1,162 parts In-Stock

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$619.000

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Continental Prestige Electronics

USA . 6,749 parts In-Stock

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UNI Independent Distributors

Spain . 5,579 parts In-Stock

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Bastille Electronics

Australia . 3,143 parts In-Stock

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Argo Parts USA

USA . 1,981 parts In-Stock

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Corphita

USA . 973 parts In-Stock

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Overview

Discover the cutting-edge SA616BS,115 by NXP Semiconductors, setting new standards in telecom interface ICs. Crafted with precision and expertise, this innovative product offers unparalleled performance and reliability for a wide range of applications. Whether you're looking to enhance communication systems or streamline connectivity solutions, this versatile chip carrier with a very thin profile is designed to exceed expectations. Experience seamless operation, high-quality construction, and unmatched value with the SA616BS,115. Unlock endless possibilities with this top-of-the-line industrial-grade telecom circuit - the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers a good balance between durability and cost-effectiveness, making it a practical choice for telecom interface ICs.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square shape provides a compact form factor, optimizing space utilization on PCBs and allowing for more efficient layout designs.

No. of Terminals: 20

With a high number of terminals, this IC can accommodate multiple connections, making it suitable for complex telecom interface applications.

Package Style: CHIP CARRIER, VERY THIN PROFILE

The chip carrier style with a very thin profile ensures a sleek and space-saving design, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliability in various operating conditions, making this IC suitable for industrial use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for consistent performance even in extreme cold environments, enhancing the IC's versatility.

Terminal Position: QUAD

The quad terminal position provides improved stability and connectivity, making this IC a reliable choice for telecom applications.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim profile, enabling the IC to be used in devices with limited space.

Width: 4 mm

The compact width dimension ensures compatibility with small form factor devices, making this IC suitable for a wide range of telecom applications.

Maximum Time At Peak Reflow Temperature: 30s

The short maximum time at peak reflow temperature minimizes the risk of heat-related damage during assembly, ensuring the IC's longevity.

Peak Reflow Temperature: 260C

With a high peak reflow temperature tolerance, this IC can withstand high-temperature soldering processes, ensuring a reliable connection on the PCB.

Length: 4 mm

The compact length dimension offers flexibility in placement on the circuit board, allowing for efficient layout customization.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making this IC suitable for demanding telecom environments.

Terminal Form: NO LEAD

The lead-free terminal form complies with environmental regulations and helps to reduce potential health hazards during manufacturing and use.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC offers optimized performance and functionality for telecommunications systems.

Nominal Supply Voltage: 3 V

With a 3V nominal supply voltage, this IC is compatible with a wide range of power sources, making it versatile for different telecom setups.

Terminal Pitch: 0.5 mm

The narrow terminal pitch allows for high-density mounting on the PCB, making this IC suitable for space-constrained telecom devices.

Technical Specifications

Other Function Telecom Interface ICs SA616BS,115 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N20

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

SA616BS,115 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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