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SA612AD/01

NXP Semiconductors

SA612AD/01 by NXP Semiconductors

SA612AD/01 by NXP Semiconductors is a telecom IC with 8 terminals, operating from -40 to 85°C. It has a supply voltage of 6V and terminal pitch of 1.27mm. This small outline package is ideal for telecom circuit applications in industrial settings.

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Chip Stock

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AZTECH Wire

Italy . 797 parts In-Stock

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Aztec Data Supply Inc.

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Overview

Discover the cutting-edge SA612AD/01 by NXP Semiconductors, a top-quality telecom interface IC that offers unparalleled value and performance. With its innovative design and industrial-grade temperature range, this product is perfect for a wide range of applications in the telecom industry. Experience seamless connectivity and reliable operation with the SA612AD/01, designed to meet your every need. Elevate your projects with the superior quality and advanced technology of NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and stability to the product, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto PCBs, saving time during production.

Package Shape: RECTANGULAR

Rectangular package shape enables more efficient use of space on the PCB, making the product suitable for compact designs.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for various telecom applications, ensuring compatibility with different systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand demanding conditions and environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product can operate reliably even in extremely cold conditions.

Nominal Supply Voltage: 6 V

With a nominal supply voltage of 6V, the product can work with a wide range of power sources, making it versatile for different applications.

Technical Specifications

Other Function Telecom Interface ICs SA612AD/01 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SA612AD/01 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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