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SIM800C

Simcom Wireless Solutions

SIM800C by Simcom Wireless Solutions

SIM800C by Simcom Wireless Solutions is a telecom IC with 0.0856 Mbps data rate. It operates in industrial temperature range (-40 to 85 °C) and has 42 terminals in a rectangular package. Ideal for IoT, M2M, and GSM applications due to its surface mount capability and quad terminal position.

Median Price

$8.242

Lifecycle Status

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DF Sales Co.

USA . 52 parts In-Stock

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DF Sales Co.

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Cogito LLC

Ukraine . 33,000 parts In-Stock

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Vyrian

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Ack Elektronik San.Tic.Ltd.Sti

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Micros

Poland . 527 parts In-Stock

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Nova Conductors

Japan . 71 parts In-Stock

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Partservice

France . 55 parts In-Stock

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Cyclops Electronics Ltd

UK . 50 parts In-Stock

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Micros sp.j. W. Kędra i J. Lic

Poland . 20 parts In-Stock

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$7.167

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A2Z Electronics, Inc.

USA . 5 parts In-Stock

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Bristol Electronics

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AZTECH Wire

Italy . 697 parts In-Stock

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$5.857

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Advanced Electronics

New Zealand . 150 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,954 parts In-Stock

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GreenTree Electronics

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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Continental Prestige Electronics

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RC Electronics

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Infinite Electronics LLP (Excess)

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Bastille Electronics

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S.R.D Solutions

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Formix International (Excess)

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Futuretech Components

Singapore . 2,525 parts In-Stock

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Argo Parts USA

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Modulus Dynamics

Lithuania . 300 parts In-Stock

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Robosynatics

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Lucentia Tech

USA . 30 parts In-Stock

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Overview

Experience seamless communication with the SIM800C by Simcom Wireless Solutions, a top-tier manufacturer known for its cutting-edge technology. This versatile telecom interface IC offers unparalleled reliability and performance in various applications. Whether you're looking to enhance IoT devices, GPS trackers, or remote monitoring systems, the SIM800C delivers unmatched value, benefits, and advantages. Trust Simcom Wireless Solutions to provide you with the innovative solutions you need to stay connected effortlessly.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and potentially saves space on the PCB, making this product suitable for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape offers good compatibility with standard PCB layouts, enhancing ease of integration into existing systems.

No. of Terminals: 42

With a high number of terminals, this product can support complex telecom interfaces and connectivity requirements, making it versatile for various applications.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style provides reliability and precision in manufacturing, ensuring consistent performance in telecom applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance even in demanding industrial environments, making this product suitable for rugged applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in extreme cold conditions, providing versatility for deployment in various climates.

Terminal Position: QUAD

The quad terminal position offers improved connectivity and signal integrity, enhancing the overall performance of the telecom interface IC.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this product is designed to withstand harsh industrial environments, ensuring reliability and longevity in operation.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and reduces the risk of solder joint failures, enhancing the overall quality and durability of the product.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuits, this IC offers optimized performance and compatibility with telecommunication systems, making it a reliable choice for such applications.

Data Rate: 0.0856 Mbps

The high data rate capability of 0.0856 Mbps enables fast data transmission in telecom applications, ensuring efficient communication and data exchange.

Technical Specifications

Other Function Telecom Interface ICs SIM800C attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Simcom Wireless Solutions

Specs

Additional Features:

Operates with 3.4-4.4 V Supply

Data Rate:

.0856 Mbps

JESD-30 Code:

R-XQMA-N42

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

QMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

SIM800C Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Simcom Wireless Solutions

Founded in 2002, SIMCom Wireless Solutions Limited has been committed to providing a variety of wireless modules and solutions including 5G, 4G, LPWA, LTE-A, smart module, automotive module, 3G, 2G and GNSS for 20 years. According to the latest M2M report by ABI Research Inc., a well-known U.S. market research company, SIMCom has made the largest shipments of wireless module for 4 consecutive years. There are five R&D centers in Shanghai, Chongqing, Shenyang, Shenzhen and Xi’an, with the world's leading wireless module technologies, testing equipment and R&D environment, including more than 5,000 square meters of top-notch 5G laboratory and a full set of 5G R&D equipment. With a senior R&D team of nearly 1,000 people and more than 500 global technology patents, SIMCom continues to maintain it role as the leader in the global IoT module market. SIMCom focuses on vertical industries while setting up a strategic global sales network to give full play to its advantages, which constitutes its core competitiveness. With more than 50 offices across the globe, SIMCom provides advances products and high quality services to more than 10,000 global customers in more than 180 countries and regions. In the future, SIMCom will actively promote edge network solutions and business model innovation, leading the rapid development of the wireless module industry.

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