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CC2564MODACMOG

Texas Instruments

CC2564MODACMOG by Texas Instruments

CC2564MODACMOG by Texas Instruments is a telecom IC with 35 terminals, operating at -30 to 85°C. It has a data rate of 4 Mbps and nominal voltage of 3.6V. This surface-mount IC in rectangular package shape is ideal for telecom applications requiring high-speed data transmission.

Median Price

$14.890

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,382 parts In-Stock

1+ parts

$8.911

100+ parts

$7.784

1k+ parts

$5.368

10k+ parts

-

2,382

$8.911

$7.784

$5.368

-

Mouser Electronics

USA . 211 parts In-Stock

1+ parts

$14.890

100+ parts

$11.010

1k+ parts

$10.340

10k+ parts

-

211

$14.890

$11.010

$10.340

-

DigiKey

USA . 2,702 parts In-Stock

1+ parts

$15.050

100+ parts

$12.413

1k+ parts

$10.388

10k+ parts

-

2,702

$15.050

$12.413

$10.388

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,565 parts In-Stock

1+ parts

$8.465

100+ parts

-

1k+ parts

-

10k+ parts

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1,565

$8.465

-

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$8.538

100+ parts

-

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-

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500

$8.538

-

-

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Mobius Materials

USA . 322 parts In-Stock

1+ parts

$21.870

100+ parts

$17.510

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-

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322

$21.870

$17.510

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Chip Stock

USA . 4,385 parts In-Stock

1+ parts

-

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4,385

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Vyrian

USA . 1,212 parts In-Stock

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-

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1,212

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

1+ parts

-

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1

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Holdelec - ElecDif-Pro

France . 1 parts In-Stock

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-

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 579 parts In-Stock

1+ parts

$7.119

100+ parts

-

1k+ parts

$7.634

10k+ parts

-

579

$7.119

-

$7.634

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DigiPath Technology Company

USA . 906 parts In-Stock

1+ parts

$7.839

100+ parts

$7.212

1k+ parts

-

10k+ parts

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906

$7.839

$7.212

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ChromeModa Solutions

Germany . 1,657 parts In-Stock

1+ parts

$7.999

100+ parts

$6.559

1k+ parts

-

10k+ parts

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1,657

$7.999

$6.559

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IDEA Electronic Components Group

UK . 970 parts In-Stock

1+ parts

$7.999

100+ parts

-

1k+ parts

$7.199

10k+ parts

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970

$7.999

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$7.199

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Corphita

USA . 1,325 parts In-Stock

1+ parts

$8.020

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1,325

$8.020

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$8.368

100+ parts

-

1k+ parts

$8.033

10k+ parts

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500

$8.368

-

$8.033

-

Continental Prestige Electronics

USA . 5,779 parts In-Stock

1+ parts

$8.538

100+ parts

-

1k+ parts

-

10k+ parts

$8.368

5,779

$8.538

-

-

$8.368

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$15.562

100+ parts

$14.784

1k+ parts

$14.784

10k+ parts

-

500

$15.562

$14.784

$14.784

-

Ampacity Inc.

Singapore . 1,638 parts In-Stock

1+ parts

$16.490

100+ parts

-

1k+ parts

-

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1,638

$16.490

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Semicontronic

India . 1,176 parts In-Stock

1+ parts

$16.490

100+ parts

$16.078

1k+ parts

$15.995

10k+ parts

-

1,176

$16.490

$16.078

$15.995

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Corohmni

South Africa . 61 parts In-Stock

1+ parts

$17.189

100+ parts

-

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61

$17.189

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Lixinc

USA . 14,825 parts In-Stock

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14,825

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 2,838 parts In-Stock

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2,838

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 1,935 parts In-Stock

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1,935

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A-Z Elektronik GmbH

Germany . 1,296 parts In-Stock

1+ parts

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100+ parts

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1,296

-

-

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Overview

Unlock the potential of seamless connectivity with the CC2564MODACMOG by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments has once again delivered a cutting-edge solution for telecom interfaces. This versatile device is ideal for a wide range of applications, offering unparalleled value and benefits to customers. Say goodbye to connectivity issues and hello to smooth, efficient communication with the CC2564MODACMOG.

Feature Benefit Bullets

Surface Mount: YES

Enables easy and efficient mounting on PCBs, saving time and effort during assembly process.

No. of Terminals: 35

Provides multiple connections for various functions and interfaces, allowing for versatility in usage.

Nominal Supply Voltage: 3.6 V

Optimal voltage requirement for reliable and efficient operation, reducing the risk of damage or malfunction.

Data Rate: 4 Mbps

High data rate capability ensures fast and smooth transmission of information, enhancing overall performance.

Moisture Sensitivity Level (MSL): 3

Ensures durability and reliability in varying environmental conditions, making it suitable for a wide range of applications.

Technical Specifications

Other Function Telecom Interface ICs CC2564MODACMOG attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

4 Mbps

JESD-30 Code:

R-XXMA-N35

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

35

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN OVER NICKEL

Terminal Form:

Terminal Position:

UNSPECIFIED

Width:

7 mm

Trade Compliance

CC2564MODACMOG Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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