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CC2520RHDT

Texas Instruments

CC2520RHDT by Texas Instruments

CC2520RHDT by Texas Instruments is a telecom IC with 28 terminals in a square chip carrier package. It operates b/w -40 to 125°C, suitable for automotive applications. With a data rate of 0.25 Mbps and nominal voltage of 3V, it's ideal for telecom circuits requiring high reliability.

Median Price

$6.854

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 100,650 parts In-Stock

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$4.928

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$4.017

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$2.678

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$4.928

$4.017

$2.678

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Mouser Electronics

USA . 357 parts In-Stock

1+ parts

$8.780

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$5.760

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$5.200

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357

$8.780

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DigiKey

USA . 1,300 parts In-Stock

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Nova Conductors

Japan . 22 parts In-Stock

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$4.017

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$4.017

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Digiode

USA . 2,068 parts In-Stock

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$4.682

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Vyrian

USA . 34,119 parts In-Stock

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Chip Stock

USA . 7,000 parts In-Stock

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Speed Components Ltd

Israel . 220 parts In-Stock

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220

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LWI Electronics Inc

India . 40 parts In-Stock

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40

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Lantek

USA . 30 parts In-Stock

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30

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Sunrise Surplus Inc.

USA . 5 parts In-Stock

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A2Z Electronics, Inc.

USA . 5 parts In-Stock

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Bristol Electronics

USA . 5 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 4 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$3.937

100+ parts

-

1k+ parts

$3.779

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50

$3.937

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$3.779

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Continental Prestige Electronics

USA . 5,471 parts In-Stock

1+ parts

$4.017

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$3.937

5,471

$4.017

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$3.937

Argo Parts USA

USA . 3,215 parts In-Stock

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$4.017

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Ampacity Inc.

Singapore . 34,072 parts In-Stock

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$4.190

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Semicontronic

India . 33,987 parts In-Stock

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$4.190

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$4.085

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$4.064

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33,987

$4.190

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Corphita

USA . 2,904 parts In-Stock

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$4.435

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Corohmni

South Africa . 90 parts In-Stock

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$6.396

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$6.396

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Parana Technologies

USA . 1,931 parts In-Stock

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$6.464

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$600.287

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$5.818

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$6.464

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DigiPath Technology Company

USA . 727 parts In-Stock

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$7.118

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ChromeModa Solutions

Germany . 4,306 parts In-Stock

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$7.263

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$5.956

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IDEA Electronic Components Group

UK . 1,439 parts In-Stock

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$7.263

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$6.537

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1,439

$7.263

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$9.448

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$8.976

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$9.448

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Perfect Parts

USA . 23,701 parts In-Stock

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Lixinc

USA . 16,516 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,457 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,638 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Kepictronics

USA . 75 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 4 parts In-Stock

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Overview

Elevate your telecom interface projects with the CC2520RHDT by Texas Instruments. This cutting-edge IC offers unmatched quality and reliability, backed by the trusted reputation of its manufacturer. Perfect for a wide range of applications in the telecom industry, this product provides exceptional value, benefits, and advantages to customers looking for top-notch performance without compromise. Upgrade your projects today with the CC2520RHDT and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and cost in manufacturing.

Package Shape: SQUARE

Square package shape helps in efficient use of space on the circuit board, ideal for compact electronic devices.

No. of Terminals: 28

Having 28 terminals allows for multiple connections and functionalities within the telecom interface IC.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in harsh operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Width: 5 mm

Narrow width enables space-saving design and integration into small electronic devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable in data transmission.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V makes the IC compatible with a wide range of electronic systems and components.

Data Rate: 0.25 Mbps

With a data rate of 0.25 Mbps, the telecom interface IC can efficiently handle moderate-speed data transmission.

Technical Specifications

Other Function Telecom Interface ICs CC2520RHDT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.25 Mbps

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CC2520RHDT Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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