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CC2530F256RHAR

Texas Instruments

CC2530F256RHAR by Texas Instruments

CC2530F256RHAR by Texas Instruments is a telecom IC with 40 terminals, operating from -40 to 125°C. It has a supply voltage of 3V, terminal pitch of 0.5mm, and MSL level of 3. Ideal for automotive applications due to its nickel palladium gold finish and no-lead terminal form.

Median Price

$5.890

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 36,893 parts In-Stock

1+ parts

$5.060

100+ parts

$4.125

1k+ parts

$2.750

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36,893

$5.060

$4.125

$2.750

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Mouser Electronics

USA . 1,484 parts In-Stock

1+ parts

$5.890

100+ parts

$4.270

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$3.360

1,484

$5.890

$4.270

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$3.360

DigiKey

USA . 866 parts In-Stock

1+ parts

$6.300

100+ parts

$4.757

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$4.185

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866

$6.300

$4.757

$4.185

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Distributors (In-Stock)

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Maritex

Poland . 2 parts In-Stock

1+ parts

$2.539

100+ parts

$1.585

1k+ parts

$1.286

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2

$2.539

$1.585

$1.286

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Nova Conductors

Japan . 300 parts In-Stock

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$3.885

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300

$3.885

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Digiode

USA . 710 parts In-Stock

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$4.807

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710

$4.807

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Chip Stock

USA . 88,900 parts In-Stock

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Vyrian

USA . 13,898 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,714 parts In-Stock

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Bristol Electronics

USA . 2,500 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,665 parts In-Stock

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ComSIT USA

USA . 1,665 parts In-Stock

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Prism Electronics

USA . 277 parts In-Stock

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Connector Distribution Corp

USA . 191 parts In-Stock

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191

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Right Parts Inc.

USA . 191 parts In-Stock

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191

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Infinite Electronics LLP

India . 97 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$3.807

100+ parts

-

1k+ parts

$3.655

10k+ parts

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100

$3.807

-

$3.655

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Continental Prestige Electronics

USA . 3,193 parts In-Stock

1+ parts

$3.885

100+ parts

-

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$3.807

3,193

$3.885

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-

$3.807

Argo Parts USA

USA . 713 parts In-Stock

1+ parts

$3.885

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713

$3.885

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Ampacity Inc.

Singapore . 13,410 parts In-Stock

1+ parts

$4.300

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13,410

$4.300

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Semicontronic

India . 13,264 parts In-Stock

1+ parts

$4.300

100+ parts

$4.192

1k+ parts

$4.171

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13,264

$4.300

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$4.171

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Corphita

USA . 505 parts In-Stock

1+ parts

$4.554

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505

$4.554

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Corohmni

South Africa . 141 parts In-Stock

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$6.141

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141

$6.141

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Parana Technologies

USA . 1,404 parts In-Stock

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$7.058

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$7.597

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1,404

$7.058

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$7.597

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DigiPath Technology Company

USA . 340 parts In-Stock

1+ parts

$7.771

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340

$7.771

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ChromeModa Solutions

Germany . 2,227 parts In-Stock

1+ parts

$7.930

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$6.503

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$7.930

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IDEA Electronic Components Group

UK . 1,881 parts In-Stock

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$7.930

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$7.137

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Advanced Electronics

New Zealand . 53 parts In-Stock

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$13.490

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$12.815

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$12.815

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53

$13.490

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$12.815

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S.R.D Solutions

India . 84,000 parts In-Stock

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Kepictronics

USA . 54,000 parts In-Stock

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Perfect Parts

USA . 45,571 parts In-Stock

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Assy Fe

Spain . 30,900 parts In-Stock

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Epart123

USA . 30,000 parts In-Stock

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$1.250

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$1.250

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$1.250

A-Z Elektronik GmbH

Germany . 17,404 parts In-Stock

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GreenTree Electronics

Israel . 17,000 parts In-Stock

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Lixinc

USA . 16,345 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 11,507 parts In-Stock

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iodParts Technologies Inc.

India . 6,405 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,936 parts In-Stock

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Futuretech Components

Singapore . 283 parts In-Stock

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Overview

Unlock the power of seamless communication with the Texas Instruments CC2530F256RHAR. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. With a wide range of applications in various industries, this product provides unmatched value and benefits to customers. Experience the advantage of cutting-edge technology and innovation, all packed into a compact and efficient package. Upgrade your systems with the CC2530F256RHAR and revolutionize the way you connect and communicate.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the telecom interface IC, making it a reliable choice.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this telecom interface IC can withstand demanding environmental conditions without sacrificing performance.

Nominal Supply Voltage: 3 V

The low nominal supply voltage of 3V makes this product energy efficient and suitable for a variety of telecom applications.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that this telecom interface IC has moderate sensitivity to moisture, ensuring reliability in different environmental conditions.

Technical Specifications

Other Function Telecom Interface ICs CC2530F256RHAR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CC2530F256RHAR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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