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CC2564CRVMR

Texas Instruments

CC2564CRVMR by Texas Instruments

CC2564CRVMR by Texas Instruments is a telecom IC with 76 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a data rate of 4 Mbps and nominal voltage of 3.6V. Ideal for telecom circuits, it has a very thin profile and matte tin terminal finish.

Median Price

$3.212

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 110,617 parts In-Stock

1+ parts

$3.212

100+ parts

$2.814

1k+ parts

$1.590

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110,617

$3.212

$2.814

$1.590

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Mouser Electronics

USA . 486 parts In-Stock

1+ parts

$4.970

100+ parts

$3.230

1k+ parts

$2.940

10k+ parts

$2.900

486

$4.970

$3.230

$2.940

$2.900

DigiKey

USA . 1,700 parts In-Stock

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$3.160

1,700

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$3.160

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.449

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10

$2.449

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Digiode

USA . 2,357 parts In-Stock

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$3.051

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$3.051

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Vyrian

USA . 38,495 parts In-Stock

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Chip Stock

USA . 6,510 parts In-Stock

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Sensible Micro Corp

USA . 1,400 parts In-Stock

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1,400

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Cyclops Electronics Ltd

UK . 56 parts In-Stock

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Bristol Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,563 parts In-Stock

1+ parts

$2.449

100+ parts

-

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$2.400

6,563

$2.449

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$2.400

Argo Parts USA

USA . 4,270 parts In-Stock

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$2.449

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4,270

$2.449

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Netroflash

USA . 2,000 parts In-Stock

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$2.449

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$2.400

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2,000

$2.449

$2.400

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Semicontronic

India . 38,684 parts In-Stock

1+ parts

$2.730

100+ parts

$2.662

1k+ parts

$2.648

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38,684

$2.730

$2.662

$2.648

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Ampacity Inc.

Singapore . 38,549 parts In-Stock

1+ parts

$2.730

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$2.730

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Corphita

USA . 3,900 parts In-Stock

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$2.891

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$2.891

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Parana Technologies

USA . 1,986 parts In-Stock

1+ parts

$6.537

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$7.278

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1,986

$6.537

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$7.278

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DigiPath Technology Company

USA . 2,100 parts In-Stock

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$7.198

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$6.622

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$7.198

$6.622

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ChromeModa Solutions

Germany . 4,039 parts In-Stock

1+ parts

$7.345

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$6.023

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4,039

$7.345

$6.023

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IDEA Electronic Components Group

UK . 1,890 parts In-Stock

1+ parts

$7.345

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$6.610

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1,890

$7.345

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Corohmni

South Africa . 397 parts In-Stock

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$9.668

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397

$9.668

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$20.617

100+ parts

$18.761

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$16.906

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$20.617

$18.761

$16.906

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Perfect Parts

USA . 218,400 parts In-Stock

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GreenTree Electronics

Israel . 190,331 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,917 parts In-Stock

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Infinite Electronics LLP (Excess)

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A-Z Elektronik GmbH

Germany . 5,552 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,701 parts In-Stock

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Kepictronics

USA . 3,166 parts In-Stock

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Formix International (Excess)

India . 2,490 parts In-Stock

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Metaverse IC Inc.

Canada . 200 parts In-Stock

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Lixinc

USA . 121 parts In-Stock

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Overview

Upgrade your telecom interface with the CC2564CRVMR by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers cutting-edge solutions for various applications. This versatile IC offers seamless connectivity and high-speed data transfer capabilities, making it ideal for telecom circuits and other functions. With a compact design and industrial-grade temperature range, this chip carrier ensures reliable performance in any environment. Trust Texas Instruments to provide the value, benefits, and advantages you need for your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, making assembly process smoother.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, optimizing layout and reducing overall footprint.

No. of Terminals: 76

With 76 terminals, this product offers versatility and connectivity options for various telecom interface requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures product reliability and stability under demanding conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for consistent performance even in extreme cold environments.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good conductivity and corrosion resistance, ensuring long-term reliability.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this product meets the industry standards and requirements for reliable communication.

Nominal Supply Voltage: 3.6 V

Optimal supply voltage of 3.6V ensures efficient power consumption and performance for telecom applications.

Data Rate: 4 Mbps

High data rate of 4 Mbps allows for fast and efficient data transmission, meeting the demands of modern telecom systems.

Technical Specifications

Other Function Telecom Interface ICs CC2564CRVMR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

4 Mbps

JESD-30 Code:

S-XQCC-N76

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

76

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.6 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

CC2564CRVMR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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