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TLK2711AIRCP

Texas Instruments

TLK2711AIRCP by Texas Instruments

TLK2711AIRCP by Texas Instruments is a telecom IC with 64 terminals, operating at 2.5V. It has a temperature range of -40 to 85°C and features a flatpack package style. Ideal for telecom circuit applications due to its industrial-grade performance and very thin profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 3,327 parts In-Stock

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Vyrian

USA . 2,321 parts In-Stock

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2,321

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Chip Stock

USA . 458 parts In-Stock

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458

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Parana Technologies

USA . 547 parts In-Stock

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$11.030

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$11.490

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547

$11.030

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$11.490

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DigiPath Technology Company

USA . 2,328 parts In-Stock

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$12.145

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$11.174

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ChromeModa Solutions

Germany . 6,382 parts In-Stock

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$12.393

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$10.162

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$12.393

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IDEA Electronic Components Group

UK . 1,050 parts In-Stock

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$12.393

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$11.773

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$11.154

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$12.393

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AZTECH Wire

Italy . 597 parts In-Stock

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$19.552

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Ampacity Inc.

Singapore . 1,599 parts In-Stock

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$69.000

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One Stop Electronics

USA . 915 parts In-Stock

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$305.000

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Semicontronic

India . 263 parts In-Stock

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$533.000

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$519.675

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Lixinc

USA . 17,576 parts In-Stock

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Argo Parts USA

USA . 4,410 parts In-Stock

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Corphita

USA . 2,027 parts In-Stock

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Continental Prestige Electronics

USA . 1,178 parts In-Stock

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Perfect Parts

USA . 759 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Microchip USA

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348

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iodParts Technologies Inc.

India . 150 parts In-Stock

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Overview

Discover the innovative TLK2711AIRCP by Texas Instruments, a cutting-edge solution in the telecom interface IC category. Crafted with precision and quality by a trusted manufacturer, this product offers exceptional value to customers seeking reliable performance and seamless connectivity. From telecom circuits to various other functions, this versatile IC is designed to meet your specific needs with ease. Elevate your projects with the TLK2711AIRCP and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, ensuring reliable performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying assembly.

Package Shape: SQUARE

Square package shape is convenient for placement on circuit boards, optimizing use of available space.

Power Supplies (V): 2.5

Operating at 2.5V ensures compatibility with common power supplies and reduces the need for additional voltage regulation.

No. of Terminals: 64

Having 64 terminals allows for multiple connections and functions, enhancing the versatility of the IC.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand high temperatures in industrial environments.

Minimum Operating Temperature: -40 °C

Operating down to -40°C enables use in a wide range of temperature conditions, making it suitable for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring optimal signal transmission.

Terminal Position: QUAD

Quad terminal position simplifies installation and connection to external devices, improving ease of use.

Width: 10 mm

Narrow width of 10mm allows for compact placement on PCBs, saving space and facilitating efficient design layouts.

Technical Specifications

Other Function Telecom Interface ICs TLK2711AIRCP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK2711AIRCP Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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