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TLK2541PFPG4

Texas Instruments

TLK2541PFPG4 by Texas Instruments

TLK2541PFPG4 by Texas Instruments is a telecom IC with 80 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5V and terminal pitch of 0.5mm. Ideal for telecom circuits, it comes in a square package style with Gull Wing terminals and Nickel Palladium Gold finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,527 parts In-Stock

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4,527

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Digiode

USA . 481 parts In-Stock

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481

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Semi Source

USA . 63 parts In-Stock

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63

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Distributors (Availability)

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Parana Technologies

USA . 2,114 parts In-Stock

1+ parts

$14.187

100+ parts

$1,317.524

1k+ parts

$12.769

10k+ parts

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2,114

$14.187

$1,317.524

$12.769

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DigiPath Technology Company

USA . 135 parts In-Stock

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$15.622

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135

$15.622

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AZTECH Wire

Italy . 298 parts In-Stock

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$15.709

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298

$15.709

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ChromeModa Solutions

Germany . 4,438 parts In-Stock

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$15.941

100+ parts

$13.072

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4,438

$15.941

$13.072

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IDEA Electronic Components Group

UK . 631 parts In-Stock

1+ parts

$15.941

100+ parts

$15.144

1k+ parts

$14.347

10k+ parts

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631

$15.941

$15.144

$14.347

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One Stop Electronics

USA . 1,247 parts In-Stock

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$760.000

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1,247

$760.000

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Corphita

USA . 287 parts In-Stock

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287

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Microchip USA

USA . 206 parts In-Stock

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Overview

Elevate your telecommunications systems with the TLK2541PFPG4 by Texas Instruments. Known for their exceptional quality and innovative technology, Texas Instruments delivers cutting-edge solutions in the category of Other Function Telecom Interface ICs. This product offers unmatched value, providing reliable performance and seamless connectivity. From industrial applications to telecommunications circuits, the TLK2541PFPG4 is the perfect choice for those seeking high-quality, efficient solutions. Experience the advantages of Texas Instruments and take your systems to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ensuring longevity and easy handling.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient assembly onto circuit boards, saving time and effort in the manufacturing process.

Power Supplies (V): 2.5

Operating at a power supply of 2.5V makes the product energy-efficient and suitable for low-power applications, helping in reducing overall power consumption.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand elevated temperatures and perform reliably in various environmental conditions.

Width: 12 mm

The compact width of 12 mm allows for efficient use of space on circuit boards while maintaining a high level of functionality.

Temperature Grade: INDUSTRIAL

Having an industrial temperature grade ensures that the product can operate reliably in industrial environments with varying temperature ranges, making it a versatile choice for different applications.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5V ensures compatibility with standard power sources, making integration into existing systems seamless.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product is less prone to moisture-related damage during handling and storage, improving overall reliability and longevity.

Technical Specifications

Other Function Telecom Interface ICs TLK2541PFPG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TLK2541PFPG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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