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CY7B933-JXC

Infineon Technologies

CY7B933-JXC by Infineon Technologies

Infineon Technologies' CY7B933-JXC is a BICMOS technology telecom IC with 28 terminals in a square chip carrier package. Operating at 5V, it supports data rates up to 400 Mbps and draws a max supply current of 155mA. Ideal for telecom circuits, this IC has a temperature range of 0-70°C and is surface mountable.

Median Price

$248.050

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,231 parts In-Stock

1+ parts

$248.050

100+ parts

$233.170

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$218.280

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8,231

$248.050

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$218.280

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Verical

USA . 4,810 parts In-Stock

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Flip Electronics (Authorized)

USA . 1,500 parts In-Stock

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Digiode

USA . 510 parts In-Stock

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$274.303

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510

$274.303

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Nova Conductors

Japan . 500 parts In-Stock

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$324.282

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500

$324.282

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Vyrian

USA . 8,580 parts In-Stock

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8,580

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

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Flip Electronics

USA . 1,500 parts In-Stock

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Chip Stock

USA . 791 parts In-Stock

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ComSIT Distribution GmbH

Germany . 39 parts In-Stock

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39

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ComSIT USA

USA . 39 parts In-Stock

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PC Components Company LLC

USA . 13 parts In-Stock

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Bristol Electronics

USA . 8 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 8 parts In-Stock

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Electronics Depot

USA . 4 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 2,434 parts In-Stock

1+ parts

$15.783

100+ parts

$15.152

1k+ parts

$14.520

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2,434

$15.783

$15.152

$14.520

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Ampacity Inc.

Singapore . 669 parts In-Stock

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$245.430

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669

$245.430

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Corphita

USA . 182 parts In-Stock

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$259.866

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182

$259.866

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Continental Prestige Electronics

USA . 5,809 parts In-Stock

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$324.282

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$317.797

5,809

$324.282

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$317.797

Netroflash

USA . 100 parts In-Stock

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$324.282

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$317.797

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100

$324.282

$317.797

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Microchip USA

USA . 168 parts In-Stock

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$427.192

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168

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Lixinc

USA . 15,048 parts In-Stock

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Futuretech Components

Singapore . 6,090 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,939 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,959 parts In-Stock

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Argo Parts USA

USA . 1,610 parts In-Stock

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Perfect Parts

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Kepictronics

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Assy Fe

Spain . 145 parts In-Stock

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Overview

Unlock seamless communication with the CY7B933-JXC by Infineon Technologies. Crafted with precision and expertise, this telecom interface IC is designed to elevate your connectivity experience. From fast data rates of up to 400 Mbps to a durable chip carrier package, this product offers unparalleled value for all your telecom circuit needs. Trust in Infineon's reputation for quality and innovation, and embrace a new era of efficient communication with the CY7B933-JXC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the internal components of the IC, making it suitable for various application environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and making the product suitable for compact designs.

Package Shape: SQUARE

The square package shape helps in easy placement and orientation of the IC on the PCB, simplifying the assembly process.

Power Supplies (V): 5

Operating at 5V makes the IC compatible with standard power sources, offering ease of integration into existing systems.

No. of Terminals: 28

Having 28 terminals allows for multiple connectivity options, enabling diverse functionality and compatibility with various interfaces.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers robust protection for the IC, ensuring reliability and longevity in operation.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the IC can function effectively in environments where temperature fluctuations may occur.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures down to 0°C widens the range of applications where the IC can be deployed.

Terminal Finish: MATTE TIN

The matte tin finish on terminals provides good conductivity and solderability, ensuring secure connections during installation.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of signals and power within the IC, optimizing performance and signal integrity.

Maximum Seated Height: 4.572 mm

The low seated height enables the IC to be used in slim and compact devices without compromising on performance.

Width: 11.5316 mm

The moderate width of the IC makes it suitable for various PCB layouts and designs, offering flexibility in integration.

Maximum Time At Peak Reflow Temperature (s): 20

The maximum time at peak reflow temperature of 20 seconds ensures quick and efficient soldering during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and bonding of the IC to the PCB, enhancing reliability.

Length: 11.5316 mm

The compact length of the IC allows for space-efficient PCB designs, making it suitable for applications with size constraints.

Temperature Grade: COMMERCIAL

The commercial temperature grade certification ensures reliable operation within standard temperature ranges found in commercial applications.

Technology: BICMOS

The BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption in the IC.

Terminal Form: J BEND

The J bend terminal form adds mechanical strength to the connections, reducing the risk of disconnections and ensuring long-term reliability.

Maximum Supply Current: 155 mA

The maximum supply current of 155mA indicates the power efficiency of the IC, making it suitable for applications with power constraints.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuits, this IC offers optimized performance and functionality for telecom applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V makes the IC compatible with standard power sources, simplifying integration and usage.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and secure connections, facilitating efficient signal transmission and power delivery.

Data Rate: 400 Mbps

With a high data rate of 400Mbps, this IC is capable of handling fast data transmission speeds, making it suitable for high-speed communication applications.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 ensures that the IC can withstand moderate exposure to moisture during handling and storage, maintaining product integrity.

Technical Specifications

Other Function Telecom Interface ICs CY7B933-JXC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

Data Rate:

400 Mbps

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.5316 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

155 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

11.5316 mm

Trade Compliance

CY7B933-JXC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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