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CY7B923-JXIT

Infineon Technologies

CY7B923-JXIT by Infineon Technologies

CY7B923-JXIT by Infineon is a BICMOS technology telecom IC with 400 Mbps data rate and 5V supply voltage. It comes in a square chip carrier package with 28 terminals, suitable for telecom circuit applications. Operating temperature ranges from -40 to 85°C, making it ideal for industrial use.

Median Price

$308.898

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$308.898

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Chip Stock

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Digiode

USA . 951 parts In-Stock

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Vyrian

USA . 683 parts In-Stock

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Cyclops Electronics Ltd

UK . 3 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 1,407 parts In-Stock

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$6.407

100+ parts

$6.151

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$5.894

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AZTECH Wire

Italy . 683 parts In-Stock

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$16.395

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Ampacity Inc.

Singapore . 446 parts In-Stock

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$281.000

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Netroflash

USA . 2,000 parts In-Stock

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$308.898

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$302.720

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Continental Prestige Electronics

USA . 1,474 parts In-Stock

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$308.898

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Microchip USA

USA . 167 parts In-Stock

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$463.347

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Lixinc

USA . 13,517 parts In-Stock

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Argo Parts USA

USA . 4,523 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 982 parts In-Stock

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Overview

Discover the CY7B923-JXIT by Infineon Technologies, a top-tier manufacturer of quality telecom interface ICs. This versatile product offers a wide range of applications, providing seamless connectivity and communication solutions. With a package style of chip carrier and a terminal finish of matte tin, this IC ensures reliability and durability. Experience the benefits of a 5V power supply, industrial temperature grade, and a data rate of 400 Mbps. Elevate your projects with the CY7B923-JXIT and unlock endless possibilities in telecommunications technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material in the package body provides durability and protection to the internal components of the IC.

Surface Mount: YES

Being surface mountable makes the installation process easier and more efficient, saving time and effort during production.

Power Supplies (V): 5

Operating at a voltage of 5V allows for compatibility with standard power sources and ensures stable performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand higher temperature environments, making it suitable for industrial applications.

Data Rate: 400 Mbps

The high data rate of 400 Mbps enables fast and efficient data transfer, making it ideal for telecom applications that require high-speed communication.

Technical Specifications

Other Function Telecom Interface ICs CY7B923-JXIT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

Data Rate:

400 Mbps

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.5316 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.095 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

11.5316 mm

Trade Compliance

CY7B923-JXIT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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