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CY7B933-JXIT

Infineon Technologies

CY7B933-JXIT by Infineon Technologies

CY7B933-JXIT by Infineon is a BICMOS technology telecom IC with 400 Mbps data rate. It operates at 5V, has 28 terminals in a square chip carrier package, and can withstand industrial temperature range. Ideal for telecom circuit applications requiring high-speed data transmission.

Median Price

$270.963

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 1,500 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$270.963

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50

$270.963

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Flip Electronics

USA . 1,528 parts In-Stock

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Vyrian

USA . 1,135 parts In-Stock

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Digiode

USA . 397 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,098 parts In-Stock

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$8.470

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$8.470

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Modulus Dynamics

Lithuania . 4,023 parts In-Stock

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$9.371

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$8.996

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$8.621

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4,023

$9.371

$8.996

$8.621

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Corohmni

South Africa . 334 parts In-Stock

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$13.359

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334

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Semicontronic

India . 1,307 parts In-Stock

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$75.000

100+ parts

$73.125

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$72.750

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$72.750

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Component Stockers USA

USA . 697 parts In-Stock

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$99.990

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Continental Prestige Electronics

USA . 5,007 parts In-Stock

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$270.963

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$265.544

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Microchip USA

USA . 290 parts In-Stock

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$463.347

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Ampacity Inc.

Singapore . 1,169 parts In-Stock

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$513.000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 3,232 parts In-Stock

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Corphita

USA . 214 parts In-Stock

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Advanced Electronics

New Zealand . 78 parts In-Stock

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Overview

Experience seamless connectivity and superior performance with the CY7B933-JXIT by Infineon Technologies. As a leader in telecom interface ICs, Infineon delivers top-quality products that exceed industry standards. This versatile chip carrier offers reliability and efficiency in a compact design, making it ideal for various applications. With a nominal supply voltage of 5V and a data rate of 400 Mbps, this industrial-grade solution ensures optimal functionality. Elevate your projects with the CY7B933-JXIT, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the integrated circuits, ensuring reliable performance over time.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto printed circuit boards, saving space and simplifying assembly.

Power Supplies (V): 5

Operates on a standard voltage supply, making it compatible with most electronic systems.

Maximum Operating Temperature: 85 °C

Can operate effectively in a wide range of temperatures, suitable for various environments and applications.

Data Rate: 400 Mbps

High data rate capability enables efficient and fast transmission of telecom signals, ensuring smooth communication.

Technical Specifications

Other Function Telecom Interface ICs CY7B933-JXIT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

Data Rate:

400 Mbps

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.5316 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.16 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

11.5316 mm

Trade Compliance

CY7B933-JXIT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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