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ATPL250A-AKU-R

Microchip Technology

ATPL250A-AKU-R by Microchip Technology

ATPL250A-AKU-R by Microchip Technology is a telecom interface IC with 1 function. It has a square package shape, 80 terminals, and a low profile flatpack style. With an operating temperature range of -40 to 85 °C, it is suitable for industrial applications in the telecom circuit field.

Median Price

$9.900

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 983 parts In-Stock

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$9.900

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983

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$9.900

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Distributors (In-Stock)

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VNN

France . 2,965 parts In-Stock

1+ parts

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2,965

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Vyrian

USA . 665 parts In-Stock

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665

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Digiode

USA . 300 parts In-Stock

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300

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Distributors (Availability)

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Vigor

Singapore . 302 parts In-Stock

1+ parts

$4.210

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302

$4.210

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Semicontronic

India . 628 parts In-Stock

1+ parts

$8.420

100+ parts

$8.210

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$8.167

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628

$8.420

$8.210

$8.167

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Ampacity Inc.

Singapore . 609 parts In-Stock

1+ parts

$8.420

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609

$8.420

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Corohmni

South Africa . 458 parts In-Stock

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$13.104

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458

$13.104

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AZTECH Wire

Italy . 553 parts In-Stock

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$17.809

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553

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QUARKTWIN TECHNOLOGY LTD

USA . 13,960 parts In-Stock

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13,960

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Marpe Global Electronics

Taiwan . 2,804 parts In-Stock

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QualityLine Systems

Poland . 2,804 parts In-Stock

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2,804

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XL Components Corporation

Australia . 2,804 parts In-Stock

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Supply Digital

USA . 1,465 parts In-Stock

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Microchip USA

USA . 1,363 parts In-Stock

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1,363

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Continental Prestige Electronics

USA . 634 parts In-Stock

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634

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Argo Parts USA

USA . 486 parts In-Stock

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486

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Corphita

USA . 416 parts In-Stock

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416

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Discover the ATPL250A-AKU-R by Microchip Technology, the ultimate solution for all your telecom interface needs. With its high-quality manufacturing and precision engineering, this product is guaranteed to deliver unparalleled performance and reliability. Whether you're looking to enhance your communication systems or expand your network capabilities, the ATPL250A-AKU-R offers unbeatable value, benefits, and advantages. Say goodbye to connectivity issues and hello to seamless telecommunication experiences. Upgrade your technology today with the ATPL250A-AKU-R and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy as the package body material provides durability and protection for the internal components, making it a reliable choice for long-term use.

Surface Mount:

YES - The surface mount capability allows for easy installation and integration into various electronic devices, making it convenient and versatile.

No. of Functions:

1 - With a single function, this product offers simplicity and efficiency in its operation, making it suitable for specific telecom interface applications.

Package Shape:

SQUARE - The square package shape offers a compact and space-saving design, making it suitable for applications with limited board space.

No. of Terminals:

80 - Having a high number of terminals allows for multiple connectivity options, making it adaptable for various interface requirements.

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH - The flatpack, low profile, and fine pitch package style provides a smaller footprint and enhanced electrical performance, making it suitable for applications demanding compactness and high-speed signals.

Maximum Operating Temperature:

85 °C - The high maximum operating temperature ensures reliable and stable performance even in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature allows the product to operate reliably in extremely cold conditions, making it suitable for diverse environments.

Terminal Finish:

MATTE TIN - The matte tin terminal finish offers excellent conductivity and corrosion resistance, ensuring optimal signal integrity and long-term reliability.

Terminal Position:

QUAD - The quad terminal position provides multiple points of connection, allowing for increased flexibility and compatibility with different system architectures.

Maximum Seated Height:

1.6 mm - The low maximum seated height allows for a compact and streamlined design, making it suitable for space-constrained applications.

Width:

12 mm - With a width of 12 mm, this product offers a slim and compact form factor, facilitating easy integration and installation into various devices.

Length:

12 mm - The 12 mm length ensures a compact overall size, making it suitable for applications with limited board space.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade ensures stable and reliable performance in harsh operating conditions, making it suitable for demanding industrial applications.

Terminal Form:

GULL WING - The gull wing terminal form provides secure and reliable soldering connections, enhancing the product's overall durability and longevity.

Telecom IC Type:

TELECOM CIRCUIT - This product belongs to the telecom circuit IC type, which means it is specifically designed and optimized for telecom interface applications, making it a suitable choice for such applications.

Nominal Supply Voltage:

3.3 V - The 3.3 V nominal supply voltage ensures compatibility with common power systems, enabling seamless integration and operation.

Terminal Pitch:

0.5 mm - With a terminal pitch of 0.5 mm, this product offers fine-pitched connections, allowing for increased design flexibility and higher signal density.

Technical Specifications

Other Function Telecom Interface ICs ATPL250A-AKU-R attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

ATPL250A-AKU-R Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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