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WL1805MODGBMOCT

Texas Instruments

WL1805MODGBMOCT by Texas Instruments

WL1805MODGBMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for commercial applications requiring high-speed telecommunications functionality.

Median Price

$16.912

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 91 parts In-Stock

1+ parts

$12.920

100+ parts

$12.660

1k+ parts

$12.400

10k+ parts

-

91

$12.920

$12.660

$12.400

-

Texas Instruments

USA . 1,937 parts In-Stock

1+ parts

$16.912

100+ parts

$14.773

1k+ parts

$10.188

10k+ parts

-

1,937

$16.912

$14.773

$10.188

-

DigiKey

USA . 125 parts In-Stock

1+ parts

$26.620

100+ parts

$20.443

1k+ parts

-

10k+ parts

-

125

$26.620

$20.443

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$14.800

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$14.800

-

-

-

Digiode

USA . 1,367 parts In-Stock

1+ parts

$16.066

100+ parts

-

1k+ parts

-

10k+ parts

-

1,367

$16.066

-

-

-

Vyrian

USA . 5,869 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,869

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 105 parts In-Stock

1+ parts

$9.477

100+ parts

-

1k+ parts

$10.085

10k+ parts

-

105

$9.477

-

$10.085

-

Corohmni

South Africa . 286 parts In-Stock

1+ parts

$9.718

100+ parts

-

1k+ parts

-

10k+ parts

-

286

$9.718

-

-

-

IDEA Electronic Components Group

UK . 2,124 parts In-Stock

1+ parts

$10.648

100+ parts

$10.116

1k+ parts

$9.583

10k+ parts

-

2,124

$10.648

$10.116

$9.583

-

ChromeModa Solutions

Germany . 50 parts In-Stock

1+ parts

$10.648

100+ parts

$8.731

1k+ parts

-

10k+ parts

-

50

$10.648

$8.731

-

-

Semicontronic

India . 1,080 parts In-Stock

1+ parts

$14.380

100+ parts

$14.020

1k+ parts

$13.949

10k+ parts

-

1,080

$14.380

$14.020

$13.949

-

Ampacity Inc.

Singapore . 999 parts In-Stock

1+ parts

$14.380

100+ parts

-

1k+ parts

-

10k+ parts

-

999

$14.380

-

-

-

Continental Prestige Electronics

USA . 5,965 parts In-Stock

1+ parts

$14.800

100+ parts

-

1k+ parts

-

10k+ parts

$14.504

5,965

$14.800

-

-

$14.504

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$14.800

100+ parts

$14.504

1k+ parts

-

10k+ parts

-

2,000

$14.800

$14.504

-

-

Corphita

USA . 1,130 parts In-Stock

1+ parts

$15.221

100+ parts

-

1k+ parts

-

10k+ parts

-

1,130

$15.221

-

-

-

Component Stockers USA

USA . 2,268 parts In-Stock

1+ parts

$19.560

100+ parts

$15.290

1k+ parts

$10.030

10k+ parts

-

2,268

$19.560

$15.290

$10.030

-

Perfect Parts

USA . 2,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,520

-

-

-

-

Argo Parts USA

USA . 2,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,330

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,767 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,767

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

DigiPath Technology Company

USA . 170 parts In-Stock

1+ parts

-

100+ parts

$9.600

1k+ parts

-

10k+ parts

-

170

-

$9.600

-

-

Lixinc

USA . 36 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

36

-

-

-

-

Overview

Elevate your telecom interface with the WL1805MODGBMOCT by Texas Instruments. Crafted with precision and quality materials, this innovative product offers unparalleled performance and reliability. Whether you're looking to enhance communication systems or streamline telecommunication processes, this versatile device is your go-to solution. With a sleek design and advanced features, it delivers value and benefits that exceed expectations. Experience seamless connectivity and optimal functionality with the WL1805MODGBMOCT – making every interaction effortless and efficient.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to impact, making the product suitable for various environments and handling.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 2.9/4.8

Supports a range of power supplies, offering flexibility in power options for different applications.

No. of Terminals: 100

Offers a high number of terminals for connectivity, enabling multiple connections and functions within the product.

Maximum Operating Temperature: 70 °C

Ensures stable performance even in high temperature conditions, increasing the reliability of the product.

Minimum Operating Temperature: -20 °C

Allows the product to function in cold environments, expanding its usability in a variety of settings.

Data Rate: 100 Mbps

Supports high-speed data transfer, ensuring efficient communication and performance in data-intensive applications.

Technical Specifications

Other Function Telecom Interface ICs WL1805MODGBMOCT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

100 Mbps

JESD-30 Code:

R-PBGA-B100

JESD-609 Code:

e4

Length:

13.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

LGA

Package Equivalence Code:

LGA100(UNSPEC)

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.9/4.8

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.7 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13.3 mm

Trade Compliance

WL1805MODGBMOCT Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8473.30.11.80

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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