Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Texas Instruments' WL1837MODGIMOCR is a telecom IC with 100 terminals, operating at -40 to 85°C. It has a supply voltage of 3.7V and supports data rates up to 100Mbps. This rectangular package with grid array style is ideal for industrial telecom applications.
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$32.720
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Microchip USA
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Formix International (Excess)
Metaverse IC Inc.
Plastic/Epoxy material provides good protection for the internal components of the IC, making it durable and long-lasting.
Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during production.
With a high maximum operating temperature, this IC can withstand harsh environmental conditions and ensure reliable performance in a variety of situations.
The high data rate of 100 Mbps allows for fast and efficient data communication, making this IC suitable for telecom applications that require high-speed data transfer.
With a low nominal supply voltage, this IC offers energy efficiency and can operate on standard power sources, reducing overall power consumption.
Other Function Telecom Interface ICs WL1837MODGIMOCR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments
Data Rate:
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Sub-Category:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
WL1837MODGIMOCR Telecommunications trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8473.30.11.80
SB
8542.39.00.00
PCN Design/Specification - WL1807MOD/WL1837MOD 11/Oct/2021
PCN Assembly/Origin - WL18YYY 06/Sep/2017
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LL4148
Onsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Zetex Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WT
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
NDT2955
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
1N4148
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
1552200253
Molex
WIRE AND CABLE;
Rochester Electronics
SMBJ18CA
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
MBRA340T3G
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CRCW080510K0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510K0FKEA is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 reference standard compliance and -55 to 155 °C operating temperature range.
NC7WZ07P6X
The Onsemi NC7WZ07P6X is a logic gate with 2 functions, featuring a propagation delay of 4.8 ns at 1.8V supply voltage. With open-drain output characteristics, it operates in industrial temperatures from -40 to 85°C. Ideal for applications requiring fast signal processing and low power consumption in compact designs.
Rectron
2N7002
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
EU2B-YS3303C
Idec
ROTARY SWITCH;
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
MAX2769CETI+
Analog Devices
TELECOM CIRCUIT; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30;
ODIN-W260-00B-00
U-blox Ag
TELECOM CIRCUIT; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 4;
HMC773ALC3BTR-R5
Analog Devices' HMC773ALC3BTR-R5 is a telecom IC with 12 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. With a very thin profile and no-lead terminal form, it's ideal for telecom interface applications.
NEO-M8Q-0-10
NEO-M8Q-0-10 by U-blox Ag is a MICROELECTRONIC ASSEMBLY with 24 terminals, operating from -40 to 85 °C. Ideal for TELECOM CIRCUIT applications due to its INDUSTRIAL temperature grade and 3V supply voltage requirement.
MAX24287ETK+
MAX24287ETK+ by Microchip Technology is a telecom IC with 68 terminals in a square chip carrier package. It operates b/w -40 to 85°C, supporting circuits at 1.2V supply voltage for data rates up to 1000 Mbps. Ideal for applications requiring very thin profile and surface mount compatibility.
CC2642R1FRGZR
Texas Instruments
CC2642R1FRGZR by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Suitable for telecom circuits, it features nickel palladium gold terminal finish and is surface mountable.
WT32I-E-AI6IAP
Silicon Labs
Silicon Labs' WT32I-E-AI6IAP is a telecom IC with 50 terminals, operating from -40 to 85°C. Its compact rectangular package measures 15.9mm x 23.9mm with a low profile of 2.55mm, suitable for industrial applications requiring surface mount technology.
ISL32275EFVZ-T
Renesas Electronics
ISL32275EFVZ-T by Renesas Electronics is a BICMOS technology telecom IC with 16 terminals in a small outline package. It operates b/w -40 to 125°C, suitable for automotive applications. With a nominal voltage of 3.3V and matte tin terminal finish, it is ideal for telecom circuit designs.
ADRV9026BBCZ
Analog Devices ADRV9026BBCZ is a telecom IC with 4 functions, operating at -40 to 110°C. It features a grid array package with 289 terminals and low profile design. Ideal for industrial applications requiring a nominal voltage of 1V and terminal pitch of 0.8mm.
SL2S2002FTB,115
NXP Semiconductors
The NXP Semiconductors SL2S2002FTB,115 is a small outline, very thin profile IC with 3 terminals and CMOS technology. It operates in industrial temperature range (-40 to 85 °C) and is suitable for telecom circuit applications. The package material is plastic/epoxy, surface mountable with tin finish terminals at 0.55mm pitch.
RN52-I/RM
Microchip Technology's RN52-I/RM is a rectangular package IC with 40 terminals, 2.7mm height, and dimensions of 13.5mm x 26mm. It operates at a data rate of 3 Mbps and is used in telecom circuits for various applications requiring surface mount technology.
DC-ME4-01T-S-UPW
Digi International
DC-ME4-01T-S-UPW by Digi Int. is a SERIAL DEVICE SERVER with 100 Mbps Data Rate, operating at -40 to 85°C. Its MICROELECTRONIC ASSEMBLY package measures 19.05mm x 36.7mm x 18.67mm, ideal for telecom interfaces in various applications.
TMS3705DDRQ1
TMS3705DDRQ1 by Texas Instruments is a telecom IC with 16 terminals, operating b/w -40 to 85°C. It has a supply voltage of 5V and terminal pitch of 1.27mm. This AEC-Q100 compliant IC is ideal for industrial applications requiring small outline packages and dual terminal positions.
PEF7072HLV16SLLHN
Intel
The Intel PEF7072HLV16SLLHN is a telecom interface IC with 64 terminals in a rectangular flatpack package. Its gull wing terminal form and quad position make it suitable for telecom circuit applications. This surface-mount device is made of plastic/epoxy, ideal for various telecommunications functions.
ANNA-B112-01B
ANNA-B112-01B by U-blox Ag is a telecom IC with 52 terminals, operating at -40 to 85°C. It has a compact square package style, suitable for industrial applications. With a supply voltage of 3V and no lead terminal form, it's ideal for telecom interface functions.
NORA-B106-00B
TELECOM CIRCUIT;
SN65DSI86IPAPQ1
SN65DSI86IPAPQ1 by Texas Instruments is a telecom interface IC with 64 terminals in a square package. It operates b/w -40 to 85°C, with terminal finish of NiPdAu. This IC is suitable for industrial applications requiring a nominal voltage of 1.2V and features gull wing terminal form.
BMD-300-A-R
Rigado
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 47; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
ZED-F9R-01B
AT86RF215-ZUR
Atmel
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: VQCCN; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
WL1801MODGBMOCT
WL1801MODGBMOCT by Texas Instruments is a telecom IC with 100 terminals in a grid array package. It operates at -20 to 70°C, with a supply voltage of 3.7V and data rate of 100 Mbps. Ideal for telecom circuits, it has a compact rectangular shape and surface-mount capability.
WL1837MODGIMOCT
WL1837MODGIMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. It operates at temperatures from -40 to 85°C, with a supply voltage of 3.7V and data rate of 100 Mbps. Ideal for industrial applications requiring high-speed communication in compact spaces.
WL1831MODGBMOCR
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BUTT; No. of Terminals: 100; Package Code: LGA; Package Shape: RECTANGULAR;
WL1831MODGBMOCT
WL1831MODGBMOCT by Texas Instruments is a telecom IC with 100 terminals in a grid array package. It operates at -20 to 70°C, with a data rate of 100 Mbps and nominal voltage of 3.7V. Ideal for telecom circuits, it features surface mount capability and measures 13.4mm x 13.3mm in size.
WL1835MODGBMOCR
The Texas Instruments WL1835MODGBMOCR is a telecom IC with 100 terminals in a rectangular grid array package. It operates at temperatures from -20 to 70°C, with a supply voltage of 3.7V and data rate of 100 Mbps. Ideal for telecom circuits, it features surface mount capability and nickel palladium gold terminal finish.
WL1801MODGBMOCR
WL1801MODGBMOCR by Texas Instruments is a telecom IC with 100 terminals, operating at 3.7V. It offers a data rate of 100 Mbps and can withstand temperatures from -20 to 70°C. Ideal for telecom applications requiring high-speed data transmission in commercial-grade environments.
WL1835MODGBMOCT
Texas Instruments' WL1835MODGBMOCT is a telecom IC with 100 terminals, operating at 3.7V and supporting data rates up to 100 Mbps. It features a rectangular package style, surface mount capability, and operates within -20 to 70°C temperature range. Ideal for telecom interface applications requiring high-speed data transmission in commercial-grade environments.
WL1805MODGBMOCT
WL1805MODGBMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for commercial applications requiring high-speed telecommunications functionality.
WL1807MODGIMOCT
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 100; Package Code: LGA; Package Shape: RECTANGULAR;
WL1807MODGIMOCR
WL1801GYFVR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR;
WL1801MODGBMOC
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 130; Package Code: BGA; Package Shape: RECTANGULAR;
WL1805MODGBMOC
WL1805MODGBMOCR
WL1831GYFVR
WL1831MODGBMOC
WL1835MODGBMOC
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