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WL1831GYFVR

Texas Instruments

WL1831GYFVR by Texas Instruments

WL1831GYFVR by Texas Instruments is a telecom IC with 130 terminals in a grid array package. It operates b/w -40 to 105°C, with peak reflow temperature of 260°C. Ideal for telecom circuits, it has a very thin profile and fine pitch design for industrial applications.

Median Price

$5.704

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,947 parts In-Stock

1+ parts

$5.704

100+ parts

$4.650

1k+ parts

$3.100

10k+ parts

-

5,947

$5.704

$4.650

$3.100

-

Mouser Electronics

USA . 4,950 parts In-Stock

1+ parts

$10.020

100+ parts

$6.410

1k+ parts

$4.920

10k+ parts

$4.770

4,950

$10.020

$6.410

$4.920

$4.770

DigiKey

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.782

5,000

-

-

-

$4.782

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 188 parts In-Stock

1+ parts

$3.875

100+ parts

-

1k+ parts

-

10k+ parts

-

188

$3.875

-

-

-

Digiode

USA . 1,053 parts In-Stock

1+ parts

$5.419

100+ parts

-

1k+ parts

-

10k+ parts

-

1,053

$5.419

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,181 parts In-Stock

1+ parts

$3.290

100+ parts

-

1k+ parts

-

10k+ parts

-

4,181

$3.290

-

-

-

Semicontronic

India . 4,152 parts In-Stock

1+ parts

$3.290

100+ parts

$3.208

1k+ parts

$3.191

10k+ parts

-

4,152

$3.290

$3.208

$3.191

-

Corohmni

South Africa . 453 parts In-Stock

1+ parts

$3.875

100+ parts

-

1k+ parts

-

10k+ parts

-

453

$3.875

-

-

-

Corphita

USA . 630 parts In-Stock

1+ parts

$5.134

100+ parts

-

1k+ parts

-

10k+ parts

-

630

$5.134

-

-

-

Parana Technologies

USA . 801 parts In-Stock

1+ parts

$11.161

100+ parts

$1,036.514

1k+ parts

$10.045

10k+ parts

-

801

$11.161

$1,036.514

$10.045

-

DigiPath Technology Company

USA . 1,185 parts In-Stock

1+ parts

$12.290

100+ parts

-

1k+ parts

-

10k+ parts

-

1,185

$12.290

-

-

-

ChromeModa Solutions

Germany . 6,171 parts In-Stock

1+ parts

$12.541

100+ parts

$10.284

1k+ parts

-

10k+ parts

-

6,171

$12.541

$10.284

-

-

IDEA Electronic Components Group

UK . 1,984 parts In-Stock

1+ parts

$12.541

100+ parts

$11.914

1k+ parts

$11.287

10k+ parts

-

1,984

$12.541

$11.914

$11.287

-

Kepictronics

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,000

-

-

-

-

Lixinc

USA . 5,862 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,862

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Experience seamless connectivity and superior performance with the Texas Instruments WL1831GYFVR. Manufactured by a trusted industry leader, this telecom interface IC offers unmatched reliability and quality. Ideal for a wide range of applications, this product provides value by delivering fast and efficient communication solutions. Stay ahead of the competition with the cutting-edge technology and innovative features of the WL1831GYFVR. Elevate your projects with this top-of-the-line product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product suitable for portable and long-lasting applications.

Surface Mount: YES

Surface mount technology allows for efficient PCB assembly and saves space on the board, making it ideal for compact electronic devices.

Package Shape: RECTANGULAR

Rectangular package shape ensures easy integration and compatibility with standard mounting techniques.

No. of Terminals: 130

High number of terminals allows for complex circuit connections, enabling versatile functionality and performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and improves thermal management, enhancing overall product reliability.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environments and industrial applications.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC provides optimized performance and features for telecommunication systems.

Technical Specifications

Other Function Telecom Interface ICs WL1831GYFVR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B130

JESD-609 Code:

e1

Length:

4.93 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

130

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA130,11X12,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.575 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.64 mm

Trade Compliance

WL1831GYFVR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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